Abstract: A semiconductor device has a memory cell, decoders, a redundancy circuit and a mode setting circuit. The memory cell array has word lines including a redundant word line, bit lines and memory cells. A row decoder selects the word lines in response to a row address. Further, the row address decoder selects the redundant word line when a replacement signal is received. A column decoder selects the bit lines in response to a column address. A row address redundancy circuit stores a redundant row address. The row address redundancy circuit provides the replacement signal when the redundant row address corresponds to the received address. The mode setting circuit receives a mode signal having a normal mode and a test mode. The mode setting circuit outputs the replacement signal to the row decoder when the mode signal is in the normal mode, and prohibits an output of the replacement signal.

Abstract: A delay from the release of a low power consumption mode of nonvolatile memory to the restart of read operation is reduced. Nonvolatile memory which can electrically rewrite stored information has in well regions plural nonvolatile memory cell transistors having drain electrodes and source electrodes respectively coupled to bit lines and source lines and gate electrodes coupled to word lines and storing information based on a difference between threshold voltages to a word line select level in read operation, and the nonvolatile memory has a low power consumption mode. In the low power consumption mode, a second voltage lower than a circuit ground voltage and higher than a first negative voltage necessary for read operation is supplied to the well regions and word lines. When boost forming a rewriting negative voltage therein, a circuit node at a negative voltage is not the circuit ground voltage in the low power consumption mode.

Abstract: Memory blocks having memory cells which are comprised of vertical transistors and memory elements in which the resistance value is varied depending on the temperature imposed on the upper side thereof, are laminated to realize a highly-integrated non-volatile memory.

Abstract: A register part of a mode register has a plurality of operation setting parts in which plural types of operating specifications are respectively set to operate the semiconductor memory. The mode register outputs a soft reset signal when at least a value of one-bit of the register part represents a reset state. A reset signal generator outputs a reset signal for resetting an internal circuit in response to the soft reset signal. In the present invention, a system that controls the semiconductor memory is required to necessarily assign a predetermined bit with a setting command of the mode register in order to generate the soft reset signal. Accordingly, it is possible to reliably reset the internal circuit by external control.

Abstract: A semiconductor memory device enabling efficient repair of defects by using limited redundant memory while suppressing a drop of access speed accompanied with the repair of defects of the memory, wherein a first memory array is divided into a plurality of memory regions for each 16 word lines and wherein defective memory addresses in regions are stored in a second memory array. When a memory address for accessing the first memory array is input, the defective memory address of the memory region including the memory to be accessed is read out from the second memory array. In this way, the addresses of defective memory in 16 word lines worth of a memory region are stored in the second memory array 2, therefore addresses of a wider range of defective memory can be stored. For this reason, it becomes possible to repair defects occurring at random efficiently.

Abstract: A sense amplifier circuit comprises (1) an isolation device comprising a control terminal and first and second terminals, the first terminal of the isolation device coupled to a signal line, (2) a gated diode comprising first and second terminals, the first terminal of the gated diode coupled to the second terminal of the isolation device, and the second terminal of the gated diode coupled to a set line; and (3) control circuitry coupled to the control terminal of the isolation device and adapted to control voltage on the control terminal of the isolation device in order to enable and disable the isolation device. A latch circuit further comprises a precharge device comprising a control terminal and first and second terminals, the first terminal of the precharge device coupled to a power supply voltage, and the second terminal of the precharge device coupled to the first terminal of the isolation device.

Abstract: A semiconductor memory device includes spaced apart twisted bit line pairs, a respective one of which includes a spaced apart twisted area. A conductive line overlaps the respective twisted areas of the spaced apart twisted line pairs. The conductive line can extend parallel to the memory device word lines, and can provide a power supply ground and/or signal line.

Abstract: A method of programming a non-volatile memory device includes activating a first pump to generate a bitline voltage, and after the bulk voltage reaches a target voltage, detecting whether the bitline voltage is less than a detection voltage. When the bitline voltage is less than the detection voltage, a second pump becomes active.

Abstract: A system includes a pull-up circuit to program a memory cell. The pull-up circuit may include a level shifter to receive a control signal, a supply voltage, and one or more of a plurality of rail voltages, each of the plurality of rail voltages substantially equal to a respective integer multiple of the supply voltage, and to generate a second control signal, and a cascode stage. The cascode stage may include a plurality of transistors, a gate voltage of each of the plurality of transistors to be controlled at least in part by a respective one of the second control signal, the supply voltage, and at least one of the plurality of rail voltages, and an output node to provide a cell programming signal.

