Patents Examined by Michael J. Feely
  • Patent number: 10308757
    Abstract: A two-component curable epoxy resin system having an epoxy component containing a unique combination of two or more epoxy resins with at least one of the epoxy resins being an epoxy novolac type resin. The composite made from such resin system exhibits high glass transition temperature.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: June 4, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Timothy A. Morley, Rainer Koeniger, Nebojsa Jelic, Rolf Hueppi, Zeljko Sikman
  • Patent number: 10308822
    Abstract: An object to be solved by the present invention is to discover a thermosetting coating composition ensuring an excellent finished appearance without a decrease in corrosion resistance, and to provide a coated article with such excellent coating performances. The present invention provides a thermosetting coating composition, comprising a modified epoxy resin (A) resulting from a reaction of an epoxy resin (a1) with a modifier (a2), and optionally with an amine compound (a4); and a blocked polyisocyanate compound (B), the modified epoxy resin (A) comprising, at least in a part of the terminals thereof, a specific organic group, and having a number average molecular weight of 800 to 80,000.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: June 4, 2019
    Assignee: KANSAI PAINT CO., LTD.
    Inventors: Tsuneaki Hori, Masami Kobata
  • Patent number: 10308594
    Abstract: The present invention provides, among others, compounds of Formula (I) or a salt thereof, methods for making these compounds, degradable polymers and reinforced composites made therefrom, and methods for degrading and/or recycling the degradable polymers and reinforced composites.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: June 4, 2019
    Assignee: Adesso Advanced Materials Wuhu Co., Ltd.
    Inventors: Bing Qin, Xin Li, Bo Liang
  • Patent number: 10308803
    Abstract: A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C): (A) a silicone-modified epoxy resin having a cyclic siloxane structure, (B) a silicone-modified epoxy resin having a branched siloxane structure, and (C) an epoxy resin curing agent containing a polyvalent carboxylic acid having a tricyclodecane structure and a carboxylic anhydride compound.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 4, 2019
    Assignees: Shin-Etsu Chemical Co., Ltd., Nippon Kayaku Kabuhiki Kaisha
    Inventors: Toshio Shiobara, Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada, Chie Sasaki
  • Patent number: 10301471
    Abstract: The present invention provides a curable resin composition having excellent fluidity and giving a cured product having excellent physical properties such as heat resistance, moisture resistance/solder resistance, flame retardance, and dielectric characteristics. The curable resin composition contains a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) at such a ratio that when the total number of moles of the benzoxazine structure of the structural formula (A1) is ?, and the number of moles of epoxy groups in the epoxy resin (B) is ?, a ratio [?/?] is 0.1 to 0.5.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: May 28, 2019
    Assignee: DIC Corporation
    Inventors: Tomohiro Shimono, Kazuo Arita
  • Patent number: 10301517
    Abstract: A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions: (I-I) the minimum modulus is no greater than 104 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 105 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: May 28, 2019
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Akinori Inoue, Shozo Takada
  • Patent number: 10294366
    Abstract: The present invention is a crystalline polyamide resin composition, comprising 100 parts by mass of a crystalline polyamide resin and 1 to 10 part(s) by mass of a modified polyolefin resin. The crystalline polyamide resin composition of the present invention can provide a molded product which has so excellent sliding durability that changes in surface appearance against repeated slidings for tens of thousands times with high load are small and which has excellent mechanical strength and moldability, while keeping excellent characteristics inherent to a crystalline polyamide resin.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: May 21, 2019
    Assignee: TOYOBO CO., LTD.
    Inventor: Tomohide Nakagawa
  • Patent number: 10287387
    Abstract: The object of the present invention is to provide an epoxy resin composition for casting having excellent heat resistance and thermal shock resistance. The epoxy resin composition for casting of the present invention contains a silica powder (A), a liquid epoxy resin (B), a polyether polyol (C), a liquid acid anhydride (D), a curing accelerator (E), and a core shell polymer (F).
