Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.

Abstract: A transceiver assembly includes a cage and a heatsink. The cage includes first and second spaced apart walls and a third wall that spans the first and second walls. The third wall defines an opening, and the third wall includes two spring arms that each extend into the opening. The heatsink includes a heatsink body including a first surface and a protrusion that extends from the first surface of the heatsink body and a pair of spring-arm receivers positioned on the first surface of the heatsink body. Each of the pair of spring-arm engagement portions is configured to engage with a corresponding one of the two spring arms of the cage when the heatsink is attached to the cage.

Abstract: A base deck for a data storage device includes a body. The body includes a bottom wall and sidewalls that create an internal cavity. The bottom wall includes a textured external surface opposite the internal cavity. The base deck can be coupled to a cover to seal the internal cavity.

Abstract: A display stand and a display device comprising the same are disclosed. The disclosed display device may comprise: a display body including a display panel and having a mounting groove formed on the rear surface thereof; a stand which is detachably mounted to the mounting groove and conceals a cable connected to the display body; and a display body cover which is detachably coupled to the display body so as to cover the mounting groove and through which a part of the stand passes.

Abstract: An electronic apparatus has a heat-exchanger within a housing exchanges heat between internal and external fluids without direct contact between the fluids. The internal fluid circulates within the housing and the external fluid is received external from the housing and output external from the housing 120. The housing includes is a heater; impellers; a controller for controlling the heater and the flow of fluids through the heat-exchanger; and temperature and humidity sensors. The controller receives temperature and humidity data from the sensors; processes the data to indicate a current dew point within the housing; and compares the current dew point with a current location temperature at or adjacent the heat-exchanger. If the current location temperature is at or below the current dew point, the controller raises the temperature at at least one location on the heat-exchanger and/or activates the heat source to raise the temperature.

Abstract: A method of cooling a data centre, and a data centre, is disclosed. Optionally, the data centre comprises: a cooling air source (201); at least one rack room (202) having a floor and rack storage areas (203a-203d) on the floor, each rack storage area accommodating racks in which items of electronic equipment having at least one fan (204) are housed; one or more cold aisles (205) in the rack room, each cold aisle being adjacent to a rack storage area; one or more hot aisles (206) in the rack room, each hot aisle being adjacent to a rack storage area; and an air supply corridor (207) for transporting cooling air, above the floor, from the cooling air source to the one or more cold aisles. The method optionally comprises transporting cooling air from the cooling air source (201) to the one or more cold aisles (205) substantially under the control of the fans (204) of the items of electronic equipment.

Abstract: An example air management system includes laterally spaced apart rows of electrical equipment that each provide a flow path between two convection regions on opposing sides of the row. A plurality of supply aisles and a plurality of return aisles are interposed between each other. Each supply and return aisle has a respective room portion that includes a respective one of the convection regions, a respective ceiling portion disposed above the room portion, and a vented barrier portion therebetween. Each supply aisle provides airflow downwards from its ceiling portion to its convection region, and each return aisle provides airflow flow upwards from its convection region to its ceiling portion. A plurality of air handling units are located external to the plurality of rows and are configured to utilize the ceiling portions of the supply aisles as supply ducts, and utilize the ceiling portions of the return aisles as return ducts.

Abstract: The present application pertains to testing methods and apparatus useful in two-phase liquid immersion cooling systems. Such systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of two phase liquid immersion cooling so actual servers are not required to test various aspects of the two phase liquid immersion cooling units.

Abstract: A component carrier has a base structure with a recess, a thermally highly conductive coating covering at least a part of a surface of the base structure, and a component in the recess.

Abstract: A wire harness unit applied to a power storage device unit and a wire harness includes a routing material and a cooling unit that cools the routing material. The routing material constitutes a charging conduction path that extends between a charging inlet and a power storage device, and transmits electricity. The charging inlet is provided to a vehicle. The power storage device is provided to the vehicle and can store electric power. As a result, the wire harness unit, the power storage device unit, and the wire harness can reduce a cross-sectional area of the routing material to a relatively small area, thereby having an advantageous effect of capable of having proper mountability.

Abstract: This disclosure provides a fan for a power supply and a power supply device. The power supply includes an outer casing with four sides, and the four sides form four corners. Wherein the fan includes a fan frame, and a reserved space is formed by any one of the corners of the outer casing and an outer surface of the fan frame at the corresponding position; and the fan frame further has positioning holes at the other three corners of the outer casing to fix and connect with the outer casing.

Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.

Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a heat source, a heat sink over the heat source, and an active loading mechanism coupled to the heat sink, where the heat sink is thermally decoupled from the heat source when the active loading mechanism is not activated and the heat sink is thermally coupled to the heat source when the active loading mechanism is activated. In an example, the active loading mechanism includes shape memory material and the shape memory material is activated when a temperature of the heat source satisfies a threshold temperature.

Abstract: Circuit films, a printed circuit board (PCB), and the like, are connected to a display panel. First and second heat dissipation members are coupled to a rear surface of the display panel to support and protect the circuit films, the PCB, and the like, while dissipating heat from driver ICs and the like.

Abstract: An electronic apparatus includes: a first cover having a first face portion that covers a plurality of parts built in the electronic apparatus, and a first peripheral face portion which provides a first portion of an outer peripheral face of the electronic apparatus; a second cover having a second face portion that covers the plurality of parts, and a second peripheral face portion which provides a second portion of the outer peripheral face of the electronic apparatus; a channel defined by a separation between the first cover and the second cover, where the first and second face portions are opposite to one another, a first peripheral edge of the first cover and a second peripheral edge of the second cover oppose one another and do not meet, thereby defining the separation between the first cover and the second cover; and a plurality of air vent holes located through at least one wall surface within the channel.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously an absorption/desorption unit is employed having a carbon element and a controller configured to regulate the absorption unit.

Abstract: The present invention relates to a carrier (2) with a passive cooling function for a semiconductor component (3), having a main body (6) with a top side (7) and a bottom side (8) and at least one electrical component (13, 13a, 13b) that is embedded in the main body (6), wherein the carrier (2) has a first thermal via (14), which extends from the top side (7) of the main body (6) to the at least one electrical component (13, 13a, 13b), wherein the carrier (2) has a second thermal via (15), which extends from the at least one electrical component (13, 13a, 13b) to the bottom side (8) of the main body (6), and wherein the at least one embedded electrical component (13, 13a, 13b) is electrically contacted by the first and the second thermal via (14, 15).

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. Utilizing robotic arms and slot-in computing components located within chassis, a self-healing computing system may be created.

Abstract: A system and method are provided for coordinating the installation and removal a motor control center subunit with the power connection and interruption thereof. A system of interlocks and indicators causes an operator to install a motor control center subunit into a motor control center, and connect supply and control power thereto, in a particular order. Embodiments of the invention may prevent actuation of line contacts of the bucket, and shield the line contacts, until the bucket is fully installed in the motor control center. Other embodiments also prevent circuit breaker closure until the line contacts are engaged with a bus of the motor control center.