Patents Examined by Michael A Matey
  • Patent number: 11570938
    Abstract: A display device includes a display panel, a back cover disposed on a rear surface of the display panel and including a plurality of layers, and a finishing portion disposed to surround at least a part of an outer side surface of the display panel and an outer side surface of the back cover. The back cover includes a first layer positioned on the rear surface of the display panel and disposed in an area including an area overlapping with the display panel, a second layer disposed apart from the first layer to oppose the first layer, and a core disposed between the first layer and the second layer.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 31, 2023
    Assignee: LG DISPLAY CO., LTD.
    Inventors: GyungBo Ha, HakMo Hwang, SunBok Song, Seeun Kim
  • Patent number: 11558957
    Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: January 17, 2023
    Assignees: Raytheon Company, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
    Inventors: David H. Altman, Christopher H. Peters, Gregory P. Schaefer, Philip M. Henault, Darin J. Sharar
  • Patent number: 11556149
    Abstract: An information handling system may include an organic light-emitting diode (OLED) display layer of a video display to display an image to a user; an A-cover forming a housing behind the OLED display layer; and a physically bifurcated display daughter board between the OLED display layer and the A-cover, the physically bifurcated display daughter board including: a first portion of the display daughter board including a source driver integrated circuit (IC) operatively coupled to a processor to receive graphics data; and a second portion of the display daughter board comprising a power management integrated circuit (PMIC) operatively coupled to the first portion and a power source; the second portion of the display daughter board being mechanically coupled to an interior surface of the A-cover to dissipate heat away from the OLED display layer.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: January 17, 2023
    Assignee: Dell Products, LP
    Inventors: Dan Odell Boice, Yu-Lung Lin, Yi-Fan Wang, Chao-Kai Huang
  • Patent number: 11558986
    Abstract: A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: January 17, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae-Eun Kim, Jeungsoo Kim, Junghoon Kim
  • Patent number: 11553625
    Abstract: A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: January 10, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun Chang, Shih-Hsuan Hu, Wei-Cheng Tseng, Cheng-Feng Tsai
  • Patent number: 11547017
    Abstract: A cooling module reduces the number of parts and achieves weight reduction. An electronic apparatus includes: the cooling module; a chassis; first and second heating elements provided inside the chassis; and a cooling module configured to absorb heat generated by the first and second heating elements. The cooling module includes: a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate having an outer shape larger than that of the first metal plate; a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: January 3, 2023
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Akinori Uchino, Takuroh Kamimura, Hiroshi Yamazaki, Masayuki Amano
  • Patent number: 11547015
    Abstract: A notebook cooler with a pressurizing function comprises a cooler body and one or more soft sealing elements detachably disposed on the cooler body. A notebook is placed on the soft sealing element, an airtight space is defined by the bottom of the notebook, the soft selling element and the cooler body, and a cooling fan is disposed in the airtight space. The circular soft sealing element is laid on the notebook cooler, so that an airtight space is defined by the bottom of the notebook, the soft sealing element and the cooler body; a turbofan sucks air from the bottom of the cooler and presses the air into the airtight space; and the cooler can press air into the notebook via cooling holes in the bottom of the notebook to effectively accelerate air circulation in the notebook, so that elements in the notebook can be rapidly cooled.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: January 3, 2023
    Inventor: Xihua Zhong
  • Patent number: 11540417
    Abstract: The invention provides a sounding device. The sounding device comprises a housing body with an accommodating space, a one-way inlet valve and a one-way outlet valve. A speaker unit partitions the accommodating space into a front cavity and a back cavity. The one-way inlet valve communicates the outside and the back cavity and is used for introducing air into the back cavity. The one-way outlet valve communicates the back cavity and the outside and is used for discharging the air in the back cavity outside. A first through hole communicating the outside and the back cavity is formed in the housing body. The invention also provides a mobile terminal. Compared with the related art, the sounding device and the mobile terminal of the invention have better reliability and better performance.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: December 27, 2022
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Xingzhi Huang, Lin Liu, Dijiang Tong, Zhe Zhang, Jun Wu, Zhichen Chen, Zhaoyu Yin
  • Patent number: 11540418
    Abstract: A method for cooling a display assembly includes forcibly circulating gas about an airflow pathway extending within a housing and surrounding an image assembly. Forcibly ingesting ambient air into the housing through an intake, passing the ingested ambient air within the housing in a manner which provides thermal interaction with the circulating gas in said airflow pathway, and exhausting the ingested ambient air from the housing through an exhaust to cool the circulating gas.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: December 27, 2022
    Assignee: Manufacturing Resources International, Inc.
