Patents Examined by Michael J. Feely
  • Patent number: 10730998
    Abstract: The invention relates to novel curable bio-based thermosetting compositions of a) at least one highly-functional bio-based epoxy resin; and b) at least one carboxylic acid crosslinker selected from the group consisting of a water-soluble multifunctional carboxylic acid, a dicarboxylic acid oligomer from a melt reaction between a diol and a dicarboxylic acid or its anhydride, and mixtures thereof and which are curable with water, an alcohol or a water and alcohol mixture. The bio-based thermosets of the invention may be free of VOCs and/or organic solvents. The bio-based thermosets of the invention can be used to form coatings, composites, adhesives, and films. Methods of making the bio-based thermosets of the invention are disclosed as are coating compositions and coated objects, such as coatings, composites, adhesives, and films, using the bio-based thermosets of the invention.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: August 4, 2020
    Inventors: Dean C. Webster, Songqi Ma
  • Patent number: 10730846
    Abstract: A method of producing an epoxy compound, which comprises reacting hydrogen peroxide with a compound having a carbon-carbon double bond, in the presence of at least one of a tungsten compound and a molybdenum compound; and an onium salt comprising 20 or more carbon atoms and one or more of substituents convertible to a functional group containing an active hydrogen or a salt thereof.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: August 4, 2020
    Inventors: Akemi Hosokawa, Haruhiko Kusaka
  • Patent number: 10723912
    Abstract: Various embodiments provide epoxy modified fluorinated urethane compositions that may provide desirable bulk mechanical properties of conventional coatings, adhesives, or structural matrix resins, while simultaneously exhibiting surface properties that may reduce surface contamination. Various embodiments provide formulations comprising epoxy modified fluorinated alkyl ether including urethane oligomer or polymer resins that may possess the requisite thermal, mechanical, chemical, and optical properties while achieving a low surface energy. In various embodiments, such resins may be prepared from random urethane oligomer compositions including fluorinated alkyl ether segments, in which the oligomers may be terminated with amino groups and subsequently reacted with epoxy including monomers or oligomers.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: July 28, 2020
    Inventors: Jereme R. Doss, John W. Connell, Christopher J. Wohl, Jr.
  • Patent number: 10723684
    Abstract: A compound is provided according to structure 4, (4) wherein n has a value from 0 to 48 and Z is hydroxyl or a benzene ring bearing substituents R11-R15, wherein R1-R15 are each individually selected from the group consisting of H, allyl, alkyl, alkoxy, phenyl, phenoxy, halide, hydroxyl, glycidyl, (meth)acryloyl, 3-(meth)acryloyl-2-hydroxy-1-propoxy, 2,3-epoxypropyl, maleate, and structure (a) wherein at least one of R1-R5, at least one of R6-R10, and at least one of R11-R15 is hydroxyl or an ether or ester derived from it and one of the R6-R10 groups is replaced by a direct bond to the CXY group.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: July 28, 2020
    Inventors: Kaleigh Havery Reno, Joseph Francis Stanzione, III, Richard Patrick Wool, Joshua M. Sadler, John Joseph Lascala, Eric David Hernandez
  • Patent number: 10717808
    Abstract: Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: July 21, 2020
    Inventor: Ian Aspin
  • Patent number: 10711154
    Abstract: An hydrophobic epoxy resin composition including at least one ortho-substituted glycidyl ether, at least one ortho, ortho?-disubstituted glycidyl ether, at least one ortho, meta?-disubstituted glycidyl ether, at least one amine/aniline curing agent, and at least one organic solvent.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: July 14, 2020
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Joseph W. Tsang, Michael Garrison
  • Patent number: 10703854
    Abstract: An epoxy composition may comprise a resin composition comprising a diglycidyl ether of bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The resin composition may further comprise at least one diglycidyl ether of bisphenol A and bisphenol F.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: July 7, 2020
    Assignee: Raytheon Technologies Corporation
    Inventors: Eli Cole Warren, Peter J. Walsh
  • Patent number: 10696820
    Abstract: A multiple component thermosetting epoxy resin composition comprising (A) at least one cycloaliphatic glycidyl-type epoxy resin without an ester group, (B) at least one curing agent selected from the group aliphatic amine, cycloaliphatic amine, and dicyandiamide, and (C) at least one silanized filler, which, in particular, is suitable for the manufacture of outdoor insulation system articles for electrical engineering by casting, potting, encapsulation, and impregnation processes, wherein said articles exhibit good mechanical, electrical and dielectrical properties, and can be used as insulators, bushings, switchgears and instrument transformers.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: June 30, 2020
    Inventors: Christian Beisele, Zhijian Liu, Hongyan Chen, Satoru Hishikawa
  • Patent number: 10696783
    Abstract: A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: June 30, 2020
    Inventors: Chen-Hsi Cheng, Ming-Hung Huang
  • Patent number: 10696805
    Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener or an acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: June 30, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
  • Patent number: 10683441
    Abstract: A curable adhesive composition includes a curable epoxy resin, an amine curing agent, a toughening agent, and aluminum flakes. The aluminum flakes include a fatty acid milling aid on at least a portion of their surfaces. The aluminum flakes were heated after milling. An article includes an adhesive composition cured between at least two members. The cured adhesive composition includes the heat-treated aluminum flakes within a toughened epoxy resin cured with an amine curing agent. The method includes applying the curable adhesive composition of described above to a surface of at least one of two or more members, joining the members so that the curable adhesive composition is sandwiched between the two or more members, and curing the curable adhesive composition to form an adhesive bond between the two or more members.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: June 16, 2020
    Assignee: 3M Innovative Properties Company
    Inventors: Jay S. Schlechte, Peyton R. Nosbusch, George M. Stout, Michael A. Kropp
  • Patent number: 10682732
    Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: June 16, 2020
    Inventors: Ramakrishna Hosur Venkatagiriyappa, Morgana De Avila Ribas, Barun Das, Harish Hanchina Siddappa, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Rahul Raut, Ranjit Pandher
  • Patent number: 10682791
    Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: June 16, 2020
    Assignee: Cytec Industries Inc.
