Patents Examined by Michael J. Feely
  • Patent number: 10400112
    Abstract: Disclosed are powder coating compositions that include a polymeric aromatic product of an aromatic isocyanate manufacturing process.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: September 3, 2019
    Assignee: Covestro LLC
    Inventors: George Pavlovich, Don S. Wardius
  • Patent number: 10392469
    Abstract: Epoxy resin compositions containing at least one resin component and at least one hardener component are suitable as a thermoset matrix for production of semi-finished fiber matrix products and cured fiber matrix laminates known as composites.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: August 27, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Martina Ortelt, Dirk Fuchsmann, Sebastian de Nardo, Eike Langkabel, Britta Kohlstruk, Annette Sandkuehler, Ralph Aldridge, Katharina Karns
  • Patent number: 10385161
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: August 20, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Min Gyum Kim, Jin Woo Choi, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon
  • Patent number: 10385174
    Abstract: A fiber reinforced thermoplastic resin molding material includes a thermoplastic resin; a resin impregnated reinforcing fiber filament obtained by impregnating reinforcing fibers with a resin having a melt viscosity at 200° C. lower than a melt viscosity of the thermoplastic resin; and a reinforcing fiber modifier having a melt viscosity at 200° C. lower than the melt viscosity of the thermoplastic resin and a difference in solubility parameter value from the thermoplastic resin equal to or larger than 1.0, the molding material including 50 to 98.9 parts by weight of the thermoplastic resin; 1 to 40 parts by weight of the reinforcing fiber; 0.1 to 10 parts by weight of the reinforcing fiber modifier; and 0.2 to 12 parts by weight of the resin relative to total 100 parts by weight of the thermoplastic resin, the reinforcing fiber, and the reinforcing fiber modifier.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: August 20, 2019
    Assignee: Toray Industries, Inc.
    Inventors: Shin Hirata, Yuki Mitsutsuji, Sora Bang, Atsuki Tsuchiya
  • Patent number: 10385159
    Abstract: A water-based primer composition is particularly suitable for the pre-treatment of polycarbonate substrates, and has a component K1 having an aqueous epoxy resin dispersion, an aqueous polyester-polyurethane dispersion and an aqueous polyacrylate dispersion, and optionally a water-miscible organic solvent, and a second component K2 containing a water-dispersible curing agent based on isocyanate. The primers provide a strong bonding of subsequently applied adhesives to polycarbonate substrates, and permit a processing with a significant reduction in VOC emissions and the prevention of the occurrence of stress-cracks.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: August 20, 2019
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Dirk Urbach, Michael Oeser, André Buchholz, Thomas Hanhörster
  • Patent number: 10377929
    Abstract: An epoxy adhesive that is adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques is disclosed. The epoxy adhesive can include one or more epoxy resins and one or more solvents that are used to dissolve the one or more epoxy resins. An adduct, a tackifier, and fumed silica can also be added to the adhesive.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: August 13, 2019
    Assignee: Westech Aerosol Corporation
    Inventors: David W. Carnahan, Robert R. Yuodelis, James C. Manlove
  • Patent number: 10370545
    Abstract: The present invention is directed to an electrodepositable coating composition comprising a main vehicle comprising a phosphatized epoxy resin, a plasticizer, and a curing agent, wherein the main vehicle comprises a low-VOC main vehicle. The present invention is also directed to coatings and coated substrates.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: August 6, 2019
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Se Ryeon Lee, Mark L. Follet
  • Patent number: 10370536
    Abstract: A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yoshitaka Ueno, Masataka Kudo, Michio Yaginuma
  • Patent number: 10370532
    Abstract: A resin composition of the present invention contains: an epoxy resin (A); a hardener (B); and an ion exchanger (C). At least one of the epoxy resin (A) and the hardener (B) contains a modified silicone (S), and the epoxy resin (A) is at least one type selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, and an epoxy-modified silicone.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: August 6, 2019
    Assignee: OLYMPUS CORPORATION
    Inventors: Koji Kobayashi, Takae Hayashi, Kunihisa Obi
  • Patent number: 10363724
    Abstract: A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: July 30, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Akira Oota, Masahiro Ichino, Toru Kondo
  • Patent number: 10356898
    Abstract: Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.193 to 3.082 ?m.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: July 16, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Nobuaki Miyamoto
  • Patent number: 10351700
