Abstract: A fin frame baseplate is disclosed. Specific implementations include a baseplate configured to be coupled to a substrate, a fin frame including a base portion coupled to the baseplate, and a plurality of fins extending from the base portion, the plurality of fins protruding from the base portion. The fin frame may include a plurality of openings therethrough.

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

Abstract: Systems and methods for managing airflow for cooling computing devices (e.g. in a data center) in normal and cold environments are disclosed. In one embodiment, the method comprises positioning the computing devices on a plurality of racks with air barriers to create hot and cold aisles. The computing devices may be configured in a first mode to draw in cool air the cold aisles and exhaust heated air into the hot aisles. Temperatures in the cold aisles may be periodically measured. In response to temperatures below a predetermined threshold, one or more of the cold aisles may be converted into a temporary hot aisle by adjusting ventilation openings and configuring a subset of the computing devices to temporarily draw in warm air from the temporary hot aisle.

Abstract: In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.

Abstract: A connector assembly with latching provided by a rotating latch bar. The connector has a low height, with the rotating latch bar providing secure engagement between mated connectors of the connector assembly. The latch bar may be shaped to provide spring force that urges the mated connectors together. The connector assembly may be formed with a cable connector and a board connector. The low height of the board connector enables the connector to be mounted close to high speed electronic components, such as a processor, even if covered by a heat sink, as the connector may fit under the heat sink. The cable connector may be coupled, via a cable, to an I/O connector or other component remote from the high speed electronic component.

Abstract: Provided herein are a heat sink module of an inverter module to power an electric vehicle. The heats sink module can include a heat sink body having a plurality of mounting holes, a fluid inlet and a fluid outlet. The heats sink module can include a cooling channel that can be fluidly coupled with the fluid inlet and the fluid outlet. The heats sink module can include an insulator plate having a first surface and a second surface. The second surface of the insulator plate can couple with a joining surface of the heat sink body to seal the cooling channel. The heats sink module can include a heat sink lid disposed over the insulator plate. The heat sink lid can have a plurality of mounting feet to couple with the mounting holes of the heat sink body to secure the heat sink lid to the heat sink body.

Abstract: An electronic housing assembly includes a polymeric housing base and a metallic heat sink secured to the housing base with a snap-fit engagement. A printed circuit board is positioned within a cavity in the housing assembly and is protected within the housing by an environmental seal. The electronic housing assembly allows for expansion and contraction between the heat sink and the housing while maintaining the integrity of the seal.

Abstract: A dual heat transfer assembly includes upper and lower heat transfer elements received in a separator channel of a port separator of a receptacle cage. The upper heat transfer element includes an upper thermal interface extending into an upper module channel to interface with an upper pluggable module. The lower heat transfer element includes a lower thermal interface extending into a lower module channel of the receptacle cage to interface with a lower pluggable module. The heat transfer elements include inner ends located in the separator channel. The heat transfer elements include biasing members engaging the heat transfer elements and biasing the heat transfer elements into thermal engagement with the pluggable modules.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.

Abstract: An electronic device includes a board to which a heat generation component is attached, a heat sink that radiates heat generated by the heat generation component, a cooling target component that is between the board and the heat sink and is attached to the board, and a duct that takes in a part of a cooling air flow for cooling at least the heat sink and introduces the cooling air flow which is taken in to the cooling target component, thereby sufficiently cooling the cooling target component that is between the heat sink increased in size and the board and is positioned on a side to which the cooling air flow being applied to the heat sink flows away from the heat sink.

Abstract: An example electrical and liquid coolant midplane includes an electrical midplane having a ring bus bar assembly, a liquid coolant manifold, and a heat transfer device. The ring bus bar assembly is to receive power from power supply units of the computing system and provide the power to computing components installed in the computing system. The liquid coolant manifold includes four segments connected together as a rectangular ring, the liquid coolant manifold including first liquid connectors facing in a first direction and second liquid connectors facing in a second direction opposite the first direction. The heat transfer device is in contact with the ring bus bar assembly and one of the segments of the liquid coolant manifold, to thermally couple the ring bus bar assembly with the manifold to provide liquid cooling to the ring bus bar assembly.

