Abstract: In accordance with the present invention, a display apparatus 8 comprises a color CRT 10 having an evacuated envelope 11 with a faceplate panel 12 sealed to one end of a funnel 15 that is closed at the other end by a neck 14. The faceplate panel has a luminescent screen 22 on an interior surface thereof. A shadow mask 25 is located in proximity to the screen. The shadow mask comprises a metal sheet having a central portion and an exterior portion with a plurality of apertures 40, 43 therethrough. An electron gun 26 is disposed within the neck for generating and directing electron beams 28 toward the screen. A deflection yoke 30 is disposed around the envelope at the junction of the neck and the funnel. The yoke deflects the beams to scan a raster across the screen.

Abstract: The durable mask includes a polyimide layer formed over a portion of a semiconductor substrate to be masked. A heavy metal layer is then formed over the polyimide layer. An adhesion layer is formed between the polyimide layer and the heavy metal layer to insure adhesion of the heavy metal layer to the polyimide layer. The durable mask may mask, for example, a heterojunction bipolar transistor formed in the semiconductor substrate prior to an ion implantation process. Furthermore, the mask is removed from the substrate by eliminating the adhesion between the mask and substrate or by dissolving the polyimide layer.

Abstract: Described are methods for making, and resultant structures of, a field emission display with soft luminescence and a comfortable image for a viewer of the display. The field emission display is formed with a baseplate and an opposing face plate. Field emission microtips are formed in openings in a conductive and insulating layer on the baseplate. An anode is formed on either the faceplate, or on the conductive layer surrounding each opening. Phosphorescent material is formed over the anode. A blocking layer is formed between the phosphor and the faceplate, such that during operation of the display direct light emission from the phosphor is blocked, resulting in indirect phosphorescence and a more comfortable display image. An optional reflective layer may be added over the conductive layer to increase phosphorescence.

Abstract: A method of making a patterned conductive textile is provided by depositing a conductive polymer film on the fabric to provide a resistivity of 1000 ohms per square or less, coating selected areas of the fabric with a protective film, to protect the conductive polymer from a chemical etching agent, to provide an oxygen barrier and to retain areas of high conductivity, applying a chemical etching agent to the fabric thereby degrading the conductive polymer film on areas of the fabric which have not been coated with the protective film and create areas of low conductivity and rinsing the fabric to remove any residual etching agent.

Abstract: A method for making a microlens comprising the steps of uniformly distributing a volume of Poly(methylmethacrylate) (PMMA) across a major surface of a substrate, hardening the PMMA layer on the substrate surface, patterning the PMMA layer and forming patterned PMMA and reflowing the patterned PMMA to form at least one microlens on the substrate.

Abstract: A phase shift structure and a method for forming the phase shift structure are provided. The phase shift structure includes: a transparent substrate; a phase shifter etched into the substrate; and a pair of opaque members formed on the substrate on either side of the phase shifter. The phase shift structure is adapted to print an isolated linear feature such as an isolated line for a semiconductor integrated circuit. During a lithographic process using the phase shift structure, the inside edges of the opaque members do not print due to the effect of the phase shifter. The longitudinal edges of the printed feature correspond to the outside edges of the opaque members. The width of the phase shifter can be adjusted to minimize light leakage in the interior of the printed feature.

Abstract: A retractable probe system (12) senses in situ a plurality of predetermined process parameters of a wafer (24) fabrication environment (16) and includes a sensing device (47) for sensing the predetermined process parameters, a probe arm (46) for holding sensing device (47) and having sufficient length to extend sensing device (47) into a predetermined location of the fabrication environment (16). A housing (36) receives the sensing device (47) and probe arm (46). A locator mechanism (52, 42, and 44) controllably locates sensing device 47) and probe arm (46) within fabrication environment (16) and within housing (36). An isolator mechanism (34) isolates sensing device (47) and probe arm (46) within housing (36) and essentially out of gases communication with fabrication environment (16). Cleaning mechanism (54) cleanses sensing device (47) within housing (36) and permits sensing device (47) to be immediately thereafter located in fabrication environment (16).

Abstract: A surface having exposed doped silicon dioxide such as BPSG is cleaned with a solution that etches thermal oxide at least one-third as fast as it etches the exposed doped silicon dioxide, resulting in more thorough cleaning with less removal of the exposed doped silicon dioxide. Specific applications to formation of container capacitors are disclosed. Preferred cleaning solutions include about 46 parts ammonium fluoride, about 9.5 parts hydrogen fluoride, and about 8.5 parts ammonium hydroxide in about 100 parts water by weight; and about 670 parts ammonium fluoride and about 3 parts hydrogen fluoride in about 1000 parts water by weight. The latter solution is also useful in cleaning methods in which a refractory metal silicide is exposed to the cleaning solution such as in cleaning prior to spacer formation or prior to a gate stack contact fill, in which case about 670 parts ammonium fluoride and about 1.6 parts hydrogen fluoride in about 1000 parts water is most preferred.

Abstract: A metallic sheet (10) is laminated between a pair of photoresist layers (26, 30) having different properties which permit one photoresist (26) to be stripped from the metallic sheet, substantially without effecting the other photoresist (30). A thin gauge blank or article (56) is photo-chemically machined from the lamination and the photoresist (26) is stripped from one side, leaving the other photoresist (30) to provide electrical insulation on just one side of the article.

Abstract: An apparatus and process for limiting residue remaining after the etching of metal in a semiconductor manufacturing process by injecting a halogen-containing gas without a plasma into a processing chamber. The wafer is then exposed to the remnants of the halogen-containing gas in the chamber before the metal is deposited on the wafer. The exposure can occur in the same chamber as the metal deposition, or a different chamber. The wafer can remain in the chamber or be moved to another chamber for etching after exposure and deposition.