    Abstract: A epoxy resin composition includes a given epoxy resin [A], an aromatic amine compound [B], an organic acid hydrazide compound [C] having a structural formula represented by general formula (I) or (II) (X is a structure selected from among monocyclic and polycyclic aromatic ring structures, polycyclic aromatic ring structures, and aromatic heterocyclic structures and optionally has, as a substituent, any of C4 or lower alkyl groups, a hydroxy group, and an amino group), and a thermoplastic resin [D], wherein the amount of the constituent element [C] is 1-25 parts by mass per 100 parts by mass of the constituent element [A], the epoxy resin composition, after having been held at 80° C. for 2 hours, having a viscosity which is up to 2.0 times the initial viscosity at 80° C.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: July 16, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Koji Furukawa, Atsuhito Arai, Hiroaki Sakata
  • Patent number: 10344117
    Abstract: An epoxy resin composition includes [A] an epoxy resin, [B] dicyandiamide, [C] an aromatic urea and [D] a boric acid ester and satisfies any one of (i) requirements [a] and [b], (ii) requirements [c] and [d] and (iii) requirements [c] and [e]:[a]: the time from when the temperature reaches 100° C. till when the heat flow reaches a peak top is 60 minutes or shorter as determined by a differential scanning calorimetry; [b]: the time from when the temperature reaches 60° C.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: July 9, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Kentaro Sano, Reo Takaiwa, Noriyuki Hirano
  • Patent number: 10343383
    Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: July 9, 2019
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Hui Li, Kehong Fang
  • Patent number: 10344191
    Abstract: Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: July 9, 2019
    Assignees: DENSO CORPORATION, ADEKA CORPORATION
    Inventors: Kenji Koga, Daisuke Takama, Ryo Ogawa, Shinsuke Yamada, Takuya Matsuda
  • Patent number: 10344160
    Abstract: An hydrophobic epoxy resin composition including at least one ortho-substituted glycidyl ether, at least one ortho, ortho?-disubstituted glycidyl ether, at least one ortho, meta?-disubstituted glycidyl ether, at least one amine/aniline curing agent, and at least one organic solvent.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: July 9, 2019
    Assignee: The United States of America as Represented by the Secretary of the Navy
    Inventors: Joseph W Tsang, Michael Garrison
  • Patent number: 10336875
    Abstract: A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: July 2, 2019
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Hui Li, Kehong Fang
  • Patent number: 10336899
    Abstract: A polybutylene terephthalate resin composition containing a polybutylene terephthalate resin, 10 to 20% by mass of glass fiber relative to a total mass of the composition, an ethylene/ethyl acrylate copolymer, and an epoxy compound having an epoxy equivalent weight of 600 to 1,500 g/equivalent, and having a comparative tracking index (CTI) of 600 V or higher, measured in accordance with the third edition of IEC 60112.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 2, 2019
    Assignee: WinTech Polymer Ltd.
    Inventors: Shotaro Moriya, Kouichi Sakata
  • Patent number: 10329464
    Abstract: A two-part adhesive is provided comprising: A) a curative part comprising: i) an epoxy curative; and ii) a reaction intermediate which is the reaction product of a suspension of core/shell rubber nanoparticles in a liquid epoxy resin and an excess of the epoxy curative; wherein the curative part comprises greater than 1.1 wt % core/shell rubber nanoparticles; and B) an epoxy part comprising: iii) a liquid epoxy resin; and iv) greater than 9.1 wt % core/shell rubber nanoparticles. In some embodiments, the epoxy part additionally comprises greater than 5.1 wt % solid epoxy resin, such as, e.g., triglycidyl ether of trisphenol-methane. In some embodiments, the sum of the wt % solid epoxy resin and the wt % core/shell rubber nanoparticles in the epoxy part is greater than 41.0%. In some embodiments, the sum of the wt % solid epoxy resin and the wt % core/shell rubber nanoparticles in the mixed adhesive is greater than 26.0%.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: June 25, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: Lianzhou Chen, Jay S. Schlechte, George S. Stout, Rachel J. Squires
  • Patent number: 10329465
    Abstract: The present invention relates to adhesive compositions containing a prepolymer which can be obtained by reacting a reaction mixture containing: at least one epoxy resin; at least one polyetherdiamine or polyethertriamine; at least one carboxyl-terminated butadiene-acrylonitrile copolymer (CTBN); and rubber particles having a core/shell structure. The invention also relates to methods for curing said compositions, to the cured adhesive compositions thus obtained, to the use thereof for bonding components and to the components thus obtained.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: June 25, 2019
    Assignee: Henkel AG & Co. KGaA
    Inventors: Christian Holtgrewe, Harald Kuester, Thomas Bachon, Rainer Schoenfeld