Abstract: A fan module is provided in this disclosure. The fan module comprises a fan and a casing. The casing accommodates the fan and includes a first cover and at least one second cover, the second cover is rotatably connected with the first cover at a first location or a second location. A portion of the fan exposed by the second cover at the first location is less than that at the second location.

Abstract: A PCD may include an active heat transfer system configured to transfer heat from the PCD to a docking device. The active heat transfer system may include a thermoelectric cooler, a heat pipe, or other heat transfer elements. The active heat transfer system may, based on temperature measurements, be activated when the PCD is coupled to the docking device.

Abstract: A quick release structure for bearing a display on a supporting stand is provided. The quick release structure comprises a bearing module and a housing module. The bearing module is disposed on the supporting stand, and comprises a first main board, a second main board, an accommodating space, a plurality of elastic members and an operating button. The elastic members are disposed in an accommodating space. The housing module is disposed on the display and comprises a housing and a plurality of limit columns being disposed on the housing. When the bearing module and the housing module are in an assembling status, the limit columns is penetrated the perforations and engaged with the corresponding elastic members, respectively; when an external force is applied to the operating button, the operating button is configured to deform the elastic members for detaching the limit columns from the elastic members.

Abstract: The laptop includes a host, a screen and a heat dissipation structure. The screen is pivotally connected to the host and includes a clamp member. The heat dissipation structure is connected to the host adjacent to where the screen is pivotally connected and covers a back of the host. The heat dissipation structure includes a back case body and a hatch cover. The back case body defines a heat dissipation opening. One side of the hatch cover is pivotally connected to the back case body. The hatch cover is set to match the heat dissipation opening. When the screen is closed with respect to the host, the clamp member urges the hatch cover to close the heat dissipation opening; when the screen is open with respect to the host, the clamp member is released from the hatch cover, and the hatch cover rotates to expose the heat dissipation opening.

Abstract: A cooling mount for portable electronic devices is provided that includes a cooling unit for preventing portable electronic devices housing the cooling mount from reaching critical temperatures during operation to avoid undesired shut down of the electronic device.

Abstract: In accordance with some aspects of the disclosure, a modular telecommunications patch panel system is shown and described. The panel can include a mounting frame extending between a first end and a second end, the mounting frame defining a plurality of apertures for receiving telecommunications components, a first mounting ear forming a snap-fit connection with the mounting frame first end, in a first orientation, and a second mounting ear, identical to the first mounting ear, forming a snap-fit connection with the mounting frame second end, in a second orientation.

Abstract: A heatsink (21) is disposed on a lower surface of a circuit board (10). The circuit board (10) has through holes (h1) that penetrate the circuit board (10) in an area (A) where an integrated circuit apparatus (5) is disposed. Heat conduction paths (11) are provided in the through holes (h1). The heat conduction paths (11) connect the integrated circuit apparatus 5 and the heatsink (21). This structure allows for disposition of a component different from the heatsink (21) on the same side as the integrated circuit apparatus (5), thus ensuring a higher degree of freedom in a component layout.

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.

Abstract: The present specification discloses systems, devices, and methods and uses provide a mounting system which includes rail and a bracket which is selectively secured to the rail. A bracket disclosed herein selectively and/or automatically secures or locks to a rail disclosed herein when positioned on the rail by actuating or triggering a locking mechanism disclosed herein to adopted a locked configuration. In addition, a bracket disclosed herein may be selectively removed from a rail by actuating or triggering a locking mechanism disclosed herein to adopted an unlocked configuration. The disclosed mounting systems, devices, and methods enable a device to be protected from impact and moisture exposure, enable a device to be securely mounted on a base, and/or enable a device to be quickly secured and removed from a base.

Abstract: An example apparatus comprising a heat dissipation mechanism and a controller to detect a temperature of a surface of the apparatus, in response to detecting that an audio output device is connected to the apparatus, determine a thermal profile, and instruct the heat dissipation mechanism to dissipate heat from the apparatus based on the thermal profile.

