Abstract: A chemical-mechanical polishing (CMP) apparatus for manufacturing a semiconductor device. The apparatus includes: a spin chuck for supporting and rotating a semiconductor wafer; a polisher comprising a polishing pad for planarizing a surface of the semiconductor wafer, the polisher moving along the surface of the semiconductor wafer by a polishing arm; and a polisher supporting device for supporting the polisher and maintaining the polisher in a horizontal state, while polishing an edge part of the surface of the semiconductor wafer, in order to improve polishing uniformity of a center part and the edge part of the semiconductor wafer. Accordingly, polishing uniformity of the center part and edge part of the semiconductor wafer may be improved, and a height of the polisher supporting device may be optimized according to a polishing degree. Also, the polisher may be easily supported, wear and tear of the support head may be minimized, and the support head may function as a conditioner.

Abstract: A method for polishing a vehicle wheel, the wheel includes a plurality of holes and a cylindrical rim. A polishing media storage tank holding abrasive media is vibrated to cause the medium to flow in an upwardly or downwardly vortex. The vehicle wheel is dipped into the medium such that the rim portion is disposed between the upward or downward flow of the medium, to polish the wheel.

Abstract: A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.

Abstract: A waterjet system for generating and delivering fluid jets suitable for processing a workpiece has a cutting head body and a mixing tube. The cutting head body includes a mixing chamber and a bore. The bore is positioned downstream of the mixing chamber, and an abrasive fluid jet from the mixing chamber passes through the mixing tube. The mixing tube has a first coupler adapted to magnetically couple the mixing tube to the cutting head body when the mixing tube is installed. The cutting head body has a second coupler positioned to engage the first coupler of the mixing tube to keep the mixing tube properly positioned during operation of the waterjet system.

Abstract: Stent, as well as a method and device for fabricating the stent, wherein the stent has a tubular lattice structure comprising individual struts and at least one strut of which at least one longitudinal section runs with at least one directional component in the radial circumferential direction of the stent, wherein the surface of the longitudinal section facing the outside of the stent is curved only about the longitudinal axis of the stent. According to the invention, the surface of longitudinal section of the strut, which surface faces the inside of the stent, has such a curvature that the strut cross section is fluidically optimized.

Abstract: An ultrasonic trimming method is composed of steps, driving a cutter blade having a flat plate shape and supported by an arm at an end of an articulated robot via an ultrasonic oscillator, the cutter blade being driven by the arm while the cutter blade is ultrasonically vibrated; cutting a workpiece secured by a workpiece securing portion; and during, operation for cutting, moving the cutter blade held attached to the articulated robot to the position at where the cutting edge is brought into contact with the grindstone, maintaining the cutter blades attitude such that a plane containing the cutting edge thereof contacts the grindstone, and grinding the cutter blade by pressing the cutter blade against a grinding member by the arm while the cutter blade is ultrasonically vibrated, the grinding member being disposed within a movable range of the cutter blade driven by the articulated robot.

Abstract: A sanding device for use with an abrasive sponge includes a base, at least one retaining mechanism, and at least one engaging mechanism. The base has opposite supporting and working surfaces, the working surface being shaped and sized for receiving the abrasive sponge. Each retaining mechanism is mountable onto the base, and is configured for removably securing a first portion of the abrasive sponge against the working surface of the base. Each engaging mechanism is mountable onto the base, and is configured for projecting out from the working surface so as to penetrate a second portion of the abrasive sponge when resting against the working surface of the base, each engaging mechanism being further configured so as to draw the second portion of the abrasive sponge away from the first portion.

Abstract: The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements.

Abstract: A cutter for cutting a workpiece while using a water includes a housing, an electric motor disposed in the housing, a rotation shaft, a base, and a splashboard. The rotation shaft is supported by the housing for rotatably supporting an end tool driven by the electric motor. The base supports the housing, and has a top surface and a bottom surface to be in contact with the workpiece. The end tool has a part protrudable from the bottom surface. The splashboard section is positioned on the top surface and behind the end tool in a cutting direction. The splashboard section protrudes in a direction away from the top surface and extends in a direction substantially parallel to an axial direction of the rotation shaft.

