Abstract: The present invention relates to an epoxy resin system containing an epoxy resin and a mono-alkylated diamine. The epoxy resin system can further contain a second amine. The present invention also relates to a method for producing an epoxy resin system comprising combining an epoxy resin with a mono-alkylated diamine. The mono-alkylated diamines of this invention enhance desirable processing and cured properties of epoxy resin compositions without the negative impact on mechanical properties in the cured product normally seen with cycloaliphatic amine-based curing agents.

Abstract: This disclosure relates to wear-resistant rubber compositions, such as those, for example, comprising at least one hydroxy-terminated polybutadiene, at least one natural rubber, at least one polymerization accelerant; at least one sulfur; and at least one polybutadiene, wherein the wear-resistant rubber composition may have an effective cross-linking density of at least about 30×10?5 moles/cm3.

Abstract: Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.

Abstract: An organic-inorganic hybrid material is disclosure. The organic inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.

Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.

Abstract: The purpose of the present invention is to provide an epoxy resin composition which has excellent viscosity stability, and when cured, can provide a resin cured product which has high flame retardancy and excellent mechanical properties, and a prepreg and fiber-reinforced composite material using the epoxy resin composition. An embodiment of the epoxy resin composition according to the present invention which achieves the purpose contains all components [A]-[C]. [A]: A reactive diluent having a specific structure and a viscosity of 2 Pa·s or less at 25° C. [B]: An epoxy resin having three of more functional groups. [C]: An amine-based curing agent having a specific structure.

Abstract: Described herein are articles and methods of making articles, including a transparent composite film having a fiber filler embedded in a polymer network and further including a hard coating. The polymer network of the film is a cured, cross-linked matrix. The hard coating is a cross-linked aromatic urethane acrylate oligomer and a photoinitiator and provides a flexible protective layer that maintains good hardness, puncture-resistance and scratch-resistance.

Abstract: The invention relates to an impregnation resin mixture and to the use thereof. In one embodiment, an impregnation resin mixture includes a) at least one epoxide resin component selected from the group consisting of polyepoxides based on bisphenol A and/or F, and advancement resin produced therefrom, based on epoxidized halogenated bisphenols and/or epoxidized novolaks and/or polyepoxide esters based on phthalic acid, hexahydrophthalic acid, or based on terephthalic acid, epoxidized polyaddition products from dicyclopentadiene and phenol or cycloaliphatic compounds, b) as reactive diluents, 2 to 30 wt. % lactones with respect to the sum of the epoxy resin components, c) BCI3 and/or BCI3 complexes and/or a compound selected from the group of imidazoles and d) optionally additional additives, wherein the impregnation resin mixture does not contain any carboxylic acid anhydrides.

Abstract: A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

Abstract: This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present invention exhibits fast curing property under UV light and has improved adhesion strength after being further heated.

Abstract: An in-situ polymerized type thermoplastic prepreg is provided, which is excellent in productivity, has tack properties and drape properties that allow easy shaping in a mold, is excellent in handling properties, and allows a molded product obtained by curing to have both mechanical properties as high as those of a thermosetting composite and the features of the thermoplastic composite. An in-situ polymerized type thermoplastic prepreg 1 includes reinforcing fibers 2 and an in-situ polymerized type thermoplastic epoxy resin 3 as a matrix resin. The in-situ polymerized type thermoplastic epoxy resin 3 is cured to B-stage, with the weight-average molecular weight being 6,000 or less, and has tack properties and drape properties at 30° C. or less, and the in-situ polymerized type thermoplastic epoxy resin after curing has a weight-average molecular weight of 30,000 or more.

Abstract: A method of increasing the glass transition point of a cured epoxy comprising a bisphenol A diglycidyl ether and a polyetheramine includes the step of including 1,8-diamino-p-menthane as an additional hardener for curing the epoxy. An epoxy formulation includes bisphenol A diglycidyl ether and a hardener including a polyetheramine and 1,8-diamino-p-menthane.

Abstract: Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.

Abstract: A bonding method for joining two structural parts using a curable adhesive layer having a fibrous veil embedded therein. The fibrous veil carries a polymeric binder, which is in a solid phase at room temperature (20° C.-25° C.) and is capable of dissolving into the adhesive composition during curing thereof.

Abstract: The present invention relates to a polyol composition for obtaining a polyurethane foam through a reaction with a polyisocyanate compound. The polyol composition comprises a polyol, a catalyst, a foam stabilizer, a foaming agent, and ammonium carboxylate, wherein the ammonium carboxylate has a quaternary ammonium cation as a cationic moiety, and a carboxylic acid anion represented by formula (1) as an anionic moiety.

Abstract: The present invention relates to a composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups which are both part of an organic ring system, and c) at least one salt of a very strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, and to processes for production thereof and use thereof.

Abstract: The present invention relates to a low-alkylphenol composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups that are both part of an organic ring system, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, to processes for production thereof and to the use thereof.

Abstract: The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I) in which R1 to R4 is H or an organic radical, with the proviso that at least one of the R1, R2, R3 and R4 radicals ?H, and X?—(Y1)m-(A1)n-(Y2)o-(A2)p-(Y3)q-(A3)r-(Y4)s—??(II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A1, A2, A3=alkylene or alkenylene radical and Y1, Y2, Y3, Y4?NR5, PR5, O or S, where R5 independently=organic radical, where any two organic radicals selected from R1 to R5 and any radicals present in the alkylene and/or alkenylene radicals A1, A2, A3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R1 to R5 present and any radicals present in the alkylene and/or alkenylene radicals A1, A2, A3 is substituted by at least one —NHR6 or —NH2 group, where R6=organic radical, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-co

Abstract: Provided are an epoxy resin composition, a prepreg, a resin sheet, and a carbon fiber-reinforced composite material, which have high heat resistance, a high elastic modulus, low water absorption, and excellent flame resistance. This epoxy resin is a para-cresol novolac epoxy resin represented by General formula (1), in which a content ratio of components represented by n=1 as measured by gel permeation chromatography is less than 10% by area, and a content ratio of components represented by n=2 as measured by gel permeation chromatography is at least 1% by area and less than 40% by area. (In the formula, plural R's each independently represent a C1-6 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.

Abstract: A thermoplastic polyester resin composition includes a thermoplastic polyester resin (A), an epoxy compound (B) having an epoxy equivalent of from 200 to 3,000 g/eq, and a hydroxy group-containing resin (C) having a number average molecular weight of from 2,000 to 500,000 and a halogen element content of 1,000 ppm or less, wherein the epoxy compound (B) is blended in an amount of from 0.05 to 10 parts by weight with respect to 100 parts by weight in total of 70 to 99.9 parts by weight of the thermoplastic polyester resin (A) and 0.1 to 30 parts by weight of the hydroxy group-containing resin (C). The thermoplastic resin composition and a molded article achieve both long-term hydrolysis resistance and heat aging resistance at a high level, and can further suppress bleed-out to the surface of the molded article during heat-dry and heat-moisture treatments.