Abstract: A polishing pad and a polishing method for polishing a substrate are described. The polishing pad includes a polishing layer and at least two grooves. The grooves form polishing tracks respectively. The polishing tracks collectively construct an even tracking zone. A better polishing uniformity of a substrate surface is achieved with the even tracking zone.

Abstract: The invention relates to a device (10) for machining, in particular eroding and grinding, rotational workpieces (44) provided with cutting edges, with a machine base (12), a machining mechanism (14), which can be displaced relative to the machine base (12), and a workpiece positioning mechanism (18), which can be displaced relative to the machine base (12), wherein the machining mechanism (14) has at least one machining tool (30), which is attached in a rotatably drivable manner to a slide arrangement (20), which can be displaced in relation to the machine base (12), for machining a functional portion to be machined of the rotational workpiece (44), and wherein the workpiece positioning mechanism (18) has a workpiece holding mechanism (46), which can be displaced relative to the machine base (12) and holds a holding portion of the rotational workpiece (44) directly or via a holding adapter for attaching the rotational workpiece (44) to the workpiece positioning mechanism (18).

Abstract: A method for double-side polishing of a semiconductor wafer includes situating the semiconductor wafer in a cutout of a carrier that is disposed in a working gap between an upper polishing plate covered by a first polishing pad and a lower polishing plate covered by a second polishing pad. The first and second polishing pads each include tiled square segments that are formed by an arrangement of channels on the pads, where the square segments of the first pad are larger than the segments of the second pad. The square segments of the polishing pads include abrasives. During polishing, the carrier is guided such that a portion of the wafer temporarily projects laterally outside of the working gap. A polishing agent with a pH that is variable is supplied during polishing at a pH in a range of 11 to 12.5 during a first step and at a pH of at least 13 during a second step.

Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.

Abstract: An automatic grinding machine for end mills for wood, programmable with optical reading of geometric features and for computerized sharpening, has a compact structure, which includes a computerized control panel actuating various assemblies adapted for automated sharpening. A first optical reading assembly has an arm for automatic movement from an inactive position to a position suited for detecting the geometric features of the end mill. A second assembly for holding the end mill is configured to move on command forward and backward and/or simultaneously rotate the mill about its own axis. A third assembly for supporting a cup grinding wheel is mounted on the vertical frame, which rests on a rotatable circular and horizontal base. The grinding wheel can move above and below, longitudinally along the mill and/or in front of it, on the right and left side to sharpen end mills for wood with a left-handed or right-handed helix.

Abstract: The present disclosure involves various embodiments for finishing the internal wall of a capillary tube. A quantity of abrasive particles and a rod are placed in a capillary tube, wherein a portion of the abrasive particles is magnetic. A magnet is positioned near a side of the capillary tube, thereby attracting the abrasive particles toward an internal wall of the capillary tube. A relative rotation of the capillary tube is produced with respect to the magnet, thereby causing the abrasive particles to finish the internal wall of the capillary tube.

Abstract: The invention provides a block splitter assembly comprising first lower and second upper opposed splitter blade assemblies. The splitter blade assemblies have a splitting blade and two or more first forming blades. One forming blade is disposed to the right of and one forming blade is disposed to the left of the first splitting blade. The forming blades have forming edges. The splitting blade has a splitting edge that is straight, and the splitting blade has a greater maximum vertical dimension than the maximum vertical dimension of the forming blades. The splitting edge of the first splitting blade is opposed to the splitting edge of the second splitting blade.

Abstract: Cutting and grinding of ceramic-type logs to a desired piece length is disclosed. A method of manufacturing ceramic ware is disclosed which comprises transversely cutting a piece from a ceramic-type log having a longitudinal axis by cutting into the log with a blade at a location along the length of the log to form a cut transverse surface on the piece and grinding the cut transverse surface with a side of the blade. An apparatus for manufacturing ceramic ware is also disclosed comprising means for transversely cutting a piece from a ceramic-type log having a longitudinal axis, including a blade for cutting into the log at a location along the length of the log to form a cut transverse surface on the piece, and means for grinding the cut transverse surface with a side of the blade.

Abstract: Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.

Abstract: A polishing system for polishing a flat face of a rock comprises a polishing surface, a fence system, and a drive system. The polishing surface is supported for rotation about a primary rotation axis. The fence system is supported above the polishing surface. The drive system causes the polishing surface to rotate about the primary rotation axis and displace a driven portion of the fence system along a path relative to the primary rotation axis. The fence system engages the rock to prevent the polishing surface from causing the rock to move about the primary rotation axis and to cause the rock to move towards and away from the primary rotation axis.

Abstract: The invention provides a block splitter assembly comprising first lower and second upper opposed splitter blade assemblies. The splitter blade assemblies have a splitting blade and two or more first forming blades. One forming blade is disposed to the right of and one forming blade is disposed to the left of the first splitting blade. The forming blades have forming edges. The splitting blade has a splitting edge that is straight, and the splitting blade has a greater maximum vertical dimension than the maximum vertical dimension of the forming blades. The splitting edge of the first splitting blade is opposed to the splitting edge of the second splitting blade.