Abstract: A system for magnetorheological finishing of a substrate. An integrated fluid management module (IFMM) provides dynamic control of the rheological fluid properties of the MR fluid on a conventional MR finishing apparatus, and dispensing of the fluid to the wheel. A magnetically shielded chamber charged with MR fluid is in contact with the carrier wheel. A transverse line removes the spent MR fluid from the wheel as the ribbon leaves the work zone. Replenishment fluid is added to the chamber via a dripper, and preferably an electric mixer agitates MR fluid in the chamber. A grooved magnetically-shielded insert at the exit of the chamber forms a polishing ribbon on the carrier wheel as the wheel is turned. A sensor sensitive to concentration of magnetic particles provides a signal for control of MR fluid properties, particularly, water content in the MR fluid. Means is provided for cooling fluid within the chamber.

Abstract: A tool for moving an abrasive media can include a tool body and a drive system housed in the tool body. The drive system can include an output member. A retaining member can be disposed on the tool body. A first platen having a first attachment hub can be selectively coupled with the retaining member in an installed position. The first platen can have a first rotatable member that selectively attaches to the output member in a first mode of operation. A second platen having a second attachment hub can selectively couple with the retaining member in an installed position. The second platen can have a second rotatable member that selectively attaches to the output member in a second mode of operation.

Abstract: A sander according to the present application provides a sander with a rotatable plate which can be locked by hand. Specifically, the sander of the present application has a main body and a sanding head mounted below the main body. The main body has a housing, a motor and a coupling mechanism contained in the housing. The sanding head has a sanding plate rotatably connected to the base plate and the base plate and/or the sanding plate may be connected to the coupling mechanism. The base plate may also have a locking means to lock the sanding plate. The sanding head of the present application may also have a rotatable sanding plate to allow for more efficient use of the sanding paper and a locking means that can be used to lock the sanding plate to provide simpler, easier and more reliable manual locking.

Abstract: A cylindrical grinding and polishing device includes a main body defining a cavity, a polishing device, a cylindrical grinding device, a support device. The polishing device is received in the cavity, and includes a number of polishing wheels positioned along a first direction. The cylindrical grinding device is received in the cavity, and includes a grinding wheel positioned at an end of the cavity along a second direction substantially perpendicular to the first direction. The support device is received in the cavity, and includes a support plate for supporting a work-piece. The support device carries the work-piece to contact the polishing wheels or the grinding wheel.

Abstract: Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

Abstract: Embodiments described herein generally relate to the planarization of substrates. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus comprises a rotatable platen having a textured upper surface, at least one groove formed in the upper surface, and a pad disposed on the textured upper surface and bridging the at least one groove.

Abstract: The present invention provides a method of detecting and preventing grind burn from developing on a gear. The method includes performing acoustic emission testing while the gear is being ground during a grinding operation. The grinding wheel is evaluated during an eddy current test to detect material buildup on the grinding wheel which could cause grind burn. In addition, the method includes collecting swarf from the gear during the grinding operation and inspecting the swarf for an indication of grind burn.

Abstract: There is disclosed a grinding apparatus for fabrication of a liquid crystal display device that is adaptive for improving the adsorption defect of a substrate onto a substrate stage. A grinding apparatus for fabrication of a liquid crystal display device disclosed in the present invention includes a plurality of substrate stage configured to make a linearly bi-directional movement; first and second grinding parts disposed in a series at an area to which the substrate stage moves; first to third aligning parts disposed at both ends of the first and second grinding parts and therebetween; and first and second cleaning parts disposed between the first and second grinding parts and the first and second aligning parts so as to clean the substrate stage.

Abstract: A nozzle for a high pressure cutting arrangement is disclosed. The cutting arrangement comprises a liquid stream and a slurry stream, the slurry comprising abrasive particles suspended in a fluid, with both fluids being supplied into the nozzle under pressure. The nozzle has a combining chamber, having an entry region arranged to receive the liquid stream and the slurry stream, such that the pressure in the entry region is determined by the pressure in the liquid stream. The pressure in the entry region acts on the pressure in the slurry stream to regulate the pressure in the slurry stream.

Abstract: Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.

Abstract: An ultrasonic trimming apparatus is composed of an articulated robot, a cutting apparatus, and a grindstone. The cutting apparatus is composed of an ultrasonic oscillator supported by the end portion of the robot, a cutter blade which is supported by the ultrasonic oscillator, and a workpiece securing portion which secures a workpiece. The grindstone is disposed within the movable range of the cutter blade driven by the robot and is placed in a position at which the cutter blade can pressure contact the cutter blade. The cutter blade is ultrasonically vibrated by the ultrasonic oscillator and is ground while being pressed against the grindstone by means of the articulated robot. The ultrasonic trimming apparatus efficiently cuts a sheet material composed of soft material such as plastic, fabric, or rubber, a composite material, or a material containing glass fiber even when the material has a three-dimensional shape.