    Inventors: William Dunn, Tim Hubbard
  • Patent number: 11528987
    Abstract: A portable computing tablet holster comprising a handle assembly attached to a portable computing tablet retention assembly. The portable computing tablet retention assembly is adapted to retain a portable computing tablet therein using a pair of elongated retention channels extending along opposite elongated edges of a tablet rear support panel. The tablet is retained by a lateral retention channel extending along a lateral edge and at least one flexible retention element located proximate an opposite lateral edge thereof. The handle assembly can be rigidly fixed to the rear panel or moveably assembled to the rear panel. Movement between the handle and the rear panel can include a sliding movement, a rotating movement, and/or a pivoting movement. A user input device can be integrated into the handle for controlling at least one of a light and/or a camera integrated into the holster, the tablet, and the like.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: December 20, 2022
    Inventor: Dimitri Girault
  • Patent number: 11526201
    Abstract: A panel bottom sheet includes: a first heat dissipation layer; a second heat dissipation layer having circumferential side surfaces located further inside than circumferential side surfaces of the first heat dissipation layer in a plan view, the second heat dissipation layer including: a main heat dissipation pattern including a first opening formed completely through the second heat dissipation layer in a thickness direction; and a heat dissipation substrate disposed directly on the second heat dissipation layer.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: December 13, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kang Woo Lee, Boo Kan Ki, June Hyoung Park, Sun Hee Oh, Dong Hyeon Lee, Jeong In Lee, Hyuk Hwan Kim, Seong Sik Choi
  • Patent number: 11520386
    Abstract: An electronic device includes a case for housing electronics. A fan is supported within the case. The fan includes a motor configured to drive fan blades and to generate an electromagnetic charging field. The motor is positioned to provide the charging field to an open area outside the case comprising a charging pad.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: December 6, 2022
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Robert J. Kapinos, Scott Wentao Li, Robert James Norton, Jr., Russell Speight Vanblon
  • Patent number: 11520389
    Abstract: Disclosed herein are systems and methods of determining a maximum allowable air temperature limit for closed loop (CL) control of the inlet boundary or threshold temperature of a given computer expansion slot that contains a particular mating expansion card. The maximum allowable air temperature limit may be determined for closed loop control of the expansion slot inlet boundary temperature by using reverse correlation of an open loop (OL) cooling tier curve that has been designated for open loop control of cooling air velocity provided to the particular expansion card of the given expansion slot. The reverse correlation may be performed in further view of the particular expansion slot airflow characteristics (e.g., maximum expansion slot airflow velocity capacity or limit) corresponding to a expansion card received in a given expansion slot.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: December 6, 2022
    Assignee: Dell Products L.P.
    Inventors: Hasnain Shabbir, Hui Chen
  • Patent number: 11520391
    Abstract: A cryptocurrency mining rig comprising an ac/dc power supply for providing power to a mining machine includes power-handling circuitry and a passive heat-dissipation system that passively dissipates heat generated by the power-handling circuitry. The passive heat-dissipation system comprises a housing that encloses that power-handling circuitry and a thermal network that provides thermal communication between the power-handling circuitry and faces of the housing.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: December 6, 2022
    Assignee: AA Power Inc.
