Patents Examined by Lynne R. Edmondson
-
Patent number: 7150091Abstract: A method of sealing a generator stator bar and a stator bar end fitting receiving the end including the steps of: brazing the fitting to the end of the stator bar with a braze material; applying a powder coating material to the end of the stator bar in the fitting; and curing the powder coating material to form a barrier coating on the end of the stator bar and the adjoining interior surfaces of the fitting.Type: GrantFiled: November 9, 2004Date of Patent: December 19, 2006Assignee: General Electric CompanyInventors: Waheed Tony Mall, Roderick Mark Lusted, Yu Wang
-
Patent number: 7147141Abstract: A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.Type: GrantFiled: November 13, 2002Date of Patent: December 12, 2006Assignee: Intel CorporationInventors: Daryl Sato, Gary Paek, John Dungan, David W. Boggs
-
Patent number: 7143928Abstract: Disclosed herein is a method for joining dissimilar metals without a need for a separate welding process. The method comprises applying a flux on a metal to be joined, inserting the metal into a mold, and injecting a molten metal into the mold. Thus, the base metal to be cast and the different metal are joined simultaneously with a casting process.Type: GrantFiled: September 15, 2005Date of Patent: December 5, 2006Assignee: Samyoung Machinery Co., Ltd.Inventor: Geum Tai Han
-
Patent number: 7140529Abstract: A wire bonding apparatus that include a piezoelectric element 4 provided near the capillary attachment portion of a bonding arm 1 so that a capillary 3 vibrates in the axial direction of the bonding arm 1, the piezoelectric element 4 being driven by a piezoelectric element driving power source 11. The wire bonding apparatus further includes a detector 15 and a bonding arm control circuit 16, wherein the detector 15 detects the voltage or current generated by the piezoelectric element 4 when the capillary 3 is lowered and contacts the object of bonding, and the bonding arm control circuit 16 controls the lowering motion of the bonding arm 1 in accordance with the changes in the voltage or current detected by this detector 15.Type: GrantFiled: February 17, 2005Date of Patent: November 28, 2006Assignee: Kabushiki Kaisha ShinkawaInventor: Yutaka Kondo
-
Patent number: 7134588Abstract: Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and/or accumulation of foreign matter, such as plating material, on the pressure welding part during use of the bonding tool are prevented, so that the bonding tool can carry out ultrasonic bonding stably. A plurality of protrusions with curved outer surfaces are formed on the pressure welding part that contacts the bonded part during ultrasonic bonding. The protrusions can be formed with spherical outer surfaces by forming concave grooves in a grid in an end surface of the bonding tool and then sandblasting the end surface of the bonding tool.Type: GrantFiled: December 23, 2004Date of Patent: November 14, 2006Assignee: Fujitsu LimitedInventors: Kenji Kobae, Takashi Kubota
-
Patent number: 7134590Abstract: A desoldering sheath that comprises at least one hollow metal wire molded to conform to the tip of a desoldering tool. In one implementation, the desoldering sheath is formed using a hollow metal wire that is coiled around a male cone-shaped mold. The coiled, hollow metal wire is then compressed between the male cone-shaped mold and a female cone-shaped mold to cause the hollow wire to retain the coiled shape. In use, the desoldering sheath is placed on the tip of a desoldering gun or iron and then heated. The heated desoldering sheath, while still on the tip of the desoldering gun or iron, is then placed into contact with solder. This causes the solder to melt and the desoldering sheath captures the molten solder by using capillary action to draw the molten solder into the hollow metal wire.Type: GrantFiled: March 16, 2004Date of Patent: November 14, 2006Inventors: Moon Gul Choi, Criswell Hyunsoo Choi
-
Patent number: 7134591Abstract: A method and apparatus for the nondestructive testing of a bond connection between a bond wire and a substrate or pad which utilizes an ultrasonic tool for bonding the bond wire to the substrate or pad. The test force is applied in the plane of the bond connection transversely to the bond wire through an ultrasonic welding tool.Type: GrantFiled: April 2, 2004Date of Patent: November 14, 2006Assignee: Hesse & Knipps GmbHInventor: Frank Walther
-
