Abstract: A variable resistance memory device includes a first conductive line extending in a first direction, a second conductive line extending in a second direction, the second direction intersecting the first direction on the first conductive line, a fixed resistance layer between the first conductive line and the second conductive line, and a variable resistance layer between the first conductive line and the second conductive line, wherein the fixed resistance layer and the variable resistance layer are electrically connected in parallel to each other between the first conductive line and the second conductive line.

Abstract: A memory device may include a substrate having conductivity regions and a channel region. A first voltage line may be arranged over the channel region. Second, third, and fourth voltage lines may each be electrically coupled to a conductivity region. Resistive units may be arranged between the third voltage line and the conductivity region electrically coupled to the third voltage line, and between the fourth voltage line and the conductivity region electrically coupled to the fourth voltage line. A resistance adjusting element may have at least a portion arranged between one of the resistive units and one of the conductivity regions. An amount of the resistance adjusting element between the first resistive unit and the conductivity region electrically coupled to the third voltage line may be different from that between the second resistive unit and the conductivity region electrically coupled to the fourth voltage line.

Abstract: A method of forming a semiconductor structure includes forming a plurality of fins over a substrate, at least a portion of one or more of the fins providing one or more channels for one or more fin field-effect transistors. The method also includes forming a plurality of active gate structures over the fins, forming at least one single diffusion break trench between a first one of the active gate structures and a second one of the active gate structures, and forming at least one double diffusion break trench between a third one of the active gate structures and a fourth one of the active gate structures. The double diffusion break trench has a stepped height profile in the substrate, the stepped height profile comprising a first depth with a first width and a second depth less than the first depth with a second width greater than the first width.

Abstract: A three-dimensional memory device includes alternating stacks of insulating strips and electrically conductive strips located over a substrate and laterally spaced apart among one another by line trenches. The line trenches laterally extend along a first horizontal direction and are spaced apart along a second horizontal direction. Each line trench fill structure includes a laterally undulating dielectric rail having a laterally undulating width along the second horizontal direction and extending along the first horizontal direction and a row of memory stack structures located at neck regions of the laterally undulating dielectric rail.

Abstract: A thermally efficient, cost efficient and compact LED device having an LED module and a circuit board. The LED module having an LED substrate and an LED chip mounted on a mounting surface of the LED substrate. The circuit board is composed of a circuit board substrate and has a plurality of conductive tracks on a surface of the circuit board substrate. The LED substrate is embedded in the circuit board substrate.

Abstract: A semiconductor structure includes a first device and a second device. The first device includes a plate including a plurality of apertures; a membrane disposed opposite to the plate and including a plurality of corrugations, and a conductive plug extending through the plate and the membrane. The second device includes a substrate and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate includes a semiconductive member and a tensile member, and the semiconductive member is disposed within the tensile member.

Abstract: A semiconductor device includes a vertical protection device having a thyristor and a lateral trigger element disposed in a substrate. The lateral trigger element is for triggering the vertical protection device.

Abstract: The present disclosure provides many different embodiments of an IC device. The IC device includes a gate stack disposed over a surface of a substrate and a spacer disposed along a sidewall of the gate stack. The spacer has a tapered edge that faces the surface of the substrate while tapering toward the gate stack. Therefore the tapered edge has an angle with respect to the surface of the substrate.

Abstract: A trench DMOS transistor with a very low on-state drain-to-source resistance and a high gate-to-drain charge includes one or more floating islands that lie between the gate and drain to reduce the charge coupling between the gate and drain, and effectively lower the gate-to-drain capacitance.

Abstract: A thin film transistor includes a gate electrode, an active layer formed of oxide semiconductor material on a substrate, and a gate insulation layer therebetween. The active layer includes a channel region corresponding to the gate electrode, a source region at one side of the channel region, and a drain region at the other side of the channel region. The source region includes a first upper portion and the drain region includes a second upper portion that includes the oxide semiconductor material and Si.

Abstract: Selective transfer of dies including semiconductor devices to a target substrate can be performed employing local laser irradiation. Coining of at least one set of solder material portions can be employed to provide a planar surface-to-surface contact and to facilitate bonding of adjoining pairs of bond structures. Laser irradiation on the solder material portions can be employed to sequentially bond selected pairs of mated bonding structures, while preventing bonding of devices not to be transferred to the target substrate. Additional laser irradiation can be employed to selectively detach bonded devices, while not detaching devices that are not bonded to the target substrate. The transferred devices can be pressed against the target substrate during a second reflow process so that the top surfaces of the transferred devices can be coplanar. Wetting layers of different sizes can be employed to provide a trapezoidal vertical cross-sectional profile for reflowed solder material portions.

