Abstract: A die cutting method that cuts patterns in a label is provided. According an embodiment, a method adjusts temperature of a label sheet comprising a laminated layer and a liner layer. The method further separates the laminated layer from the liner layer prior to making the cuts on the laminated layer. The method further cuts one or more patterns on the laminated layer. The method further re-attaches, the laminated layer to the liner layer.

Abstract: A chip ejecting apparatus includes a table configured to be provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape, an ejector unit including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape, and a control unit configured to separately control on/off operations of the plurality of gas holes and select an active gas hole group from the plurality of gas holes. The active gas hole group is selected to overlap the target chip, and is configured to inject the gas toward the dicing tape along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip.

Abstract: An application head specially designed for producing parts made of composite materials, comprising an application roller, guiding means defining a guiding plane and a cutting system for cutting a fiber comprising a first tool movable in translation along a cutting direction and a second tool. The cutting system comprises an integrated control means able to displace the first tool in translation along the cutting direction and to displace the first and second tool together, in rotation around a direction parallel to the application roller.

Abstract: A method for taping a wafer is disclosed. A wafer taping device comprising a wafer stage is provided. A wafer is mounted and secured on the wafer stage. A tape is delivered along a first direction over the wafer. The tape is forced into adhesion with a surface of the wafer in a non-contact manner. The tape is cut along a perimeter of the wafer.

Abstract: An application head, comprising an application system, guiding means defining a guiding plane, a cutting system comprising a first cutting tool movable in translation and a second cutting tool, and a clamping system comprising a first clamping tool movable in translation and a second clamping tool. A first control means is able to displace the cutting tools together between initial and final cutting positions representing a variation in distance along the guiding plane and a second control means is able to displace the clamping tools together between initial and final clamping positions representing a variation in distance along the guiding plane.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may place a first outer layer, a core layer, and a second outer layer in a mold; and may heat the mold to at least thirty degrees Celsius above a glass transition temperature (Tg) for a period of time. In one or more embodiments, the polycarbonate fibers may be between eight and ten deniers per filament. In one or more embodiments, the Tg may be no more than 105 degrees Celsius. In one or more embodiments, the one or more systems, methods, and/or processes may further allow the first outer layer, the core layer, and the second outer layer to cool below the Tg, after the period of time. For example, after the layers cool, a shear modulus of the core layer may be in a range of 0.9868 megapounds per square inch (msi) to 2.2730 msi.

Abstract: A corrugated board plant includes a corrugated board production assembly for producing a double-face laminated web of corrugated board, and at least one cutting assembly arranged downstream of the corrugated board production assembly, which has a cross-cutting device for producing sheets from the double-face web of corrugated board, and is capable of producing at least one identification sheet from the double-face laminated web of corrugated board, which is different from the sheets. The corrugated board plant further has a stack depositing area arranged downstream of the cutting assembly to stack the sheets and the at least one identification sheet in such a way as to form a stack, which is identifiable by means of the at least one identification sheet, in particular for further processing.

Abstract: A method of recovering structural members from a used absorbent article comprising a front sheet, a back sheet and an absorbent body between the front sheet and the back sheet, wherein at least one of the front sheet and the back sheet includes a film, and wherein the absorbent body includes an absorbent body material, may include swelling the used absorbent article with water, applying a physical shock to and disintegrating the swelled used absorbent article into at least the film and the absorbent body material, and separating the film and the absorbent body material.

Abstract: A high-speed lamination machine includes a hinged, clamshell lid, and clamped lamination chamber that uses localized and thermally isolated heating and stepper driven separation pin motion. Pneumatically actuated rollers in a track clamp the lamination chamber closed during operation. The clamshell design obviates the need for a hydraulic press and makes the lamination chamber easily accessible to other automated systems, so robots may be used to place lamination elements within the chamber.

Abstract: A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

Abstract: The present invention relates to a method of manufacturing a plurality of wind turbine blades. The method includes providing first, second and third stationary moulds, moulding respective first upper and lower shell halves, removing and turning the first upper shell half, and positioning and bonding it on the first lower shell half to form a closed wind turbine blade shell. This is repeated for continuously manufacturing a plurality of wind turbine blades.