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: May 14, 2019
    Assignee: KANEKA CORPORATION
    Inventor: Nobuo Miyatake
  • Patent number: 10280252
    Abstract: Latent epoxy resin formulations are suitable for liquid impregnation processes for production of fiber composite materials.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: May 7, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Martina Ortelt, Dirk Fuchsmann, Eike Langkabel, Britta Kohlstruk, Jaclyn Balthasar
  • Patent number: 10280116
    Abstract: The invention relates to an additive mixture for addition to a building material covering mixture for forming a composite covering system for the floor, wall, or facade area, which additive mixture reduces the thermal conductivity or thermal dissipation of covering systems, in particular the thermal dissipation through objects and sub-bases coated with the covering system, in such a way that walking on the sub-base provided with the covering system is no longer associated with a sensation of cold feet. This is achieved in that the additive mixture has a proportion of between 50% wt and 95% wt of Muscovite mica.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: May 7, 2019
    Assignee: Synfola GmbH
    Inventor: Kaspar Hauser
  • Patent number: 10266641
    Abstract: Provided are: an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and fast curing properties at high levels; a prepreg; and an epoxy resin composition which exhibits excellent mechanical characteristics as a fiber-reinforced composite material. A resin composition which contains an epoxy resin, dicyandiamide, an imidazole compound and an acidic compound, while satisfying the following conditions (a)-(c): (d) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 100° C. is 25 minutes or less as measured by a differential scanning calorimeter at an isothermal temperature of 100° C. in a nitrogen gas stream. (e) The time until the heat flow rate reaches the peak top after the epoxy resin composition reaches 60° C. is 15 hours or more as measured by a differential scanning calorimeter at an isothermal temperature of 60° C. in a nitrogen gas stream.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 23, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Reo Takaiwa, Kentaro Sano, Noriyuki Hirano
  • Patent number: 10266730
    Abstract: [Problem] Provided is a thermally and electrically conductive adhesive composition used as a die-bonding material which shows high heat dissipation performance and stable electric conductivity as well as high adhesion force. [Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: April 23, 2019
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Rikia Furusho, Shintaro Abe, Takeshi Kondo, Teruki Tanaka
  • Patent number: 10266644
    Abstract: The present invention provides an epoxy resin composition, which is improved in terms of storage stability without deteriorating the characteristics of a cured resin, and is also superior in handling property, by using a curing accelerator having higher latency. The epoxy resin composition of the present invention comprises an epoxy resin, a curing agent, and a curing accelerator, wherein the curing accelerator is a reaction product between a carbodiimide compound and an imidazole compound, and is contained in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: April 23, 2019
    Assignee: Nisshinbo Chemical Inc.
    Inventors: Ikuo Takahashi, Takahiko Itoh, Shinichi Nakashima, Takahiro Sasaki
  • Patent number: 10259920
    Abstract: A prepreg comprising at least one layer of carbon fibers and a curable thermosetting resin system, the curable thermosetting resin system at least partly impregnating the at least one layer of carbon fibers, wherein the curable thermosetting resin system comprises: a. a curable thermosetting resin including at least one epoxide group; b. a curing agent for curing the curable thermosetting resin, wherein the curing agent is present in the liquid phase and includes a cyanamide reactive group; c. an accelerator for accelerating the curing of the thermosetting resin by the curing agent, wherein the accelerator includes at least one urea reactive group; and d. a rheology modifier for the curable thermosetting resin system, wherein the rheology modifier is at least one of a thermoplastic resin and an inorganic particulate thickener or a mixture thereof.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: April 16, 2019
    Assignee: Gurit (UK) Ltd.
    Inventors: Paul John Spencer, Glynn John Edwards, Kate Victoria Redrup
  • Patent number: 10253142
    Abstract: An epoxy resin composition is provided including at least the following component [A], component [B], and component [C] or [D] wherein cured product obtained by curing the epoxy resin composition has a rubbery state modulus in dynamic viscoelasticity evaluation of 10 MPa or less, and the cured product has a glass transition temperature of at least 95° C.; [A] an aromatic epoxy resin having a functionality of at least 3, [B] an aromatic diamine having a substituent at ortho position of each amino group or a cycloalkyldiamine wherein the carbon atom adjacent to the carbon atom bonded to each amino group has a substituent, [C] an aliphatic polyamine having an alkylene glycol structure, [D] a straight chain or branched aliphatic polyamine containing 6 to 12 carbon atoms.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: April 9, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Ayumi Matsuda, Masayuki Miyoshi, Noriyuki Hirano
  • Patent number: 10252965
    Abstract: A vinylbenzylated phenol compound represented by General Formula (1) below is provided. (In General Formula (1), Ar0 is a bifunctional phenol compound residue having one or more monocyclic or polycyclic aromatic nuclei, R1 to R5 may be the same or different and are each hydrogen or a methyl group, and p is an integer of 1 to 4.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: April 9, 2019
    Assignee: AIR WATER INC.
    Inventor: Shinji Onda
  • Patent number: 10246588
    Abstract: A solvent-free thermosetting filling resin composition is provided. The resin composition comprises the following components: (A) a benzoxazine resin of formula (I), (B) an epoxy resin with an alicyclic skeleton; (C) an epoxy resin hardener; (D) a benzoxazine resin hardener; and (E) a modified filler, wherein, A, B, R, and n in formula (I) are as defined in the specification.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: April 2, 2019
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Shur-Fen Liu, Chin-Hsien Hung
  • Patent number: 10245764
    Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: April 2, 2019
    Assignee: Cytec Industries Inc.
    Inventors: Jonathan E. Meegan, Olivia Denman, Marco Aurilia
  • Patent number: 10240074
    Abstract: The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: March 26, 2019
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Zengbiao Huang, Huayang Deng, Yongjing Xu
  • Patent number: 10233295
    Abstract: A fiber-reinforced composite material of the present invention is a fiber-reinforced composite material comprising: an epoxy resin cured product obtained by curing an epoxy resin composition and a reinforcing fiber, wherein the epoxy resin composition comprises an epoxy resin (A) and a curing agent (B); 10 to 80% by mass of the curing agent (B) is 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride; and the reinforcing fiber comprises one or more selected from the group consisting of a carbon fiber, an aramid fiber, and a boron fiber.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: March 19, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yuiga Asai, Tomotaka Wada