Abstract: A thermosetting resin composition which includes an epoxy-containing component and a curing agent component containing a cyclohexanetricarboxylic anhydride. The cured product of the thermosetting resin composition is excellent in surface hardness, solvent resistance, transparency, and adhesion to substrate, and is useful as a surface protection layer of the substrate.

Abstract: The present invention provides a coating composition, a process for producing the same, one or more coating layers derived therefrom, and articles comprising one or more such coating layers. The coating composition according to the present invention comprises: (a) from 10 to 90 percent by weight of an aqueous, high-solid, solvent-free alkyd dispersion comprising: (i) from 40 to 70 percent by weight of one or more alkyds based on the total weight of the dispersion, wherein each said one or more alkyds has an acid value of less than 20 and a molecular weight (Mn) in the range of greater than 1000 Dalton; (ii) from less than 10 percent by weight of one or more surfactants, based on the total weight of the dispersion; and (iii) from 30 to 55 percent by weight of water, based on the total weight of the dispersion; wherein said aqueous, high-solid, solvent-free alkyd dispersion has an average particle size diameter in the range of from 0.

Abstract: The invention provides high solids epoxy-based autodeposition coating materials that have improved moisture barrier properties and/or anti-corrosive properties and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimizes the need for process solvents. A hydrophobic water barrier enhancing agent, epoxy pre-polymer and ethylenically unsaturated monomer, as an alternative to organic solvent, are combined to yield an epoxy pre-polymer-monomer-hydrophobic water barrier enhancing agent blend, which may be blended with other coating components and additives. The resulting blend is then dispersed in water with surfactant and the ethylenically unsaturated monomer is polymerized (in the presence of other formulation components) to yield a dispersion. The dispersion may then be used as one component of a coating formulation. The coating formulation can then be applied to materials and cured to form a final coating.

Abstract: A polymerizable composition and a manufacturing method thereof are provided, in which the composition is capable of meeting requirements of overcoming decrease in production yield of a resin composed of a thioepoxy compound, the decrease being caused by variations in refractive index, hue, and optical strain. In a polymerizable composition containing a compound having at least one structure represented by the above formula (where R1 represents a hydrocarbon having 1 to 10 carbon atoms, R2, R3, and R4 each represent a hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom.), the total of a thioepoxy compound A, which has at least one structure represented by formula (2) and at least one structure represented by formula (3), and a thioepoxy compound B, which has at least one structure represented by formula (4) and at least one structure represented by formula (3), is 4 mass percent or less with respect to the total mass of the polymerizable composition.

Abstract: A slip-resistant coating composition comprising (i) a binder comprising a polyepoxide and a polyamine; (ii) a micaceous pigment selected from the group consisting of mica and micaceous iron oxide and blends thereof; (iii) at least one other pigment; wherein the micaceous pigment is present at a level of at least 4% PVC based on total volume solids and wherein the total PVC of the coating is at least 35%. The slip-resistant coating would have a slip coefficient of at least 0.50 after cure and is especially useful in the manufacture of structural joints.

Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.

Abstract: The invention relates to an aerosol can containing a two-component paint with an aerosol preparation, in particular for use in the automotive industry and for automotive repairs. Said aerosol can contains a binding agent component and a curing component. The binding agent component contains a curable epoxy parent component, solvents and a propellant and the curing component contains a cross-linking agent, which is suitable for curing the epoxy binding agent. The curing component is housed separately from the binding agent component in a cross-linking casing, which is located in the aerosol paint can and can be activated externally.

Abstract: An aqueous coating material comprising at least one epoxy resin as binder and at least one polyamine as curing agent, wherein said epoxy resin or at least one of the epoxy resins (i) is solid per se at room temperature and/or is present in a powder coating material, and (ii) the solid epoxy resin and/or the epoxy resin powder coating material is or are present in fine dispersion in an aqueous dispersion comprising the polyamine or polyamines; and the use of the aqueous coating material to produce antistonechip primers.

Abstract: The invention concerns a coating for a smoothing and/or polishing element, particularly a flexible grinding wheel, provided with a flexible abrasive insert, for smoothing and polishing stone material, consisting essentially of: a blend of epoxy resin and polysulfide; a thixotrope; primary amines; and synthetic diamond treated by a polyvinyl-formal primer.