Abstract: A multi-media tablet holder is provided and includes a first retention member, a second retention member, a pair of slide pins, at least one extension spring and a handle. The first retention member includes a first retention plate and a first retention rail. The second retention member includes a second retention plate and a second retention rail. The first and second retention rails are sized to receive a thickness of a multi-media tablet. There is also provided a multi-media tablet holder including a retention member, a handle assembly and an articulating mechanism for pivoting and rotating the retention member relative to the handle assembly.

Abstract: An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.

Abstract: A dustproof device for laptops comprises a heat dissipating device disposed in a laptop to form a dustproof device for the same, wherein the heat dissipating device is disposed on a main computing unit in an interior of the laptop; the heat dissipating device includes a fan set and a heat dissipating fin. The fan set includes a housing, a rotating section and a guiding device, wherein on a lateral side of the housing is disposed an opening, the rotating section is disposed inside the housing, the guiding device is disposed inside the housing between the rotating section and a lateral side of the opening, and a dust removing path is formed between the guiding device and an inner wall surface of the housing adjacent to the guiding device.

Abstract: An electronic device including two bodies, at least one hinge assembly, and a hinge cover is provided. The two bodies are pivoted to each other through the hinge assembly. The hinge cover is connected between the two bodies and covers the hinge assembly. The hinge cover includes a plurality of shell parts, and the shell parts are movably connected to each other in sequence. The hinge cover has at least one first heat dissipation opening and at least one heat dissipation flow channel, and the at least one heat dissipation flow channel communicates the first heat dissipation opening and an inner space of at least one of the bodies.

Abstract: A fluid connector includes an adapter panel defining at least two mounting holes configured to be secured to a mounting rail of a server chassis. The fluid connector also includes an interior connector configured to fluidly communicate with a cooling module of a server, and a blind mate connector extending from the adapter panel and configured to fluidly connect with a port of a rack manifold.

Abstract: A kit for forming a data center comprising a first rack, a second rack, a first support having a first end and a second end opposite the first end, the first support configured to be secured to the floor at the first end, a cooling frame having a cooling unit received therein, the cooling frame having a first face and a second face opposite the first face, the cooling frame configured to be secured to the second end of the first support, a first distribution frame having a first plurality of support arms extending therefrom, the first distribution frame configured to be coupled to the first face of the cooling frame, and a second distribution frame having a second plurality of support arms extending therefrom, the second distribution frame configured to be coupled to the second face of the cooling frame.

Abstract: A labor-saving mainboard withdrawing structure for electronic devices is used for withdrawing a mainboard from a slot in a withdrawing direction, and the structure includes a fixed seat, a movable seat installed separately on both sides of the fixed seat and limited to move in the withdrawing direction only and having a space defined between the two movable seats for installing the mainboard, and a rail track disposed on an opposite side and extending along the withdrawing direction for slidably inserting the mainboard. Each movable seat has a pushing portion and a pushing member abutting against the mainboard, and each pushing member has a head provided for operator to push, and a tail abutting against the fixed seat, and the head can be pushed to move the tail pivotally, and when the tail is moved pivotally, the movable seat is pushed to move a retreat distance in the withdrawing direction relative to the fixed seat, so as to detach the mainboard from the slot by pushing the pushing portion.

Abstract: Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.

Abstract: Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.

Abstract: An active thermal management system for electronic devices comprises: a heat spreader having an internal channel; a thermally conductive body moveably positioned in the internal channel; and two or more electronic devices in thermal contact with a back surface of the heat spreader and positioned adjacent to the internal channel. A location of the thermally conductive body within the internal channel determines a path for heat flow from the back surface to a front surface of the heat spreader. The location of the thermally conductive body within the internal channel may be selected to minimize a temperature differential (?T) between the electronic devices.