    Inventor: Qun Lu
  • Patent number: 11513573
    Abstract: A system includes a display panel, a temperature sensor configured to measure a temperature of the display panel, a thermoelectric device coupled to the display panel and configured to transfer heat to or from the display panel, and a controller electrically coupled to the temperature sensor and the thermoelectric device. The controller is configured to receive the measured temperature of the display panel and, based on the measured temperature of the display panel, send a second signal to the thermoelectric device to cause the thermoelectric device to remove a first quantity of heat from the display panel or send a third signal to the thermoelectric device to cause the thermoelectric device to provide a second quantity of heat to the display panel.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: November 29, 2022
    Assignee: META PLATFORMS TECHNOLOGIES, LLC
    Inventors: Min Hyuk Choi, Zhiming Zhuang, Kyung Won Park
  • Patent number: 11507154
    Abstract: A keyboard assembly for a portable information handing system. The keyboard assembly includes a plurality of keys, the plurality of keys being arranged in a typewriter style layout to allow a user to enter text content into the portable information handling system; and, a keyboard carrier, the plurality of keys being mounted to the keyboard carrier, the keyboard carrier determining when a key of the plurality of keys is actuated and generating information regarding the key of the plurality of keys, the keyboard carrier comprising a venting portion, the venting portion being located beneath a set of keys of the plurality of keys, the venting portion comprising a plurality of venting apertures.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: November 22, 2022
    Assignee: Dell Products L.P.
    Inventors: Mark Andrew Schwager, Travis C. North, Yu-Feng Huang, Kai-Yuan Cheng
  • Patent number: 11503740
    Abstract: An information handling system having a heat exchanger positioned near and in thermally-conductive conduct with an electrical, heat-generating component of the information handling system, such as a central processing unit or graphics processing unit. A fan directs air across the heat exchanger to cool the electrical component by convection. A first portion of the heat pipe may be in direct physical contact with the electrical component and a second portion of the heat pipe may be in thermal contact with the electrical component and the first portion and in direct physical contact with an additional heat exchanger. The fan may direct air across both heat exchangers to cool the electrical component.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: November 15, 2022
    Assignee: Dell Products L.P.
    Inventors: Qinghong He, Patrick Hampton
  • Patent number: 11483949
    Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: October 25, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Nicholas Keehn, Robert Jason Lankston, Husam Alissa
  • Patent number: 11474571
    Abstract: A display panel module and an electronic device is provided, the display pane module including a plurality of display panel modules. According to the disclosure, an electronic device comprises: a housing, a cover glass, a plurality of display panels disposed adjacent to a rear surface of the cover glass in the housing, a plurality of first heat dissipation plates disposed adjacent to rear surfaces of the plurality of display panels in the housing, a plurality of power/data reception circuit boards disposed adjacent to rear surfaces of the plurality of first heat dissipation plates in the housing, a support configured to support at least a portion of the plurality of power/data reception circuit boards, and a power/data transmission circuit board having at least a portion contacting and supported by the support and spaced apart by a predetermined distance from the plurality of power/data reception circuit boards in a space provided by the support.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seogyong Jeong, Junhyeong Park, Jaehyuck Shin, Youngho Ryu, Byeongguk Choi, Sungku Yeo, Chongmin Lee
  • Patent number: 11477911
    Abstract: A thermal module with a heat pipe configured on a first portion having a constant cross-section thickness and a tapered second end configured for contact with a fin stack. The heat pipe is tapered along a length of the second portion such that the cross-section thickness of the heat pipe decreases toward the end of the heat pipe. A fin stack coupled to the tapered portion comprises a plurality of fins of different heights, wherein the fin heights increase such that the combined fin height and heat pipe cross-section thickness remains approximately constant over the width of the fin stack. The tapered heat pipe and fin stack with fins with increasing fin heights provide increased cooling and decreased airflow impedance through the fin stack.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: October 18, 2022
    Assignee: Dell Products L.P.
    Inventor: Qinghong He