Abstract: The present invention provides a silicon carbide composite wafer and a manufacturing method thereof. The silicon carbide composite wafer includes (a) a silicon carbide material and (b) a wafer substrate, and the upper surface of the wafer substrate is bonded to the lower surface of the silicon carbide material, wherein the lower surface of the silicon carbide material and/or the upper surface of the wafer substrate undergo a surface modification, thereby allowing the silicon carbide material to be bonded to the wafer substrate directly and firmly. The technical effects of the present invention include achieving strong bonding between the wafer and the substrate, reducing manufacturing process, increasing yield rate, and achieving high industrial applicability.

Abstract: A polymeric handle material for a personal care implement comprises a polymer base material, and a filler material, preferably an inorganic filler material, wherein the polymer base material is selected from the group of polyamide, styrene acrylonitrile resin, polybutylene terephthalate, polyethylene terephthalate, recycled plastic materials, or mixtures thereof, and wherein the filler material constitutes from about 50 wt % to about 80 wt %, preferably from about 70 wt % to about 75 wt %, of the polymeric handle material.

Abstract: The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requires high throughput and where resin formulations having consistent handling characteristics (e.g., tack and flexibility) would be preferable across normal to elevated laminating environments (as defined by temperatures between 20° C. and 60° C.). The present invention further relates to a manufacturing process for preparing an article, particularly a molded article, from a fiber-reinforced composite material comprising a rapid-curing resin formulation.

Abstract: The present disclosure relates to a potting adhesive, including: a component A and a component B, the component A including a first liquid organic adhesive containing dimethyl siloxane, the component B including a second liquid organic adhesive containing methyl hydrogen siloxane and silicone oil, at least one of the component A and the component B further including ceramic particles which are spherical particles with a particle size of 0.1 mm to 3 mm. The present disclosure further relates to a heat dissipation device, including an adhesive potting groove, a transformer provided in the adhesive potting groove, and a filling medium which fills and is consolidated in a gap between the transformer and the adhesive potting groove.

Abstract: A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.

Abstract: A method for producing a radiation-sensitive resin composition includes a step 1 of putting at least a resin having a polarity that increases by an action of an acid, a photoacid generator, and a solvent into a stirring tank, and a step 2 of producing a radiation-sensitive resin composition by stirring and mixing the resin having a polarity that increases by the action of an acid, the photoacid generator, and the solvent in the stirring tank under a gas having an inert gas concentration of 90% by volume or more, in which in the step 2, an atmospheric pressure inside the stirring tank is higher than an atmospheric pressure outside the stirring tank, and in the step 2, a difference between the atmospheric pressure inside the stirring tank and the atmospheric pressure outside the stirring tank is 2.0 kPa or less.

Abstract: A solid crosslinked polyester composition is disclosed wherein the crosslinked polyester is environmentally degradable in less than about 180 days. The crosslinked polyester is the polyesterification reaction product between one or more multi-hydroxylic alcohols, one or more hydroxy acids, and one or more multi-carboxylic acid compounds. Alternately, the crosslinked polyester is the polyesterification reaction product between one or more multi-hydroxylic alcohols, one or more hydroxy acids, one or more multi-carboxylic acid compounds, and a cyclic ester.

Abstract: An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

Abstract: A first oriented film comprising a first polyethylene composition which comprises: from 20 to 50 wt % of a first linear low density polyethylene polymer having a density greater than 0.925 g/cc and an I2 lower than 2 g/10 min; and from 80 to 50 wt % of a second linear low density polyethylene polymer having a density lower than or equal to 0.925 g/cc and an I2 greater than or equal to 2 g/10 min; wherein the first polyethylene composition has an I2 from 0.5 to 10 g/10 min and a density from 0.910 to 0.940 g/cc is provided.

Abstract: (1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and (2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20° C./minute.

Abstract: The present invention relates to a hot-melt adhesive composition comprising at least one polyester polyol based on Betulin and at least one NCO-terminated compound as well as a method for the production of a laminated article using the inventive hot-melt adhesive composition.

Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

Abstract: A laminate production method is provided which can sufficiently prevent the occurrence of blocking without causing deterioration in the outstanding characteristics of acrylic block copolymers such as adhesive performance, and can also ensure excellent processability during extrusion.

Abstract: Disclosed is a method of preparing a carboxylic acid modified-nitrile based copolymer latex including: initiating emulsion polymerization of a monomer mixture including a conjugated diene-based monomer, ethylenic unsaturated nitrile-based monomer, ethylenic unsaturated acid monomer, and water-soluble monomer in the presence of water and 0.01 to 0.1 parts by weight of a lipid-soluble initiator based on 100 parts by weight of total of monomer mixture, and at a weight ratio (M/W) of the monomer mixture to water of 1.1 to 1.4 (S10); adding water when the polymerization conversion rate is 30 to 40% at a weight ratio (M/W) of 0.8 to 1.0 (S20); and adding water when the polymerization conversion rate is 60 to 70% at a weight ratio (M/W) of 0.6 to 0.7 (S30), when the polymerization conversion rate is between ?10% and <60%, 0.1 to 2.0 parts by weight of sodium naphthalene sulfonate formaldehyde condensate based on 100 parts by weight of the total monomer mixture is introduced.