Patent number: 7134592Abstract: Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connections of the component are thermally coupled to a protection apparatus during the soldering process, so that some of the heat which is introduced into the solder connections during the soldering process is passed to the protection apparatus. The protection apparatus also has a protection sleeve, which surrounds the component in places. The protection sleeve is advantageously composed of a thermally insulated material, and is provided with a coating with a high thermal reflection capability in places on its outer wall which faces away from the component.Type: GrantFiled: September 15, 2003Date of Patent: November 14, 2006Assignee: DaimlerChrysler AGInventors: Ulrich Ensslin, Norbert Niemczyk
-
Patent number: 7131565Abstract: A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.Type: GrantFiled: November 25, 2003Date of Patent: November 7, 2006Assignee: International Business Machines CorporationInventors: Peter A Gruber, Lannie R Bolde
-
Patent number: 7129439Abstract: The present invention provides a joining method using a method of laser welding wherein two resin molded bodies can be joined with high welding strength. Specifically, this is a method that joins two thermoplastic resin molded bodies using a method of laser welding; the first resin molded body is a laser light transmissive molded body comprising a thermoplastic resin and cellulose fibers with an ?-cellulose content of 80% or more; the second resin molded body is a laser light absorbent molded body containing a thermoplastic resin and a colorant; and the first resin molded body and the second resin molded body are welded by irradiating laser light from the first resin molded body side.Type: GrantFiled: June 20, 2005Date of Patent: October 31, 2006Assignee: Daicel Polymer Ltd.Inventors: Masahiko Itakura, Hiroshi Sagane, Yuichi Oe
-
Patent number: 7129446Abstract: A device is provided to heat the whole heated surface of a carried member carried intermittently with a temperature change over time maintained constant. The device controls the driving of a belt-conveyer so that a heater moves in a carrying direction at a carry time movement velocity that is slower than the carry velocity of a TAB tape if the TAB tape is in a carried state. On the other hand, the heater moves in an opposite carrying direction at a carry standby time movement velocity derived from the difference between the carry velocity and the carry time movement velocity if the TAB tape is in a carry standby state.Type: GrantFiled: April 21, 2004Date of Patent: October 31, 2006Assignee: Seiko Epson CorporationInventor: Norio Imaoka
-
Patent number: 7124930Abstract: A gear pump having an inner rotor and an outer rotor is covered by a cylindrical outer casing and side casings. The cylindrical outer casing has two outer circumferential edges which are welded over the entire circumference thereof to the outer edges of the side casings, respectively. The outer casing has two angularly spaced recesses in its inner periphery for receiving slide seals therein. Welding is started at a welding start point which is 90 degrees spaced from the middle point between two recesses. During welding, welding energies are applied to the welding start point and the middle point between two recesses. Those energies tend to deform the casing into oval shapes that are 90 degrees out of phase from each other. Thus, these energies cancel each other, thereby preventing the casing from being deformed.Type: GrantFiled: July 24, 2003Date of Patent: October 24, 2006Assignees: Advics Co., Ltd., Denso CorporationInventors: Fumiyoshi Ariki, Hitoshi Mizutani, Akinori Nakayama, Yasunori Kawamoto, Hideaki Shirai
-
Patent number: 7124927Abstract: A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow to the device being bonded is disclosed.Type: GrantFiled: April 15, 2005Date of Patent: October 24, 2006Inventor: Steven F. Reiber
-
Patent number: 7121447Abstract: In an ultrasonic welding apparatus comprising an ultrasonic sonotrode and a backing plate, flat workpieces to be welded are pressed between the sonotrode and the backing plate. Projections are provided on a portion of the surface of the sonotrode and on a portion of the surface of the backing plate, each projection-bearing surface portion being adjoined by a smooth portion. The flat workpieces are for example ends of a strapping tape formed in a loop around a package in a strapping machine and the aim is to produce a weld of increased strength.Type: GrantFiled: May 13, 2004Date of Patent: October 17, 2006Assignee: Maschinenfabrik Gerd Mosca AGInventors: Timo Mosca, Peter Lüdtke
