Abstract: The present invention is directed to a method of bonding at least two surfaces together. The methods step of the present invention include applying a strip of adhesive to a first surface along a predefined outer boundary of a bond area and thereby defining a remaining open area there within. A second surface, or gusset plate, is affixed onto the adhesive before the adhesive cures. The strip of adhesive is allowed to cure and then a second amount of adhesive is applied to cover the remaining open area and substantially fill a void between said first and second surfaces about said bond area. A stencil may be used to precisely apply the strip of adhesive. When the strip cures, it acts as a dam to prevent overflow of the subsequent application of adhesive to undesired areas. The method results in a precise bond area free of undesired shapes and of a preferred profile which eliminate the drawbacks of the prior art bonds.

Abstract: A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

Abstract: A method and an apparatus for automated application of paint film to bodywork parts (1) and to a paint film composite (5) which is suitable for automation. A paint film composite (5) which is suitable for automation is created and adhesively bonded onto the bodywork part (1) in an accurate position and without any bubbles or creases by means of a robot-controlled application tool that is appropriate for this purpose. To securely hold the film composite (5), which has been picked up from a substrate, the suction grippers (30, 31) which grip the ends are angled in mirror-image form, in order in this way to prevent the ends from becoming detached from the suction grippers. The lower protective strip (9) is then at least partially pulled off, thus exposing the adhesive face of the useful part (6) of the paint film. The film composite (5) is aligned in the correct orientation at a short distance from the bodywork part (1) and the useful part (6) of the paint film is wiped onto the bodywork surface (1).

Abstract: There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer (11) and a second material layer (12) (laser light irradiation, pressure application, or the like) is performed before peeling, and then peeling is conducted by physical means. Therefore, sufficient separation can be easily conducted in an inner portion of the second material layer (12) or an interface thereof.

Abstract: A membrane applicator comprises a wheeled carriage adapted to ride on a surface to be covered with the membrane. A roll mount system is provided on the carriage to support a roll of membrane thereon. A press roll is mounted to the carriage for pressing the membrane against the surface to be covered as the membrane is being unrolled from said roll mount system as a result of a displacement of the carriage on the surface. The applicator is particularly well suited for applying bituminous membrane on flat roof surfaces of commercial and industrial buildings.

Abstract: The present invention provides an adhesive tape cutter capable of, when attaching an adhesive tape to an object, automatically forming a non-adhesive area that constitutes a tab in order to make it easier to peel off the adhesive tape. An adhesive tape cutter 1 comprises: a support member 5 located at one end of a main bracket 2 to support a wound body of adhesive tape 4 so that the wound body of adhesive tape 4 can rotate; a cutting member 6 located at the other end of the main bracket 2 to cut an adhesive tape 3 drawn from the wound body of adhesive tape 4; an overlapping-area-forming mechanism 7 located between the support member 5 and the cutting member 6 to form an overlapping area 3E along one margin of the adhesive tape 3 in its lengthwise direction; and a pressing member 8 that is located near the cutting member 6 and comes into contact with the non-adhesive surface 3B of the adhesive tape 3, thereby pressing the adhesive tape 3 to the object.

Abstract: A carrier tape for a tape and reel machine includes at least one edge having a plurality of sprocket openings therein. The carrier tape also includes a first row of aperture cavities and a second row of aperture cavities. Electrical components are contained in the first and second row of aperture cavities. In some embodiments, the electrical components carried are the same, and in other embodiments, the electrical components carried in the first row differ from the electrical components carried in the second row.

Abstract: Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

Abstract: A binder strip cassette including a binder strip roll disposed within a cassette housing, with the roll including a multiplicity of elongated binder strips, each of said binder strips including a flexible substrate and an adhesive disposed on the substrate. The roll further includes a flexible elongated carrier supporting said binder strips, with said binder strips being disposed along a length of the elongated carrier in an end-to-end arrangement. The cassette is further provided with a drive apparatus for unwinding the rotatably mounted binder strip roll together with a separating apparatus disposed within the cassette housing for separating the binder strips from the elongated carrier of the unwound portion of the binder strip roll to produce a separated binder strip which is elected from the housing.

Abstract: Process for heating a substrate, which contains, relative to the total weight of the substrate, 0.1 to 70 wt. % of metallic, magnetic, ferrimagnetic, ferromagnetic, antiferromagnetic or superparamagnetic particles having an average particle size of between 1 and 5000 nm, wherein the substrate is exposed to electromagnetic radiation, characterized in that the electromagnetic radiation comprises microwave radiation with a frequency in the range from 1 to 300 GHz and the substrate is simultaneously exposed to a direct-current magnetic field, the field strength of which is at least twice the strength of the earth's magnetic field; use of the process for producing or detaching adhesive bonds; device for the simultaneous production of microwave radiation with a frequency within the range from 1 to 300 GHz and a direct-current magnetic field, the field strength of which is at least twice the strength of the earth's magnetic field.