Abstract: A coolant-resistant and thermally stable primer composition comprising an organic-functional silane, preferably the reaction product of at least one amino-functional silane and at least one isocyanato-functional silane, is provided. The primer composition may additionally comprise a phenoxy resin, a phenolic resin and talc. A method for bonding an elastomer to a metal also is provided.

Abstract: The present invention provides a curable alkanolamine containing epoxy powder coating composition comprising at least one epoxy resin, at least one alkanolamine, a curing agent in an amount effective to cure the coating and optionally at least one zinc borate compound. Further, the present invention provides a method of cathode corrosion protection which includes the steps of subjecting a metal substrate to a mechanical treatment, applying the curable alkanolamine containing epoxy powder coating composition to the surface of the metal substrate, and polarizing the coated material as a cathode. The present invention also relates to a process for making and applying the alkanolamine containing epoxy powder coating compositions of the present invention.

Abstract: A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), and monofunctional or polyfunctional epoxide compounds as curatives. The monofunctional or polyfunctional epoxide compound is stirred, preferably in the liquid state, into the aqueous polymer dispersion. Besides the epoxide compound, the heat-curable binder may further comprise a polyol or an alkanolamine as hardener.

Abstract: The cyclohexanetricarboxylic monoester of the present invention is represented by the following formula 1: wherein R is as defined in the specification. The cyclohexanetricarboxylic monoester is useful particularly as the curing agent for epoxy-containing compounds. A heat-curable resin composition comprising the cyclohexanetricarboxylic monoester and an epoxy-containing compound exhibits an excellent curability without using a curing accelerator and provides a colorless transparent cured product which is little discolored even under a long-term exposure to high-temperature conditions. Such a heat-curable resin composition is suitable as sealing materials for photoelectric transducers such as blue LED and white LED, shaped articles, coating materials, adhesives, etc.

Abstract: The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the non-flammable heat-resistant resin composition, exerts a storage elastic modulus of 700 MPa or less, a coefficient of thermal expansion of 5×10?3/K or less and an internal stress of 20 MPa or less, in a temperature range of 25 to 250° C., and the present invention also relates to an adhesive film using the resin composition.

Abstract: A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide selected from the group consisting of oxides of metal atoms belonging to Group III and Group IV of the Periodic Table excluding silicon; a semiconductor device comprising a wiring circuit board, a semiconductor element, and the above resin composition; and a method for manufacturing a semiconductor device comprising the steps of adhering a resin sheet comprising the resin composition of claim 1 and a stripping sheet to a semiconductor circuit side of a bump-mounting wafer, removing the stripping sheet leaving only the resin composition to the wafer, and cutting the wafer into individual chips.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: The invention relates to addition compounds suitable for use as wetting agents and dispersants and obtainable by reacting monofunctional or polyfunctional aromatic epoxides with polyoxyalkylenemonoamines having a number-average molecular weight of >400 g/mol, one primary or secondary amino group and at least 4 ether oxygen atoms per molecule, from 90 to 100% of the epoxide groups of the starting material having undergone reaction, the weight fraction of aromatic groups in the addition compounds being not more than 50% and the addition compounds containing per molecule at least one amino group on which salts can be formed, or being present as a salt. The invention also relates to a process for preparing the addition compounds, to their use as wetting agents and/or dispersants and to pigments or fillers coated with the addition compounds and to pigment pastes which comprise pigments, binders and the addition compounds of the invention.

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: A silicone rubber coating composition which cures into a silicone rubber having a tear strength of 25-50 kN/m and a peeling bond strength of 30-60 N/cm is suited for coating of hollow weave type air bags. A hollow weave type air bag coated with the coating composition can be instantaneously inflated while the bag prevents the silicone rubber film from being peeled from the base fabric, eliminates inflating gas leakage, and retains an acceptable inflation time.

Abstract: Using a chrome plating bath containing organic sulfonic acid, plating is conducted by application of a pulse current to thereby form a crack-free lower chrome layer on a steel substrate. The lower chrome layer has a compressive residual stress of 100 MPa or more and a crystal grain size of from 9 nm to less than 16 nm. Subsequently, by application of a direct current, a cracked upper chrome layer is formed on the lower chrome layer, to thereby obtain a chrome plated part. The lower chrome layer imparts the chrome plated part with heat resistance and corrosion resistance, and the upper chrome layer imparts the chrome plated part with wear resistance and good sliding properties.