Abstract: When a remaining amount of a sheet on one original sheet roll is equal to or less than a predetermined remaining amount, a pair of holding pads is brought into a first posture where holding surfaces are opened, and the holding surface of one holding pad is pressed to a joining end portion from the outside of the original sheet roll in a radial direction of another original sheet roll. Further, the holding pad is moved such that the joining end portion is separated toward the outside of the original sheet roll in the radial direction. Further, the posture of the pair of holding pads is changed into a second posture where the holding surfaces approach each other, and the joining end portion is conveyed to a joining part in a state where the joining end portion is sandwiched between the holding surfaces of the pair of holding pads.

Abstract: A label assembly including a face sheet, a back sheet, and a layer of an adhesive positioned between the face sheet and the back sheet. A separation line divides the label assembly into at least two portions. The separation line is formed by a first tearable line of separation extending across the back sheet and a second tearable line of separation extending across the face sheet. The first tearable line of separation is offset with respect to the second tearable line of separation, and at least one of the first and second tearable lines of separation includes a non-linear portion directed toward and/or an angled portion extending at an angle to an other of the at least one of the first and second tearable lines of separation.

Abstract: A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step of cleaning a back surface of the workpiece with cleaning water, after the cutting step is carried out.

Abstract: The current disclosure describes carrier tape systems that include a carrier tape substrate and a cover tape. The carrier tape system includes a plurality of repetitive adhesion areas where the carrier tape substrate and cover tape are attached to each other and non-adhesion areas where the carrier tape substrate and cover tape are not attached to each other. Separating the cover tape and the carrier tape substrate at these repetitive adhesion and non-adhesion areas imparts a vibration to the cover tape which impedes or prevents semiconductor devices carried in pockets of the carrier tape substrate from adhering to adhesive on the cover tape.

Abstract: An adhesive tape applicator with a holder for a roll of adhesive tape and at least one handle and an applicator head arranged so that it is in a fixed position relative to the handle, wherein a deflector edge unit is arranged in particular so that it can move relative to the applicator head.

Abstract: A component supply device supplies components stored in a component storage tape to a component extracting position. The component supply device includes a component exposing unit that performs an exposing process for exposing the components in the component storage tape fed by a tape feeding unit, the component storage tape traveling on a travel path formed from a tape travel path forming unit. The component supply device further includes a cover member that covers at least a part of each component storage part of the component storage tape after the exposing process by the component exposing unit.

Abstract: A system for cutting a web material and applying the web material on a substrate. The system comprises a feed roll configured to advance a web material. The system includes an anvil roll configured to receive the web material from the feed roll and provide a section of web material having a defined length. The system includes a cutting element configured to cut the web material to form the section of web material. The anvil roll is configured such that the anvil roll surface advances at an anvil roll surface speed. The feed roll is configured to rotate at a first feed roll surface speed that is slower than the anvil roll surface speed and a second feed roll surface speed that is substantially the same as the anvil roll surface speed when the cutting element cuts the web material.

Abstract: The current disclosure describes carrier tape systems that include a carrier tape substrate and a cover tape. The carrier tape system includes a plurality of repetitive adhesion areas where the carrier tape substrate and cover tape are attached to each other and non-adhesion areas where the carrier tape substrate and cover tape are not attached to each other. Separating the cover tape and the carrier tape substrate at these repetitive adhesion and non-adhesion areas imparts a vibration to the cover tape which impedes or prevents semiconductor devices carried in pockets of the carrier tape substrate from adhering to adhesive on the cover tape.

Abstract: A printer comprising an electrical load, a control system and an electrical circuit to switchably connect the electrical load to a first phase and a second phase of a polyphase power supply. The control system monitors a first electrical current drawn by the printer on the first phase and a second electrical current drawn by the printer on the second phase. When a difference between the first electrical current and the second electrical current satisfies a threshold condition, the control system controls the electrical circuit to disconnect the electrical load from the first phase and connect the electrical load to the second phase.

Abstract: A film pasting tool is used to paste one surface of a film on a member-to-be-pasted at a predetermined position. The tool comprises a flexible tabular body, a first adhesive part, a front surface thereof being adhesive, provided on one surface of the body, and a second adhesive part, a front surface thereof being adhesive, provided on a part of a region other than a region where the first adhesive part is provided out of one surface of the body. An other surface of the film is pastable on the front surface of the second adhesive part, and when the other surface of the film is pasted on the front surface of the second adhesive part, the front surface of the first adhesive part is exposed in such a manner that the front surface of the first adhesive part is pastable on the member-to-be-pasted.

