Patents Examined by Michael J. Feely
  • Patent number: 11453788
    Abstract: Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: September 27, 2022
    Assignee: PPG Industries Ohio, Inc.
    Inventors: David N. Walters, John R. Schneider
  • Patent number: 11453738
    Abstract: An organic-inorganic hybrid material is disclosure. The organic inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 27, 2022
    Assignee: CHANDA CHEMICAL CORP.
    Inventors: Sheng-hong A. Dai, Chien-Hsin Wu, Ying-Chi Huang, Yu-Hsiang Huang, Shih-Chieh Yeh, Ru-Jong Jeng, Jau-Hsiang Yang
  • Patent number: 11447626
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: September 20, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Patent number: 11441027
    Abstract: The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties, and a prepreg and fiber-reinforced composite material using the epoxy resin composition. An embodiment of the epoxy resin composition according to the present invention which achieves the purpose contains all components [A]-[C]. [A]: A reactive diluent having a specific structure and a viscosity of 2 Pa·s or less at 25° C. [B]: An epoxy resin having three of more functional groups. [C]: An amine-based curing agent having a specific structure.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 13, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Akihiko Ito, Hiroaki Sakata
  • Patent number: 11414527
    Abstract: Described herein are articles and methods of making articles, including a transparent composite film having a fiber filler embedded in a polymer network and further including a hard coating. The polymer network of the film is a cured, cross-linked matrix. The hard coating is a cross-linked aromatic urethane acrylate oligomer and a photoinitiator and provides a flexible protective layer that maintains good hardness, puncture-resistance and scratch-resistance.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: August 16, 2022
    Assignee: Corning Incorporated
    Inventors: Jun Hou, Kevin Robert McCarthy
  • Patent number: 11414542
    Abstract: The invention relates to an impregnation resin mixture and to the use thereof. In one embodiment, an impregnation resin mixture includes a) at least one epoxide resin component selected from the group consisting of polyepoxides based on bisphenol A and/or F, and advancement resin produced therefrom, based on epoxidized halogenated bisphenols and/or epoxidized novolaks and/or polyepoxide esters based on phthalic acid, hexahydrophthalic acid, or based on terephthalic acid, epoxidized polyaddition products from dicyclopentadiene and phenol or cycloaliphatic compounds, b) as reactive diluents, 2 to 30 wt. % lactones with respect to the sum of the epoxy resin components, c) BCI3 and/or BCI3 complexes and/or a compound selected from the group of imidazoles and d) optionally additional additives, wherein the impregnation resin mixture does not contain any carboxylic acid anhydrides.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: August 16, 2022
    Inventors: Gunda Kuhlmann, Christoph Scheuer, Panagiotis Saltapidas
  • Patent number: 11407895
    Abstract: A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: August 9, 2022
    Assignee: ELITE MATERIAL CO., LTD.
    Inventor: Ching-Hsien Hsu
  • Patent number: 11390742
    Abstract: This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present invention exhibits fast curing property under UV light and has improved adhesion strength after being further heated.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: July 19, 2022
    Assignee: Henkel AG & Co. KGaA
    Inventors: Chunfu Chen, Bin Li, Chao Wang, Shuichi Iwasaki, Masao Kanari
  • Patent number: 11384211
    Abstract: An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: July 12, 2022
    Assignee: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Kazuya Eto, Yuki Nobuzawa, Isao Kurata, Shinkichi Murakami
  • Patent number: 11377530
    Abstract: A bonding method for joining two structural parts using a curable adhesive layer having a fibrous veil embedded therein. The fibrous veil carries a polymeric binder, which is in a solid phase at room temperature (20° C.-25° C.) and is capable of dissolving into the adhesive composition during curing thereof.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: July 5, 2022
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Leonard Macadams, Dalip K. Kohli
  • Patent number: 11377519
    Abstract: A method of increasing the glass transition point of a cured epoxy comprising a bisphenol A diglycidyl ether and a polyetheramine includes the step of including 1,8-diamino-p-menthane as an additional hardener for curing the epoxy. An epoxy formulation includes bisphenol A diglycidyl ether and a hardener including a polyetheramine and 1,8-diamino-p-menthane.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: July 5, 2022
    Assignee: Space Exploration Technologies Corp.
    Inventors: Wenhong Fan, Ryan Christopher Kennett, Joshua James Conlon
  • Patent number: 11377518
    Abstract: Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: July 5, 2022
    Assignee: LG Chem, Ltd.