Abstract: A hand-held adhesive tape dispenser/applicator comprising a housing shell (1) including a hub (2) for mounting adhesive tape rolls, a tape discharge opening (13) and a lever mechanism (3). The lever mechanism (3) comprising pivotally mounted levers actuated by movement of the dispenser housing during the tape application and cutting process providing means for locking the tape whilst cutting, preventing roll back of tape end and an anti-locking function enabling smooth passage of tape whilst dispensing. Dispensing tape passes over a tape guide applicator (4), when a requisite length of tape is applied a user tilts the housing shell (1) engaging a cutter lever (6) with the tape actuating a tape depressor lever (5) which depresses and adheres a section of tape to the housing shell (1). As tape is severed a new tape end remains adhered until released by the next application. When inverted, the dispenser/applicator is freestanding and dispenses tape in desktop mode.

Abstract: A closing banding (1) for a bobbin (2), in particular for a bobbin (2) of cigarette paper, comprising a) a paper carrier (3) which is coated with a self-adhesive compound (6) on its underside (4) in the region of the upper transverse edge (5), and b) has a non-adhesive tab (8) in the region of the lower transverse edge (7), opposite the upper transverse edge (5), characterized by c) a double-sided adhesive tape (9) which is arranged on the underside (4) of the paper carrier (3), between the self-adhesive compound (6) and the tab (8), d) the double-sided adhesive tape (9) having a cleavable paper carrier (10) which is coated on both sides with self-adhesive compound (11).

Abstract: The present invention relates to a method for splicing successive rolls of webmaterial to one endless web, in such way that during subsequent coating of the web, coating defects near the splices are reduced, preferably prevented. To that end at least part of the trailing edge of the splicing tape used to splice the succeeding webs, is left free of adhesive. Because of this, air, which during said coating process gets entrapped behind the splice, between the coating layer and the web, can dissipate between the adhesive-free tape edge and the underlying web surface, thus reducing or preventing the formation of air bubbles and subsequent coating defects. The possible reoccurrence of discontinuity coating defects at very high coating speeds can be reduced or prevented by subjecting the surface of the web to be coated to an electrostatic charge before applying the coating.

Abstract: A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.

Abstract: A pipe construction system which utilizes a multiplicity of arcuate pipe segments 11, 12 to form a pipe section 10 and which sections are assembled together to form a length of pipe. Each segment 11, 12 has two longitudinal edges 13 of increased radial thickness and having a groove 14 formed in the circumferential direction whereby an interlocking and sealing member 15 may be located in the aligned grooves 14 of two adjacent segments 11, 12. One end of a pipe section 10 assembled from the segments defines a socket 22 for receiving a spigot 23 defined at the other end of a like section. The spigot end of each segment has a pocket 25 formed along said edge 13 but within the thickness of the major area of the segment, which pocket 25 mates with a corresponding pocket 25 of an adjacent segment whereby sealant may be disposed in the mating pockets.

Abstract: A label wrapper assembly for wrapping a label on an elongated object. The assembly includes a support frame having a first wall spaced from a second wall. A wrapper frame is interposed between the first and second walls, and has a first end and a second end. The wrapper frame includes an opening for receiving the elongated object extending through the wrapper frame between the first and second ends, wherein the wrapper frame revolves around the elongated object to wrap a label thereon. In one embodiment, the first end is rotatably mounted to only one of the first and second walls, and the second end is adjacent to the other of the first and second walls. In another embodiment, a clamp mechanism is mounted to each of the walls, wherein each of the clamp mechanisms clamp onto the elongated object extending through the wrapper frame to hold the elongated object as the wrapper frame revolves around the elongated object.

Abstract: A transfer tape dispenser includes a case, a supply spool, a return spool, and a substantially rigid applicator tip having an application edge. The applicator tip is disposed in a path of a transfer tape that originates from the supply spool and terminates at the return spool. When pressing the application edge on a surface, an application layer of the transfer tape adheres to the surface. The transfer tape dispenser includes a cushion that cushions the pressing of the application edge on the surface. The transfer tape dispenser further includes a slip clutch mechanism for providing slipping of the supply spool relative to the rotation of the return spool, when necessary, to maintain a desired tension in the correction transfer tape.

Abstract: A semiconductor manufacturing apparatus includes: a peeling mechanism to peel a pressure sensitive adhesive (PSA) tape from a semiconductor wafer constituted by a plurality of semiconductor chips which are separated therefrom, the semiconductor wafer having an element formation surface to form an element thereon and a rear surface opposite to the element formation surface, the PSA tape adhering to the element formation surface of the semiconductor wafer, each of the semiconductor chips having an adhesive layer formed on the rear surface; wherein the peeling mechanism has a sucking section which have a porous member to hold the semiconductor wafer by suction, the porous member being segmented into at least two sucking areas in the direction in which the PSA tape is peeled.

Abstract: Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the support structure is increased to increase a space between adjacent dies of the plurality of dies. Dies may be transferred from the expanded support structure.

Abstract: There is provided a supporting plate having a structure in which a solvent can be supplied to an adhesive layer between the supporting plate and a substrate such as a semiconductor wafer in a short period of time after the substrate is thinned, and also a method for stripping the supporting plate. The supporting plate may have a larger diameter than the semiconductor wafer, and penetrating holes are formed in the supporting plate. The outer peripheral portion of the supporting plate is a flat portion in which no penetrating hole is formed. When alcohol is poured from above the supporting plate, the alcohol reaches the adhesive layer through the penetrating holes, dissolves and removes the adhesive layer.