Abstract: An information processing system includes a processor, a memory device, and riser card. The riser card includes a riser card cage, a circuit card, and a baffle. The circuit card is installed into the riser card cage and includes a card edge and a connector affixed to the circuit card. The card edge is configured to be installed into another connector on an information handling system in a first orientation. The connector is configured to receive a card edge of an add-in card in a second orientation perpendicular to the first orientation. The baffle is integrated with the riser card cage. The baffle is configured to divert a first air flow from the processor away from the riser card cage, and to channel a second air flow from the memory device into the riser card cage.

Abstract: An equipment rack that includes a modular compute chassis, a modular processing unit located in the modular compute chassis and where the modular processing unit is configured to remove from the front of the modular compute chassis in a frontward direction, relative to the front side of the modular compute chassis, and an air mover unit located in the modular processing unit and where the air mover unit is configured to remove from a rear side of the modular processing unit in a rearward direction, relative to the front side of modular compute chassis.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously an absorption/desorption unit is employed having a carbon element and a controller configured to regulate the absorption unit. Robotic components facilitate automation.

Abstract: A chassis of a server comprises a backplane. The backplane is disposed in the chassis of the server, and the backplane includes a first sub-board, a second sub-board, and at least one air baffle. The first sub-board is isolated from the second sub-board. Each air baffle forms an included angle with the first sub-board and forms an included angle with the second sub-board. Space enclosed by the first sub-board, the second sub-board, and a side wall, an upper wall, and a lower wall of the chassis is divided into a first air cavity and at least one second air cavity by using the at least one air baffle. The first air cavity is used for at least one first module to dissipate heat, and the second air cavity is used for at least one second module to dissipate heat.

Abstract: Solid state and hybrid circuit protection devices include improved chemical, static discharge and impact resistant housing construction, arc-free switching operation, secure terminal assemblies and thermal management features. The solid state and hybrid circuit protection devices are ignition protected and avoid possible explosions and therefore obviate a need for conventional explosion-proof enclosures to ensure safe operation of an electrical power system in a potentially explosive environment.

Abstract: A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.

Abstract: Apparatuses and methods include at least one push fan assembly and at least one pull fan assembly and at least one constriction channel or pathway designed to compress air pulled in by the push fan so that as the compressed air exits the at least one constriction channel or pathway, the air undergoes an expansion and cools and the push-pull fan arrangement pulls the cooled air through the housing improving the cooling of computer or electronic components housed in the housing.

Abstract: A low-voltage switching device includes a housing in which power-electronic components are arranged in the region of ventilation of a fan. In an embodiment, the power-electronic components operate under temperature regulation by virtue of an air flow that is guided asymmetrically proceeding from the fan. Therefore, the low-voltage switching device can be operated at a nominal device current range of up to 650 A as the result of the asymmetrically guided air flow.

Abstract: An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.

Abstract: A component-level cooling system for cooling components in a chassis includes a fan in a housing positioned on a circuit board. The housing has a fan inlet on a side, a first fan outlet on one end and a second fan outlet on a second end opposite the first end. The first fan outlet may direct a first airflow in a first direction to a vent on a first panel of the chassis. The second fan outlet may direct a second airflow in a second direction opposite the first direction. A duct comprises a duct inlet for receiving the second airflow, an elbow for redirecting the second airflow in a third direction to avoid the second airflow from colliding with a main airflow to reduce acoustic noise, and a duct outlet located to avoid heated air exiting the duct from re-entering the fan inlet.

Abstract: An adaptive airflow flapper assembly may be configured to when present in a first chassis bay adjacent to a second chassis bay unpopulated with a another information handling resource module, close to a closed position relative to the enclosure such that, due to non-overlap of the enclosure airflow openings relative to the flapper airflow openings, the adaptive airflow flapper assembly prevents airflow between the interior and the exterior of an enclosure, and when present in the first chassis bay adjacent to the second chassis bay populated with the second information handling resource module, open to an open position relative to the enclosure to allow airflow between the interior and the exterior of the enclosure.

Abstract: An air shroud includes first and second channels, a center bypass port, and a center deflector. The first channel directs a first airflow over a first heat sink of a first processor. A first hot airflow leaves a first rear portion of the first channel. The second channel directs a second airflow over a second heat sink of a second processor. A second hot airflow leaves a second rear portion of the second channel. The center bypass port directs a third airflow away from a first set of memory modules. The center deflector is in physical communication with the first and second channels. The center deflector directs a first portion of the third airflow to the first rear portion of the first channel, and a second portion of the third airflow to the second rear portion of the second channel.

Abstract: The present application pertains to testing methods and apparatus useful in two-phase liquid immersion cooling systems. Such systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of two phase liquid immersion cooling so actual servers are not required to test various aspects of the two phase liquid immersion cooling units.

Abstract: A cooling fan module includes a fan unit and an air flow blocking unit. The air flow blocking unit includes a left-side plate, a left-side support pole, a left-side air flow blocking plate, a right-side plate, a right-side support pole, a right-side air flow blocking plate, and a stop member. The left-side air flow blocking plate and the right-side air flow blocking plate are blown by an air flow flowing from outside environment into a case through the fan unit that is in a malfunction state, thereby rotating by respectively taking the left-side support pole and the left-side support pole as a rotary center thereof. Consequently, the left-side air flow blocking plate and the right-side air flow blocking plate are stopped rotating by the stop member, such that the air flow is blocked, by the two air flow blocking plates, from being entering the case.

Abstract: In an example, a node of a telecommunications system includes a first section having one or more passive components; a second section including one or more power amplifier modules and a power supply, wherein the second section is coupled to the first section using fasteners; a distribution unit including a plate and a circuit board, wherein the second section is coupled to the distribution unit using fasteners; a cooling section; a first plurality of heat pipes extending from the one or more power amplifier modules to the cooling section; a second plurality of heat pipes extending from the first section into the second section; and a housing enclosing the first section and the second section.

Abstract: A circuit board assembly has a circuit board and an electrical component embedded in a cured plastic layer, as well as a heat sink for cooling the component. The component is placed with a first side on a surface of the circuit board facing the heat sink and in electrical contact with the circuit board, and is located in a window in the cured plastic layer. Moreover, the component is materially bonded to a surface of the heat sink facing the circuit board at a second side lying opposite the first side, in particular through soldering or sintering. The plastic layer is injected and cured between the surface of the circuit board and the surface of the heat sink. In the production process, the material is melted by the heat at the same time as the injection, such that the component is materially bonded to the heat sink.

Abstract: A living room convergence device includes a case, a mainboard, a central processor, and a thermal solution. The case includes a bottom portion that includes air intake holes and a top portion that includes air exhaust holes. The thermal solution includes a heatsink sitting atop the mainboard of the living room convergence device, the heatsink to dissipate heat from the central processor. The thermal solution also includes a fan assembly including rotating fan blades and a motor that drives the rotating fan blades, creating a bottom-to-up swirling airflow starting from the air intake holes and exiting through the air exhaust holes.

Abstract: A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure.

Abstract: An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.

Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.