Abstract: The invention concerns a method of machining the tooth flanks of substantially cylindrical, but crowning-modified gears through a diagonal generating process employing a worm-shaped tool which is modified with a crowning in the direction of its rotary axis, wherein the crowning can be positive or negative (concave crowning), wherein by matching the crowning of the tool to the diagonal ratio, a flank twist is generated by means of the tool and superimposed on the natural flank twist, such that the result of said superposition equals the flank twist required for the work piece.

Abstract: A high pressure cutting arrangement includes two pressurized streams: a liquid stream and a slurry stream. The two streams are independently pressurized, and then combined at pressure. The combined stream is then accelerated through a nozzle to provide a cutting jet.

Abstract: A power tool that includes a tool body housing, a drive system, a tool head and a connection system. The drive system is housed in the tool body housing. The tool head, which is configured to perform work on a work piece, includes a tool head housing and an input member that is driven by the drive system when the tool head is coupled to the tool body housing. The tool head can be engaged to the tool body housing in at least two pre-defined and distinct orientations. The connection system secures the tool head to the tool body housing in each of the at least two pre-defined and distinct orientations.

Abstract: A flat or center depressed abrasive grinding wheel, comprising an abrasive discoidal element which is associable, substantially coaxially, with the free end of a rotating shaft of a grinder, having at least one substantially central through hole, a first face which can be arranged, in the assembly configuration, so as to be substantially directed toward the grinder and which forms the back of the discoidal element, and a second face, which is opposite to the first face. The discoidal element comprises at least one first layer of a discoidal abrasive mix defined at the first face and at least one second layer of discoidal abrasive mix defined at least one portion of the second face. The first and second layers of abrasive mix are mutually superimposed and jointly associated. The second layer of abrasive mix has an inside diameter that is substantially larger than the diameter of the through hole.

Abstract: This invention provides a conveying apparatus and a blasting machine equipped with the conveying apparatus that can prevent workpieces from being damaged by the used abrasives attached to the conveying rollers. For the conveying apparatus, a peripheral part 33a disposed at the peripheral surface of a rolling member 33 of a rolling roller 31 is made of a softer elastic material than the material of the panel P, wherein when used abrasives get stuck between the peripheral part 33a of the rolling member 33 and the panel P, since the peripheral part 33a acts as a cushioning material that can reduce the force caused by the used abrasives and loaded on the panel P, even if the panel P is made of a fragile material, such as glass, the panel P can be conveyed without flaws being caused by the used abrasives.

Abstract: A nozzle for providing carbon dioxide for cleaning is disclosed. The nozzle includes a reservoir for receiving liquid carbon dioxide, a barrel defining a passageway therethrough, the passageway extending to an outlet of the barrel, an orifice effecting fluid communication between the reservoir and the passageway, and a screen member constructed and arranged for interrupting flow of the carbon dioxide pellets greater than a select size from being emitted from the passageway of the barrel. Liquid carbon dioxide flows through the orifice to phase transfer into gaseous carbon dioxide and carbon dioxide pellets in the passageway. An internal diameter of the passageway is smaller than an internal diameter of the reservoir.

Abstract: A method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers includes providing a double-side processing apparatus including two rotating ring-shaped working disks and a rolling apparatus. The carriers are arranged in the double-side processing apparatus and the openings are disposed in the carriers so as to satisfy the inequality: R/e·sin(?/N*)?r/e?1?1.2 where N* denotes a ratio of the round angle and an angle at which adjacent carriers are inserted into the rolling apparatus with the greatest distance with respect to one another, r denotes a radius of each opening for receiving a respective semiconductor wafer, e denotes a radius of a pitch circle around a midpoint of the carrier on which the opening is arranged, and R denotes a radius of the pitch circle on which the carriers move between the working disks by means of the rolling apparatus.

Abstract: The mandrel assemblies include a double face box mandrel assembly with box refacing tube, male mandrel adapter for engaging within a bore of the box refacing tube, a box mandrel assembly floating over the male mandrel adapter and connected to a drill pipe connection. A box facing mandrel adapter connects to the male mandrel adapter, an outer face plate mounts over the box mandrel assembly engaging the box refacing tube; an inner face plate mounts over the box facing mandrel adapter shaft and attaches to a flange. A double face pin mandrel assembly with pin refacing tube, male mandrel adapter, and pin facing mandrel adapter engages a male mandrel adapter, a pin mandrel assembly floats over the male mandrel adapter and pin facing mandrel adapter and connects to a drill pipe connection opposite the double face box mandrel assembly.

Abstract: A polishing jig is provided that is capable of being used with different types, styles, and numbers of optical axes. For example, the polishing jig may be used with a variety of simplex connectors and with duplex connectors of at least first and second types. The first and second types of duplex connectors have different distances between the optical axes of their respective ferrules. The polishing jig may also be used with optical connectors having three or more ferrules having three or more respective optical axes.