Abstract: An aperture grill for a cathode ray tube is formed with parallel slits by etching a cold-rolled low-carbon steel plate from the opposite sides thereof. Before carrying out the etching, the steel plate is subjected to an annealing step whereby the residual stress is reduced to 7.0 Kg/mm.sup.2 or less. The steel plate is also subjected to a tensile force for imparting a tension in the direction of the rolling of a hoop steel from which the steel plate is produced. Furthermore, the steel plate is so oriented that the direction of tapes of the aperture grill to be produced will coincide with the rolling direction. The above process makes it possible to prevent occurrence of "streaks" and improves the quality of images generated on the cathode ray tube.

Abstract: A flexible and efficient bulk micromachining method for fabricating a novel microstructure that is bounded by substantially planar surfaces meeting only at substantially right angle corner features. The novel microstructure of the present invention is useful as a spacer in assembly processes where high accuracy is required, such as precise positioning of optical fibers or conductors. In the preferred embodiment, the microstructure of the present invention includes a shelf feature disposed along a height dimension of the microstructure, which is required for some applications.The bulk micromachining method of the present invention includes providing a first substrate having a top planar surface and an opposing planar surface. The opposing surface of the substrate is anisotropically etched to provide a first thinned region. The top surface of the first substrate is anisotropically etched so that a first recessed feature having a vertical side is made integral with the first thinned region.

Abstract: The supporting plate and the bulk removal, transport and storage fixture for small batch-fabricated devices (1) have openings (2) penetrating from the top side (3) to the bottom side (4) of the plate and raised retaining means (5) on the bottom side (4). The raised retaining means (5) are provided in sufficient number and are arranged according to the shape of the devices (1) for retaining the devices. Flange means (7) which are designed for providing vacuum or agents to the devices (1) on the supporting plate are connected to the supporting plate thus forming a fixture. By changing the arrangement of the raised retaining means (5) and/or the openings (2) the supporting plate and the fixture may easily be adapted to different sizes and kinds of devices.

Abstract: Undercutting of conductive lines in a dense array bordered by an open field is avoided by reducing the severity of etching when the conductive material in the open field is substantially removed. In a preferred embodiment, the flow rate of chlorine gas is reduced during high density chlorine plasma etching of a conductive pattern when the conductive material is substantially removed from the open field.

Abstract: A micromechanical structure is etched on a component that has been introduced into a container having a plurality of inlet and discharge openings. The liquid etchant is displaced downwardly through a liquid discharge at the underside of the container by admitting water through the liquid inlet at the upper side, whereby no turbulence occurs in the liquid flow. The water employed as a rinsing agent is displaced by a liquid having a lower density such as, for example, ethanol or acetone. Finally, a liquefied gas, for example liquid carbon dioxide, is admitted via the liquid, this gas is evaporated by heating the container above the critical temperature, the pressure in the inside of the container is reduced to the ambient air pressure by opening a gas discharge, and the component is removed from the container through a sluice or lock.

Abstract: An improved method of manufacturing is provided for making an improved merged MR head. The method employs a photoresist mask with appropriately-sized openings for simultaneously etching numerous vias to various depths over a set time period. After formation of the vias, a single photoresist mask is employed to pattern in one step gap layers G3, G2, G1 and a first shield layer S1 to the desired lateral configuration for the merged MR head. Subsequent to patterning these thin film layers, double insulation layers I2 and I3 are individually soft baked on top of the coil structure of the head followed by patterning of the layers I2/I3 by a single photoresist mask. These layers are then hard baked to retain the desired smooth configuration of the layers. The improved merged MR head has a smooth configuration to its top pole piece P2 because of the smooth configuration of the I2/I3 layer so that flux leakage and saturation problems are minimized.

Abstract: The present invention relates to a process for removing a protective coating from a surface of an airfoil which process comprises the steps of providing an airfoil having a protective coating to be removed and critical areas which require protection during a coating removal step and masking these critical areas by applying an ultraviolet curable masking material to the critical areas of the airfoil. The process of the present invention further comprises the steps of curing the UV curable masking material using ultraviolet radiation and stripping the protective coating from unmasked portions of the airfoil.

Abstract: A non-photolithographic, physical patterning process, which is useful for selectively etching of a substrate, is provided. The process comprises electrostatically charging liquid droplets which are selectively etchable with respect to the substrate, dispersing the droplets onto substrate in a pattern; and etching the substrate using the droplets as a mask.

Abstract: A magneto-resistance effect type thin-film magnetic head for detecting reproduced signals by the magneto-resistance effect, which is suitable for detecting reproduced signals by magneto-resistance effects, is disclosed. The thin-film magnetic head includes a two-layered magneto-resistance effect element made up of a first magneto-resistance effect film and a second magneto-resistance effect film of substantially the same width as the first magneto-resistance effect film, layered with a non-magnetic insulating film in-between. Since the magneto-static coupling is produced between the first and second MR films, the magnetic state between the first and second MR films is stabilized. The film thickness contributing to the playback output can be reduced as in the case of a single-layer magnetic head constituted by a single-layer MR film for realizing a high playback output.

Abstract: A method for fabricating a water-repellent surface, including steps of preparing a mixture by mixing a curable liquid with a needle-like material, applying the mixture onto a surface of an object, curing a liquid of the applied mixture and forming an applied layer in which the needle-like material has been mixed on a base material of the cured liquid of the mixture, forming pits and projections of the needle-like material on a surface of the applied layer by etching the applied layer under a condition where an etching rate of the base material is larger than that of the needle-like material, and coating the surface of the applied layer with a water-repellent substance.