    Inventors: So Young Kim, Seung Min Lee, Se Woo Yang
  • Patent number: 11370876
    Abstract: The present invention relates to a low-alkylphenol composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups that are both part of an organic ring system, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, to processes for production thereof and to the use thereof.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: June 28, 2022
    Assignee: Evonik Operations GmbH
    Inventors: Emmanouil Spyrou, Dirk Fuchsmann, Britta Kohlstruk, Annette Sandkühler
  • Patent number: 11370877
    Abstract: The present invention relates to a composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups which are both part of an organic ring system, and c) at least one salt of a very strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, and to processes for production thereof and use thereof.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: June 28, 2022
    Assignee: Evonik Operations GmbH
    Inventors: Emmanouil Spyrou, Susanne Kreischer, Andrea Diesveld, Holger Loesch
  • Patent number: 11370875
    Abstract: The present invention relates to a polyol composition for obtaining a polyurethane foam through a reaction with a polyisocyanate compound. The polyol composition comprises a polyol, a catalyst, a foam stabilizer, a foaming agent, and ammonium carboxylate, wherein the ammonium carboxylate has a quaternary ammonium cation as a cationic moiety, and a carboxylic acid anion represented by formula (1) as an anionic moiety.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: June 28, 2022
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventor: Tomonori Kajita
  • Patent number: 11359048
    Abstract: The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I) in which R1 to R4 is H or an organic radical, with the proviso that at least one of the R1, R2, R3 and R4 radicals ?H, and X?—(Y1)m-(A1)n-(Y2)o-(A2)p-(Y3)q-(A3)r-(Y4)s—??(II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A1, A2, A3=alkylene or alkenylene radical and Y1, Y2, Y3, Y4?NR5, PR5, O or S, where R5 independently=organic radical, where any two organic radicals selected from R1 to R5 and any radicals present in the alkylene and/or alkenylene radicals A1, A2, A3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R1 to R5 present and any radicals present in the alkylene and/or alkenylene radicals A1, A2, A3 is substituted by at least one —NHR6 or —NH2 group, where R6=organic radical, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-co
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: June 14, 2022
    Assignee: Evonik Operations GmbH
    Inventors: Emmanouil Spyrou, Dirk Fuchsmann, Britta Kohlstruk, Annette Sandkühler
  • Patent number: 11345780
    Abstract: A thermoplastic polyester resin composition includes a thermoplastic polyester resin (A), an epoxy compound (B) having an epoxy equivalent of from 200 to 3,000 g/eq, and a hydroxy group-containing resin (C) having a number average molecular weight of from 2,000 to 500,000 and a halogen element content of 1,000 ppm or less, wherein the epoxy compound (B) is blended in an amount of from 0.05 to 10 parts by weight with respect to 100 parts by weight in total of 70 to 99.9 parts by weight of the thermoplastic polyester resin (A) and 0.1 to 30 parts by weight of the hydroxy group-containing resin (C). The thermoplastic resin composition and a molded article achieve both long-term hydrolysis resistance and heat aging resistance at a high level, and can further suppress bleed-out to the surface of the molded article during heat-dry and heat-moisture treatments.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: May 31, 2022
    Assignee: Toray Industries, Inc.
    Inventors: Kenichi Okunaga, Yusuke Tojo, Makito Yokoe, Hideyuki Umetsu
  • Patent number: 11345777
    Abstract: Provided are an epoxy resin composition, a prepreg, a resin sheet, and a carbon fiber-reinforced composite material, which have high heat resistance, a high elastic modulus, low water absorption, and excellent flame resistance. This epoxy resin is a para-cresol novolac epoxy resin represented by General formula (1), in which a content ratio of components represented by n=1 as measured by gel permeation chromatography is less than 10% by area, and a content ratio of components represented by n=2 as measured by gel permeation chromatography is at least 1% by area and less than 40% by area. (In the formula, plural R's each independently represent a C1-6 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: May 31, 2022
    Assignee: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Yusuke Kawano, Masataka Nakanishi, Kazuma Inoue
  • Patent number: 11345808
    Abstract: The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014?(content of component [D]/content of component [C])?0.045, [b]: 0.9?(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])?1.2, and [c]: 14?(content of component [A]/content of component [C])?25.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: May 31, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Eiki Takahashi, Daisuke Konishi, Masayuki Miyoshi, Noriyuki Hirano
  • Patent number: 11332607
    Abstract: Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic or non-polymeric organic phosphorous containing fire retardant; and from 1 to 30% by weight of the formulation of a curative system are provided. The formulations are particularly suitable for producing aircraft interior composite components having good fire retarding properties, low smoke emission, low smoke toxicity and low heat release properties. The formulations also have excellent processing and mechanical properties. Further components may be included in the compositions to improve various properties, including the fire retarding, low smoke emission, low smoke toxicity and low heat release properties and to also further improve the processing and mechanical properties, including toughness.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: May 17, 2022
    Assignee: HEXCEL COMPOSITES LIMITED
    Inventor: Dana Blair