Abstract: A method of removing backing film from a sheet element is provided. The sheet element has a preimpregnated layer, and sheets of backing film are adhered to the top and bottom of the preimpregnated layer. The backing film has a different coefficient of thermal expansion than the preimpregnated layer, and a plane of the sheet element is defined by the peripheral edge. A shear strain is created between the backing films and the preimpregnated layer by cooling the sheet element. A fluid stream is directed at a portion of the peripheral edge, the fluid stream being directed in the plane of the sheet element. The fluid stream causes the backing films to separate from the top and bottom of the preimpregnated layer. A differential pressure is simultaneously applied to the backing films relative to the fluid stream to cause the backing films to be removed from the preimpregnated layer.

Abstract: A tape machine includes a base, one or more wheels connected to the base, one or more uprights extending upwards from the base, a roller connected to the base, and a tape roll housing connected to the uprights and configured to receive a roll of tape therein to allow for rotational unwinding of the roll of tape. A cutter connected to the base and moveable between an idle position and a cut position. A blade on the cutter is moveable to cut the tape when in cut position.

Abstract: A material dispensing system including a first frame and a first application head. The first application head supported by the first frame including a first bias ply assembly comprising a bias ply roll supported on a bias ply dispenser unit, the first bias ply assembly configured to pass bias ply material along a bias path; and a first non-bias ply assembly comprising a non-bias ply roll supported by a non-bias ply dispenser unit, the non-bias ply assembly configured to pass non-bias ply material along a non-bias path; wherein the bias path and the non-bias path are substantially parallel. Another aspect provides a material dispensing system including a first frame and a first application head supported thereby; and a second frame and a second application head supported thereby; wherein the first frame and the second frame move in an X direction during operation. Another aspect includes preparing a composite article.

Abstract: A method for bonding the tail of a convolutely wound log to the body is provided. The method comprises the use of a bonding material to bond the tail to the wound log. The bonding material is applied to application sites arranged in a non-uniform pattern.

Abstract: A method of reducing label waste that employs a stand-alone or printer attached apparatus for cleanly and efficiently cutting a web of media or tag stock into individual units. The apparatus used by the method may cut vinyl, plastic, or RFID stock material in both back and forth directions without sacrificing cut quality, and preferably comprises a housing, a carriage assembly and a movable cutter assembly. The cutter assembly comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The method involves using the cutting apparatus to make a series of cuts as the label material is incrementally advanced through the cutting apparatus.

Abstract: A manufacturing system for laying up a stringer laminate includes a lamination surface and a plurality of lamination heads including a frame filler outer ply lamination head for laying up (e.g., laminating) frame filler bottom ply at a plurality of frame filler locations. Also included is at least one frame filler inner ply lamination head for laying up one or more frame filler inner plies over a protruding portion of the frame filler bottom ply at each frame filler location. Further included is at least one stringer body lamination head laying up one or more stringer body plies defining a stringer body portion extending along the lamination surface. A frame filler outer ply lamination head is configured to lay up a frame filler top ply at each frame filler location such that the frame filler inner plies are captured between a frame filler bottom ply and a frame filler top ply.

Abstract: The present invention relates to the field of SMT splicing belt processing equipment, and more particularly to a bonding machine for new and old SMT splicing belts. The machine comprises a supporting plate for supporting the old and new splicing belts, conveying devices for conveying the old and new splicing belts toward one another, and a bonding mechanism for bonding the old and new splicing belts together, the conveying devices and the bonding mechanism both being connected to a controller.

Abstract: A fiber placement head assembly for applying a plurality of composite tape segments on a mold that includes a fiber placement head configured to receive composite tape from a composite tape source and apply the composite tape to the mold. The assembly also includes one or more air-operating conveyors, coupled with the fiber placement head, each having an inlet that is configured to receive an end of composite tape from the composite tape source, an outlet configured to provide the end of composite tape to the fiber placement head, and one or more inline vacuum conveyors that are configured to receive compressed fluid from a source and direct the compressed fluid toward the outlet thereby transporting the end of the composite tape from the inlet to the outlet and into the fiber placement head.

Abstract: Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 ?m, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m·K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m·K or higher.

Abstract: Provided is a method of forming a three-dimensional object, which may include the steps of: (a) providing a carrier and an optically transparent member having a build surface, the carrier and the build surface defining a build region therebetween; (b) filling the build region with a polymerizable liquid that comprises a reactive blocked monomer and/or prepolymer comprising a self-polymerizing monomer and/or prepolymer blocked with a light-polymerizable blocking group; (c) irradiating the build region with light through said optically transparent member to form a solid polymer scaffold from the reactive blocked monomer and/or prepolymer and also advancing the carrier away from the build surface to form a three-dimensional intermediate; and then (d) heating and/or microwave irradiating, the three-dimensional intermediate sufficiently to degrade the scaffold and regenerate the monomer and/or prepolymer in de-blocked form, which monomer and/or prepolymer in turn self-polymerize, to form said three-dimensional obj