-
Patent number: 7122762Abstract: Apparatus and method for use with a welding system. The apparatus and method provides a fluid bath which allows a welding nozzle of the welding system to be dipped into, for example, a friction reducing agent.Type: GrantFiled: November 10, 2001Date of Patent: October 17, 2006Assignee: Weld Aid Products, Inc.Inventors: Gary Lee Baum, Anthony John Zaccagni
-
Patent number: 7118021Abstract: A tooling for affecting the repair of turbine blade tips which generates bond line loads as a result of differential thermal expansion between the work piece and the fixture. The fixture accommodates multiple work pieces of different sizes to facilitate a batch repair process and compressive load limits are established by insertion of deformable compression rings.Type: GrantFiled: November 26, 2003Date of Patent: October 10, 2006Assignee: Siemens Power Generation, Inc.Inventors: Gary William Swartzbeck, Paula Denise Freyer
-
Patent number: 7114644Abstract: The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining is from 20.65 to 23.5 wt %. The invention has been completed on the basis of the discovery that the true eutectic point of this alloy system corresponds to 20.65 wt % Sn. In the invention, as means for adjusting the composition of a resulting joint, it is necessary to appropriately adjust the composition and thickness of a brazing material according to the thickness of a gold plating. In the invention, the relationship between the brazing material thickness and the gold plating thickness is shown when the brazing material to be used has an Sn content of 21 wt % to 25 wt %.Type: GrantFiled: February 11, 2005Date of Patent: October 3, 2006Assignee: Tanaka Kikinzoku Kogyo K.K.Inventor: Kenichi Miyazaki
-
Patent number: 7111770Abstract: Connecting ends on a hose piece comprising several metal layers, in particular a strip wound metal hose piece, are produced by fixing the overlapping metal layers of a hose of larger length or of an endless hose in the region of the point of separation through welding and subsequently cutting off the hose piece from the longer hose or the endless hose. For simple and inexpensive fixing of the metal layers in the region of the point of separation, a welding seam is generated which extends through at least part of the periphery of the hose or about its entire periphery, using roller seam welding. The hose piece can subsequently be separated along the welding seam obtained in this manner, e.g. along its central line, thereby ensuring permanent and reliable fixing of the metal layers in the region of the connecting end.Type: GrantFiled: September 7, 2004Date of Patent: September 26, 2006Assignee: IWKA Balg- u. Kompensatoren-Technologie GmbHInventors: Edward Kern, Marc Pontzen, Stephen Goley
-
Patent number: 7101781Abstract: This invention relates to an integrated circuit package and a method for the same, especially relates to the integrated circuit package without a solder mask and the method for the same. A solder wettable metal is used as the material of the first solder pad and a non-wettable insulating layer is formed on the top surface and sidewalls of the metal layer, which is not solder pads, in the integrated circuit packages without a solder mask of the present invention to avoid short circuit defects and to increase a circuit density and reliability of the integrated circuit packages.Type: GrantFiled: August 13, 2002Date of Patent: September 5, 2006Assignee: Via Technologies, Inc.Inventors: Kun-Yao Ho, Moriss Kung
-
Patent number: 7100814Abstract: A method of preparing an integrated circuit module for attachment to a PC substrate. At least one uncased semiconductor die is affixed to a TAB tape frame having concentrically arranged an outer conductive test pad footprint, and an intermediate bond pad footprint. Conductive traces connect the bond pads individually to test pads and to ball grid array pads on the TAB tape within the confines of the bond pad footprint. Wire bonds connect input/output points of the die to the bond pads The die and the wire bonding are next overmolded with a plastic forming a cased integrated circuit module. Testing and burn-in of the module is achieved by connecting test probes to the test pads After the test and bum-in step, the integrated circuit module is cut free from the TAB tape frame for attachment to a PC board, via the ball grid array.Type: GrantFiled: February 18, 2004Date of Patent: September 5, 2006Assignee: Cardiac Pacemakers, Inc.Inventor: James E. Blood