Abstract: A light-emitting device is provided whose color mixing property and light emission efficiency are improved, while white light with high color rendering performance is ensured by means of four kinds of LED elements emitting red, green, blue, and white light respectively.

Abstract: Some embodiments include an integrated structure having a gallium-containing material between a charge-storage region and a semiconductor-containing channel region. Some embodiments include an integrated structure having a charge-storage region under a conductive gate, a tunneling region under the charge-storage region, and a semiconductor-containing channel region under the tunneling region. The tunneling region includes at least one dielectric material directly adjacent a gallium-containing material. Some embodiments include an integrated structure having a charge-trapping region under a conductive gate, a first oxide under the charge-storage region, a gallium-containing material under the first oxide, a second oxide under the gallium-containing material, and a semiconductor-containing channel region under the second oxide.

Abstract: A 3D integrated circuit device, including: a first transistor; a second transistor; and a third transistor, where the third transistor is overlaying the second transistor and is controlled by a third control line, where the second transistor is overlaying the first transistor and is controlled by a second control line, where the first transistor is part of a control circuit controlling the second control line and third control line, and where the first transistor, the second transistor and the third transistor are all aligned to each other with less than 100 nm misalignment.

Abstract: An LED package structure includes a carrier mounted with a plurality of LED chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second glue-layer is stacked on the first glue-layer. The second glue-layer has a height higher than that of the first glue-layer. The second glue-layer has a volume greater than that of the first glue-layer. The present invention also provides a method of LED package structure to stably produce a dam structure with uniform shape and high ratio of height/width.

Abstract: A semiconductor device may include an element region and a peripheral voltage withstanding region. The peripheral voltage withstanding region includes inner circumferential guard rings; and outer circumferential guard rings having a width narrower than a width of the inner circumferential guard rings. An interval between the inner circumferential guard rings is narrower than an interval between the outer circumferential guard rings. Each of the inner circumferential guard rings includes a first high concentration region and a first low concentration region. Each of the outer circumferential guard rings includes a second high concentration region and a second low concentration region. A width of a part of each first low concentration region that is exposed on a front surface of the semiconductor device is wider than a width of a part of each second low concentration region that is exposed on the front surface.

Abstract: An array substrate and a display device are provided. The array substrate includes a display region and a peripheral circuit region, wherein a first gate line, a first data line and a pixel region are arranged in the display region; the pixel region includes a first pixel electrode and a thin film transistor, and the thin film transistor includes a first gate electrode, a first source electrode and a first drain electrode; the peripheral circuit region is provided with at least one test unit including: a second gate line; a second data line; a second testing pixel electrode; and a second testing thin film transistor. The second testing thin film transistor includes a second gate electrode, a second source electrode and a second drain electrode, wherein the second gate electrode, the second source electrode and the second drain electrode are provided with test ports exposed outside.

Abstract: A method for forming a semiconductor device is disclosed. The method includes providing a semiconductor substrate. The method also includes epitaxially growing on the semiconductor substrate a first part of a III-V semiconductor nanostructure. The method further includes covering the first part of the III-V semiconductor nanostructure with a layer of a first material. Additionally, the method includes removing a top portion of the layer of the first material. Still further, the method includes epitaxially growing on the first part of the III-V semiconductor nanostructure a second part of the III-V semiconductor nanostructure. The method additionally includes covering the second part of the III-V semiconductor nanostructure with a layer of a second material. The second material is different from the first material. Even further, the method includes removing a top portion of the layer of the second material.

Abstract: A light source module is provided. The light source module includes a flexible printed circuit board, plural light-emitting diodes and plural first light-absorbing portions. The flexible printed circuit board has a first edge and a second edge opposite to the first edge. The light-emitting diodes are disposed on the flexible printed circuit board near the first edge. The first light-absorbing portions are disposed on the flexible printed circuit board near the second edge, in which the first light-absorbing portions are alternately arranged with the light-emitting diodes.

Abstract: A nanowire device of the present description may be produced with the incorporation of at least one hardmask during the fabrication of at least one nanowire transistor in order to assist in protecting an uppermost channel nanowire from damage that may result from fabrication processes, such as those used in a replacement metal gate process and/or the nanowire release process. The use of at least one hardmask may result in a substantially damage free uppermost channel nanowire in a multi-stacked nanowire transistor, which may improve the uniformity of the channel nanowires and the reliability of the overall multi-stacked nanowire transistor.