Abstract: An elastic heat-dissipation structure comprises a porous elastic member, a plurality of first thermal conductive members, and a plurality of second thermal conductive members. The first thermal conductive members and the second thermal conductive members are mixed in the porous elastic member. Each first thermal conductive member has a maximum width ranged from 5 ?m to 50 ?m, each second thermal conductive member has a maximum width ranged from 0 ?m to 5 ?m, and the thicknesses of each first thermal conductive member and each second thermal conductive member ranges from 0.3 nm to 30 nm. When the density of the elastic heat-dissipation structure is between 0.1 g/cm3 and 1.0 g/cm3, the contained percentages of the first thermal conductive members and the second thermal conductive members range from 0.01% to 20%. An electronic device containing the elastic heat-dissipation structure is also disclosed.

Abstract: A power distributor includes a detachable display and a power distribution unit. The power distribution unit includes a plurality of electrical sockets and a display port available to provide connection to the detachable display. Configuration parameters are stored within the power distribution unit. The detachable display includes a memory that contains configuration information for the power distribution unit. The configuration information can be transmitted through the display port to the power distribution unit and stored by the power distribution unit as the configuration parameters.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a printed circuit board, a heat source located on the printed circuit board, and an active loading mechanism secured to the printed circuit board. The active loading mechanism is over the heat source and includes shape memory material. When the shape memory material is not activated, the active loading mechanism applies a first load on the heat source and when the shape memory material is activated, the active loading mechanism applies a second load on the heat source.

Abstract: A system to improve cooling of rack mounted components may include a first rack mounted component including a first motherboard, the first motherboard having a hot area that is generally hotter than other portions of the motherboard, the hot area proximate a first edge. In addition, the system may include a second rack mounted component disposed above the first rack mounted component; the second rack mounted component having a second motherboard, wherein the second motherboard is similar to the first motherboard; the second motherboard having a first edge; wherein the second motherboard is disposed above the first motherboard, and wherein the second motherboard is angled with respect to the first motherboard so that the first edge of the second motherboard is non-aligned with the first edge of the first motherboard.

Abstract: A portable medical device, such as an ultrasound imaging system, is configured to connect to a stand, and transfer heat from the device to the stand. The device includes a heat-generating source, a hot plate that is thermally coupled to the heat-generating source, and a barrier plate that is biased away from the hot plate and moveable between a first position, wherein the device is not docked to the stand, and a second position, wherein the device is docked to the stand. In the first position, the barrier plate is not in thermally conductive contact with the hot plate, and in the second position, the barrier plate is in thermally conductive contact with the hot plate. When moved from the first position to the second position, a cold plate on the stand pushes the barrier plate into the second position such that heat generated by the imaging system is transferred through the barrier plate to the hot plate and into a cold plate of the stand.

Abstract: A server tray assembly includes a server tray support configured to receive a server board that includes a working fluid conduit fluidly coupled to a server board connector disposed on a back plane of the server board, a back wall of the server tray support includes a fluid connector configured to form an unbiased fluid connection with the server board connector; and a locking assembly secured to at least one of a server rack or the server tray support, the locking assembly disposed opposite the fluid connector is configured to engage a portion of the server board to bias the server board toward the fluid connector to fluidly seal the unbiased fluid connection between the server board connector and the fluid connector of the server tray support.

Abstract: A mounting rack is described for a power electronics installation, including busbars for electrically connecting a plurality of assemblies, which busbars are arranged on the rear side of the mounting rack. A corresponding power electronics installation is also described.

Abstract: Compressed air and lattice structure cooling is disclosed. In an embodiment, an assembly includes a heat conductive lattice structure with open-cell voids. The assembly also includes a port configured to provide compressed air that is directed toward the heat conductive lattice structure. The assembly also includes a base configured to be coupled to an electronic component and thermally coupled to the heat conductive lattice structure.

Abstract: A radiator includes a radiating part including a housing and a set of blades arranged on the inner surface of the housing; and a heat conductive part. The heat conductive part includes a shell including a heat conductive surface, configured to be in contact with a heat source, and a receiving section with two open ends. The receiving section is configured to receive the radiating part. In an embodiment, the radiating part is rotatablely fixed on the receiving section of the heat conductive part such that, when the radiating part rotates, fluid can be drawn into one end of the receiving section and then blown out at the other end by the blades. The radiating part is able to exchange heat constantly with new fluid and the rotation of the blades can expel the fluid with higher temperature and draw in fluid with lower temperature to perform new heat exchange.