    Inventors: Jonathan E. Meegan, Olivia Denman, Marco Aurilia
  • Patent number: 10676837
    Abstract: An electrocoating composition and a coating formed from the composition are described herein. The electrocoating composition includes at least an epoxy resin component, an isocyanate-functional component and a silica-based additive. The coating shows about 40 to 70% reduction in edge corrosion relative to a conventional coating.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: June 9, 2020
    Assignee: SWIMC LLC
    Inventor: Jill Tersteeg
  • Patent number: 10662325
    Abstract: The present invention relates to a polymer composition comprising a thermoplastic polyester and a propylene-based elastomer, wherein the propylene-based elastomer comprises propylene-derived units and 5 to 30 wt % of ?-olefin-derived units, and has a melting temperature of less than 120° C. and a heat of fusion of less than 75 J/g.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: May 26, 2020
    Assignee: ExxonMobil Chemical Patents Inc.
    Inventors: Ying Ying Sun, Yi Ping Ni, Pei Te Bao, Yi Zhou Shi, Xiaoyun Wang
  • Patent number: 10662281
    Abstract: A curable resin composition containing: (a) at least one resin; and (b) curative selected from the group consisting of (i) a mixture of at least one low temperature curative and at least one high temperature curative or (ii) a curative that has a low temperature curative part and a high temperature curative part wherein the amount of the low temperature curative is sufficient to cause enough resin-curative addition reaction to effect B-staging in the full resin-curative formulation, the amount of the high temperature curative is sufficient to cause the resin to cure catalytically but insufficient to cause resin-curative addition reaction in the final cure, and the ratio of the resin (a) to the curative (b) is greater than or equal to about 5. The present composition may be used to make prepregs for automotive or aerospace application.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 26, 2020
    Inventor: Ian Aspin
  • Patent number: 10647897
    Abstract: The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. an epoxy resin; ii. a filler material; iii. an epoxy-based reactive diluent; and iv. optionally, a core-shell polymer toughening agent; and wherein the amount of filler material is selected such as to provide the part (B) with a hysteresis area of at least 30 Pa×1/s, when measured at 23 C according to the test method described in the experimental section.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: May 12, 2020
    Assignee: 3M Innovative Properties Company
    Inventor: Mareike Bardts
  • Patent number: 10647849
    Abstract: The present invention provides an epoxy resin composition comprising at least the following component [A], component [B] and component [C], the epoxy resin composition being characterized in that: the mixture of component [A] and component [B] is a mixture that, when temperature is increased at 2° C./min, begins to thicken at temperature (T1) and completes thickening at temperature (T2), temperature (T1) being 80-110° C. and temperature (T1) and temperature (T2) satisfying the relationship of expression (1) 5° C.?(T2?T1)?20° C. expression (1); and the mixture of component [A] and component [C] is a mixture that, when temperature is increased at 2° C./min, begins to cure at temperature (T3), temperature (T1) and temperature (T3) satisfying the relationship of expression (2) 5° C.?(T3?T1)?80° C. expression (2). Component [A]: epoxy resin Component [B]: thickening particle Component [C]: curing agent.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: May 12, 2020
    Assignee: TOHO TENAX CO., LTD.
    Inventors: Toru Kaneko, Yuko Okano
  • Patent number: 10647875
    Abstract: Provided is a thermally curable coating composition for alloy substrates, comprising: curable components, comprising an epoxy resin and a multifunctional (meth)acrylate; latent curing agents, which crosslink with the curable components upon heating, and comprise an isocyanate having at least two NCO groups and an amino resin; a curing promoter, comprising an aromatic phosphate comprising at least one hydroxy group connected with the phosphorous atom; and an organic solvent. Also provided are a method for providing a coating layer onto an alloy substrate and a coating layer thus obtained.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: May 12, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yong-Jun Li, Steven Zhu, Army Zhang, Herbert Liu
  • Patent number: 10647835
    Abstract: This disclosure relates to wear-resistant rubber compositions, such as those, for example, comprising at least one hydroxy-terminated polybutadiene, at least one natural rubber, at least one polymerization accelerant; at least one sulfur; and at least one polybutadiene, wherein the wear-resistant rubber composition may have an effective cross-linking density of at least about 30×10?5 moles/cm3.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: May 12, 2020
    Assignee: Weir Slurry Group, Inc.
    Inventors: Francisco A. Gozalo, Sanford W. Clark, Tham Meng, Timothy Lane