Abstract: A plurality of grind-stone-mounts 12 each having a grind stone 15 on its outer side are attached to a holder 11 of a honing head 10 expandably along a radial direction. Each of the grind-stone-mounts 12 is provided with a support part 13 disposed inside along the radial direction, and a grind part 14 including the grind stone 15 and disposed outside along the radial direction. The grind part 14 is swingably attached to the support part 13 through one or more spring members 16 disposed at intervals along an axial direction of the holder 11.

Abstract: An apparatus and process used in a wet blasting cleaning operation to deliver and recycle wet media mixed with minimal liquid content to a media accelerator and maintain sizing and composition of the wet media, maximizing the efficiency of the media acceleration device, including a blast wheel or pressurized nozzle.

Abstract: A CNC system for effecting a finishing treatment of a surface, including: a mechanical assembly having a mechanical arm, adapted to move within at least two controllable axes of motion; a shoe arrangement, adapted to connect to an end of the arm and having at least one flexible surface finishing pad; and a drive mechanism adapted to drive the arm; a controller; a communication arrangement adapted to deliver communication signals between the controller and the mechanical assembly; and a positioning system providing the controller with positioning information with respect to the mechanical assembly, the system configured whereby the arm is responsive to the controller, the mechanical assembly adapted to urge the working surface against a workpiece surface, whereby a pressure is delivered thereto, the mechanical assembly including a controllable spring arrangement disposed and adapted to contribute to an overall mechanical compliance, normal to the working surface, of the mechanical assembly, the spring arrangem

Abstract: In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The slits in the feed nozzle into which the outer peripheral portions of cutoff abrasive blades are inserted serve to restrict any axial run-out of the cutoff abrasive blades during rotation. Cutting fluid is fed from the feed nozzle through slits to the rotating cutoff abrasive blades and eventually to points of cutoff machining on the magnet block.

Abstract: A method and an apparatus for smart automation of robotic surface finishing of a three-dimensional surface of a work piece is described. A three-dimensional motion path is created along the surface of the work piece. A variable contact force profile is specified along the three-dimensional motion path. The three-dimensional motion path is modified based on the specified variable contact force profile. The surface of the work piece is finished using one or more surface finishing tools along the modified three-dimensional motion path. The surface of the work piece includes at least a flat region and a curved region.

Abstract: A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 ?m/cm2, wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diameter not less than about 9.0 cm.

Abstract: The present invention comprises of a process for lapping a high-throughput of ultra-flat wafers by utilizing a lapping apparatus containing a rotary flat, grooved polishing platen, at least two rotating pressurized heads each having a polishing wafer carrier that is adapted to receive a plurality of mounted wafers, and a plurality of concentric conditioning rings surrounding each pressurized head. The rotating pressurized heads are counterbalanced throughout the inventive process, and the lapping platen is continuously conditioned by simultaneously rotating the concentric conditioning rings over the lapping platen. This process allows continuous and controllable planarization thus allowing for a high throughput of wafers, while at the same time it prevents distortions in the lapping platen which reduces maintenance by providing continuous conditioning of the lapping platen.

Abstract: In an outer blade cutting wheel comprising an annular thin disc base of cemented carbide having an outer diameter of 80-200 mm, an inner diameter of 30-80 mm, and a thickness of 0.1-1.0 mm, and a blade section disposed on an outer periphery of the base, the blade section comprises diamond grains and/or CBN grains bound with a metal bond having a Young's modulus of 0.7-4.0×1011 Pa and has a thickness which is greater than the thickness of the base by at least 0.01 mm. The outer blade cutting wheel is capable of cutting a workpiece at a high accuracy and a reduced allowance, improves machining yields, and reduces machining costs.

Abstract: A macro-porous abrasive article includes a spun lace substrate having a macro-porous structure and a coating. The coating is made of a resin binder and abrasive aggregates. The abrasive aggregates are formed from a composition of abrasive grit particles and a nanoparticle binder. The coating is at least partially embedded in the substrate. A method for making the macro-porous abrasive article includes combining abrasive aggregates of abrasive grit particles and a nanoparticle binder with a resin binder to form a slurry. The slurry is applied to a macro-porous support structure so that the slurry at least partially penetrates the substrate. The resin is then cured to bond the aggregate grains to the substrate.

Abstract: A method for polishing lens surfaces, in which a) prior to the polishing process, for the purpose of determining an abrasion profile, at least one point of a workpiece is polished by means of a polishing tool to be used, using at least one pre-defined parameter; b) the polishing abrasion thus achieved on the workpiece side is determined by measuring; c) on the basis of the abrasion profile, at least one parameter is set for a subsequent polishing process, and the polishing process is completed at least partially. A method for polishing lens surfaces, in which the polishing point is places at least outside of the workpiece center at a distance a from a plane which is tensioned by the tool spindle axis and the workpiece spindle axis.

Abstract: Semiconductor wafers are CMP polished by polishing the rear side of the semiconductor wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is higher at the center than at the edge of the rear side; and polishing the front side of the wafer by means of CMP with a material removal with a profile along the diameter of the wafer wherein material removal is lower in the center of the front side than in an edge region of the front side.