Abstract: A polishing head that can be disassembled and comprises a polishing cloth 1, sponge 2 and plastic base 3. The polishing cloth 1 is tightly pressed on the plastic base 3 by a sponge 2. The plastic base 3 is divided into one part with male threads and the other part with female threads. The two parts coordinate with each other to achieve dismantling or locking of the cloth and sponge to the base. When the polishing cloth is damaged, the plastic base can be unscrewed to change the damaged polishing cloth, while the base can be reused so as to reduce waste.

Abstract: A method of making a compound semiconductor substrate includes providing a GaN compound semiconductor single crystal ingot, and cutting the ingot with a cutter to form a GaN single crystal substrate. The cutting is performed while controlling a temperature in a contact portion between the ingot and the cutter to be not more than 160° C. such that a cut surface of the GaN single crystal substrate has an arithmetical mean waviness (Wa) not more than 9 ?m.

Abstract: An apparatus for supplying a constant amount of abrasive which can supply even dry ice particles, ice particles, or the like as abrasive in a constant amount is provided. In order to take out abrasive contained in measuring holes 21 of a rotating disc 20, an abrasive mixing section 40 for blowing a compressed gas into each of the measuring holes 21 has a cylinder 41? which opens toward one surface of the rotating disc at the position where the measuring holes are formed. A piston 43? is inserted into the cylinder. A fluid channel 45 opens toward the cylinder 41? through the intermediary of the rotating disc 20 and whose opening rim 45a is in sliding contact with another surface of the rotating disc 20. One of the cylinder 41? and the fluid channel 45 communicates with a compressed-gas supply source through the intermediary of a compressed-gas introduction path 52. The other one of the cylinder 41? and the fluid channel 45 communicates with the abrasive transport path 51.

Abstract: Disclosed is a flex-arm device including a base, at least one support block attached to the base, the support block including a shaft aperture, a shaft engaged with the shaft aperture of the support block, and a flex-arm mount attached to the shaft. When the device is in an unlocked orientation, the shaft is capable of rotation within the shaft aperture such that the flex-arm mount may be angularly displaced about multiple positions, and when the device is in a locked orientation, the shaft is restricted from rotation within the shaft aperture.

Abstract: The invention relates to a method and an arrangement for re-creation of an optimized contour of the leading edges of gas-turbine blades, in which a gas-turbine blade (2) is passed by one or more grinding machine or machines (71, 71?) with the aid of a computer-controlled robot (10). The desired contour is achieved by following a movement procedure which is stored in a data memory (21). The stored movement procedure is designed to convert a blade from a previously determined statistical mean wear state to a likewise previously determined or calculated design contour. The contact pressure of the gas-turbine blade on the grinding disk or disks (71, 71?) is measured and is taken into account in the movement procedure of the robot (10) such that the desired design contour is achieved irrespective of the initial contour and wear of the grinding disks.

Abstract: A linear, automated apparatus and method for clean, cost-effective, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials is presented, constructed principally from corrosion resistant stainless steel or nickel, enabling utilization of high purity water based abrasive slurry. The circular stainless steel or nickel lapping plate of the apparatus supports a synthetic nylon or rayon pad, whereby material is abraded from the workpiece primarily through the reciprocal, back and forth, linear movement of the workpiece holder, diametrically across the circular lapping plate, with intermittent rotation in step increments of the workpiece holder and affixed workpiece, tracing arcs of 180 degrees, first in a clockwise and subsequently counterclockwise direction.

Abstract: A grinding center for the simultaneous grinding of a plurality of main and rod bearings and/or central and end-side sections of crankshafts includes first and second stations. Two main bearing grinding spindles, of which the first is movable only in the Z-direction and the second only insignificantly movable in the X-direction, are mounted on a common rod bearing-compound slide. In the final phase of grinding, a correction of variations in size between the two processed rod bearings occurs via a separated drive of the second rod bearing-grinding spindle in accordance with a size or roundness correction. The variations are detected by measuring devices. An inclined profiled grinding wheel is provided for the grinding of the end sections.

Abstract: An apparatus and a method for forming or polishing a concave or convex radius surface on a work-piece is described herein. The apparatus includes a carrier that is configured to support a work-piece. A substantially hollow rotatable tool, which includes a circumferential surface for either forming or polishing the radius surface, is positioned adjacent the carrier. An axis of rotation of the tool is oriented at an oblique angle with respect to a longitudinal axis of the work-piece and a longitudinal axis of the carrier. Alternatively, the longitudinal axis of the work-piece may be laterally offset from the longitudinal axis of the carrier. The apparatus further includes provisions for rotating the hollow rotatable tool for forming or polishing a radius surface on the surface of the work-piece.

Abstract: Optical grade surfacing tool, including: a rigid support (60); an elastically compressible interface (12) attached to the rigid support (60); a flexible pad (13) adapted to be pressed against a surface (71) to be worked, attached to the interface (12) on the opposite side to the rigid support (60); and return spring elements (14) disposed between the rigid support (60) and a peripheral part (12b) of the interface (12); characterized in that the return spring elements (14) include a plurality of pairs of superposed elastically flexible blades (65, 66) that project transversely from the rigid support (60), respectively a first blade (65) having a distal portion cooperating in bearing engagement, through a first face, exclusively with the peripheral part (12b) of the interface (12), and a second blade (66) cooperating in bearing engagement with the first blade (65) via a second face opposite its first face.