Abstract: A method of fabricating a composite structure is presented. The method comprises laying up a plurality of composite plies over a layup mandrel; positioning a first caul plate and a second caul plate over the plurality of composite plies, leaving composite material exposed; removing at least part of the composite material exposed between the first caul plate and the second caul plate to separate a first composite section from a second composite section; curing the first composite section and the second composite section to form a first composite part and a second composite part; and removing the first composite part and the second composite part from the layup mandrel immediately following curing.

Abstract: Provided is a gel nail sticker including: a lower laminated part which is a part directly attached to a nail or a toenail, and has a color or a pattern, and is formed of a flexible material to correspond to a curved surface of the nail or the toenail; and an upper laminated part which is a transparent coated layer positioned on the lower laminated part and providing glossiness to a color or a pattern of the lower laminated part, and is in a flexible semi-solid state to correspond to the curved surface of the nail or the toenail before being attached to the nail or the toenail, and is cured to a solid state while maintaining a form attached to the nail or the toenail when an ultraviolet ray is irradiated to the upper laminated part after the upper laminated part is attached to the nail or the toenail.

Abstract: An apparatus for applying the film to the substrate includes a bed having a substrate placement surface and a selectively positionable tack bar, a roller support moveable over the span of the bed, and including the location of the positioning bar, and a roller rotatably supported to the positioning bar and moveable over the bed in response to movement of the roller support with respect to the bed. In another aspect, the tack bar is of the same thickness, or slightly less thick, as the substrate onto which the film is to be applied, such that a portion of the film to be applied can be secured thereto and not on the substrate before the backing is removed from additional portions of the film, such that the tack bar supports an end of the film in substantially the plane of, or slightly below the plane of, the substrate.

Abstract: A peeling device includes a rolling mechanism, a peeling mechanism, and a suction mechanism. The rolling mechanism includes a feeding wheel and a receiving wheel. At least one of the feeding wheel and the receiving wheel is configured to rotate. The peeling mechanism includes a peeling plate including a first surface and a side surface. The suction mechanism includes a support table and a rotary suction cup. A carrier tape is transmitted in sequence around the feeding wheel, the first surface, the side surface, and the receiving wheel. The peeling plate peels the material from the carrier tape at a junction of the first surface and the side surface. The support table holds the material peeled from the carrier tape. The rotary suction cup is used to suck the material from the support table and move the material to a next processing area.

Abstract: The present disclosure discloses a display panel and a manufacturing method thereof, and a display device, and belongs to the field of display technology. The method includes: fixing a base substrate on a supporting plate; disposing the supporting plate on which the base substrate is fixed at a specified position in a process apparatus; and performing a process corresponding to the process apparatus on the base substrate which is fixed on the supporting plate by means of the process apparatus.

Abstract: A countertop assembly and method of making same. The method includes obtaining at least first and second layers that each include first and second alignment openings defined therein, disposing adhesive onto the upper surface of the first layer or the bottom surface of the second layer, stacking the second layer on the first layer, aligning the first alignment openings and aligning the second alignment openings, inserting a first alignment rod through the aligned first alignment openings, inserting a second alignment rod through the aligned second alignment openings, allowing the adhesive to dry to form a countertop stack assembly, and machining the countertop stack assembly to remove at least a portion of a surface of the first layer and at least a portion of a surface of the second layer to form a finished countertop assembly.

Abstract: Systems and methods are provided for designing composite parts. One embodiment is a method for fabricating a composite part. The method includes receiving a design that defines a stacking sequence for a composite charge comprising plies that have different fiber orientations, defining a splice zone within the design, modifying the design by splicing plies in a manner that accommodates ply slippage when the composite charge is formed to a contour, and fabricating a composite part based on the design that was modified.

Abstract: A method for determining the position of a construction platform for additive manufacturing of a component, includes marking a construction platform for additive manufacturing, providing a marking region of the construction platform with reference features, wherein the reference features are arranged and designed in such a way that a position of the reference features relative to a reference point are captured using an optical scanning method, and optically scanning the construction platform in the marking region and capturing the relative position with the aid of the reference features and the reference point.

Abstract: The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.