Abstract: An object of the present invention is to provide a compound suitable for use as a latent curing agent, which does not produce an aldehyde compound when caused to react with an isocyanate compound. The present invention provides, as the compound, a silylamine compound represented by the following formula (1): in the formula (1), R1 to R12 each independently represent an alkyl group having 1 to 6 carbon atoms, R13 represents an alkylene group having 2 to 12 carbon atoms or an arylene group having 6 to 12 carbon atoms, R14 to R21 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, “y” and “z” each independently represent an integer of from 1 to 11, and “n” represents an integer of from 1 to 43.

Abstract: Getter composition to be used for controlling the amount of moisture and organic gases in sealed electronic or optoelectronic devices, said composition comprising a blend of first getter and second getter powders in a weight ratio comprised between 0.1 and 5.0, wherein the first getter is polyphenylene oxide (PPO) or Poly(2,6-diphenyl-p-phenylene oxide) (PPPO) and the second getter is a Faujasite (FAU) zeolite or a mixture of a Faujasite (FAU) zeolite and a Linde Type A (LTA) zeolite with a ratio comprised between 0.1 and 5.0. The invention also relates to a dispensable paste comprising a resin and the getter composition.

Abstract: Disclosed are an intumescent fire-retardant coating with ultra-high corrosion resistance and a preparation method thereof. The fire-retardant coating is composed by water, wetting and dispersing agent, defoaming agent, composite carbon-forming catalyst, composite blowing agent, pentaerythritol, titanium dioxide, Mg(OH)2, mica powder, kaolin, anti-rust pigment, aluminum tripolyphosphate, VAE emulsion, freeze-thaw agent, film-forming aid, and thickener. On the basis of the existing fire-retardant coatings, the present disclosure adds a series of anti-corrosion, heat insulation fillers and salt spray resistance additives to achieve a certain salt spray resistance effect. The fire-retardant coating of the present disclosure has both fire-retardant and anticorrosive functions, does not contain organic solvents, is low in price, has high construction tolerance, and has broad application prospects in the field of intumescent fire-retardant coatings.

Abstract: A water-soluble film is provided that is capable of achieving deformation resistance during pouch storage as well as excellent water solubility of the film and excellent reduction in undissolved residues. A water-soluble film includes a polyvinyl alcohol-based resin, wherein a crystal long period Ds obtained from an X-ray profile obtained by small-angle X-ray scattering measurement in a water/methanol mixed solvent (volume ratio: 2/8) is from 10.0 to 30.0 nm and a rate of increase (DS?Da)/Da of the crystal long period Ds to a crystal long period Da obtained by small-angle X-ray scattering measurement before immersion in the solvent is 30% or more and 130% or less.

Abstract: A nonlimiting example method of forming highly spherical carbon nanomaterial-graft-polyamide (CNM-g-polyamide) polymer particles may comprising: mixing a mixture comprising: (a) carbon nanomaterial-graft-polyamide (CNM-g-polyamide), wherein the CNM-g-polyamide particles comprises: a polyamide grafted to a carbon nanomaterial, (b) a carrier fluid that is immiscible with the polyamide of the CNM-g-polyamide, optionally (c) a thermoplastic polymer not grafted to a CNM, and optionally (d) an emulsion stabilizer at a temperature greater than a melting point or softening temperature of the polyamide of the CNM-g-polyamide and the thermoplastic polymer, when included, and at a shear rate sufficiently high to disperse the CNM-g-polyamide in the carrier fluid; cooling the mixture to below the melting point or softening temperature to form CNM-g-polyamide particles; and separating the CNM-g-polyamide particles from the carrier fluid.

Abstract: A polyisocyanate resin can include from 25 wt % to 50 wt % of a first cycloaliphatic polyisocyanate and from 50 wt % to 75 wt % of a flexibilizing component based on a total weight of the polyisocyanate resin. The flexibilizing component can include a linear aliphatic polyisocyanate having a number average isocyanate functionality of from 2 to 3 based on gel permeation chromatography and an isocyanate-terminated reaction product of a second cycloaliphatic polyisocyanate and an isocyanate-reactive material, the reaction product having a Tg of less than ?30° C. based on a Differential Scanning calorimetry (2nd Heating) temperature scan from ?100° ° C. to 150° C. using 20° C./min heating and cooling ramps. The isocyanate-terminated reaction product and the linear aliphatic polyisocyanate can be present at a weight ratio of from 0.5 to 2.5.