Abstract: An exemplary NAND string memory array provides for capacitive boosting of a half-selected memory cell channel to reduce program disturb effects of the half selected cell. To reduce the effect of leakage current degradation of the boosted level, multiple programming pulses of a shorter duration are employed to limit the time period during which such leakage currents may degrade the voltage within the unselected NAND strings. In addition, multiple series select devices at one or both ends of each NAND string further ensure reduced leakage through such select devices, for both unselected and selected NAND strings. In certain exemplary embodiments, a memory array includes series-connected NAND strings of memory cell transistors having a charge storage dielectric, and includes more than one plane of memory cells formed above a substrate.

Abstract: An operation to erase a nitride read only memory (NROM) memory block starts by erasing the memory block. An erase verify operation can then be performed to determine the success of the erase. If a read operation is performed and column current is detected, a high-efficiency recovery operation is performed. If the read operation is performed and column current is not detected, the erase operation has been successfully completed.

Abstract: An integrated circuit includes operational circuitry; a sensor configured to sense an environmental parameter; and adjustment circuitry coupled to the sensor and to the operational circuitry and configured to affect the operational circuitry to at least partially counteract the effects of the environmental parameter. A method of testing an integrated circuit includes supporting a sensor in the integrated circuit and using the sensor to sense environmental data.

Abstract: A circuit and method for generating a wordline voltage in a nonvolatile semiconductor memory device. The circuit comprises a switching unit to provide an external program voltage as the wordline voltage, together with a wordline voltage pump to generate the wordline voltage by pumping a power source voltage. After the wordline voltage is raised to a first level by the external program voltage, it is further increased by a pumping operation. According the circuit and method described herein, shortens the time required to reach a target voltage.

Abstract: Disclosed is a page buffer for a nonvolatile semiconductor memory device and a related method of operation. The page buffer includes a unidirectional driver between a loading latch unit used for storing a data bit in the page buffer and a bitline used to program a memory cell connected to the page buffer.

Abstract: The present invention relates to a memory circuit having a memory cell array for storing data, and having a command decoding circuit for receiving command signals, and having a setting memory for storing an item of operating information that is specific to a memory circuit, the command decoding circuit performing a function in the memory circuit on the basis of applied drive commands, wherein the command decoding circuit is configured in such a manner that, during an initialization mode, the operating information can be read out on the basis of a predetermined drive command that is supplied to the command decoding circuit, and in such a manner that, during a normal operating mode, a function that is different therefrom can be performed with the aid of the predetermined drive command.

Abstract: A priority encoder can be used for a Content-Addressable Memory (CAM) device that typically has an array of CAM cells arranged in columns and rows with each row having a match signal indicative that compare data has matched data within the respective row. A priority encoder is operatively connected to the array of CAM cells and determines a highest priority matching address for data within the array of CAM cells. The priority encoder includes match lines associated with respective rows and precharged bus lines connected into respective match lines that are discharged whenever there is a match signal such that the highest precharged bus line discharged results in an encoded address.

Abstract: Semiconductor memory devices include a memory array having a plurality of multi-column memory blocks therein and a multi-column redundant memory block. A redundancy column selecting unit is provided, which is configured to route data read from the multi-column redundant memory block to a redundant data line, in response to a column address. A data input/output unit is also provided. This data input/output unit is connected to the redundant data line and a data line associated with a defective column in the memory array. The data input/output unit is configured to respond to an instruction to read first data from a defective column in the memory array by routing first data read from a selected redundant column in the multi-column redundant memory block to an input/output bus while concurrently blocking data read from the defective column from being transferred to the input/output bus.

Abstract: A Delayed Lock Loop (DLL) circuit includes an inversion control circuit. The inversion control circuit includes an inversion decision circuit to determine the inversion of reproduction clock signal by comparing phases of an external clock signal and a reproduction clock signal, and to produce an inversion decision signal including a duty error margin for the reproduction clock signal. The inversion control circuit also includes an output latch to latch the inversion decision signal in synchronization with a start signal to produce an inversion control signal.

Abstract: A selected wordline that is coupled to cells for programming is biased with a programming voltage. The unselected wordlines that are adjacent to the selected wordline are biased at a first predetermined voltage. The remaining wordlines are biased at a second predetermined voltage that is greater than the first predetermined voltage. The first predetermined voltage is selected by determining what unselected, adjacent wordline bias voltage produces a minimized Vpass disturb in response to the selected wordline programming voltage.

Abstract: A ferroelectric memory has a plurality of memory cells respectively having a cell transistor and ferroelectric capacitor whose one terminal is connected with the cell transistor, a plurality of word lines respectively connected with said cell transistor, a plurality of plate lines connected with the other terminal of said ferroelectric capacitor and intersecting with said word lines, a plurality of local bit lines connected with said cell transistors, and a global bit line that is selectively connected with local bit lines. Furthermore, the ferroelectric memory has a sensing amplifier unit that detects the amount of charging of the local bit lines from said memory cells while maintaining the potential of the local bit lines at a potential equivalent to the non-selected plate lines, during reading.