Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Abstract: A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH2—CN]n(1), wherein A is hydrogen or C1-C12 alkyl which is unsubstituted or substituted by one or more C1-C12 alkoxy groups, C1-C12 alkylcarbonyl groups, C7-C25 arylcarbonyl groups, hydroxyl groups, amino groups, C1-C12 alkylamino groups, C1-C12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR1—, wherein R1 is hydrogen or C1-C12 alkyl which is unsubstituted or substituted by one or more C1-C12 alkoxy groups, C1-C12 alkylcarbonyl groups, C7-C25 arylcarbonyl groups, hydroxyl groups, amino groups, C1-C12 alkylamino groups, C1-C12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C.

Abstract: A biopolymer blend is provided that comprises a combination of three components: poly (butylene adipate-co-terephthalate) (PBAT); agriculture sourced polylactic acid (PLA); and engineered proteinaceous eggshell nanoparticles. The two polymer components can be present in any ratio but an approximate 70:30 ratio is preferred. The engineered proteinaceous eggshell nanoparticles are preferably about 10-25 nanometers. Also provided are methods of preparing biopolymer film and packaging components. Pelleted poly (butylene adipate-co-terephthalate) and agriculture sourced polylactic acid (PLA) are dissolved in chloroform and mixed together to form a polymer blend, and engineered proteinaceous eggshell nanoparticles are incorporated into the polymer blend, which is then extruded to create a biopolymer film or component.

Abstract: To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 ?m observed within a 25-mm2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

Abstract: A substrate having a burnable coating mask includes: a substrate having a first section and a second section; a mask coating layer over the first section of the substrate; and a functional coating layer over at least a portion of the mask coating layer and over the second section of the substrate. A method of segmenting a substrate having a layer thereover, a method of preparing a segmented substrate having a layer thereover, a segmented substrate, and a transparency are also disclosed.

Abstract: The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

Abstract: Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.

Abstract: Provided is a method of producing a polycarbonate-based resin composition, including mixing an aliphatic polycarbonate-based resin (A) containing a specific repeating unit (A-1), and at least one kind of aromatic thermoplastic resin (S) selected from the group consisting of an aromatic polycarbonate-based resin (B) containing a polycarbonate block formed of a specific repeating unit, an aromatic polyester-based resin (C) having a specific structural unit, and a polyarylate resin (D) having a specific structural unit in the presence of a transesterification catalyst at a temperature at which the resin components melt.

Abstract: A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising (i) an epoxy component selected from bisphenol C diglycidyl ether, one or more derivatives of bisphenol C diglycidyl ether, and combinations thereof, and (ii) 9,9-bis(4-amino-3-chlorophenyl)fluorene.

Abstract: A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations.

Abstract: The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.

Abstract: The invention relates to a process for producing a composite polyisocyanurate material, comprising the following steps: a) providing a polyisocyanate composition A) which comprises oligomeric polyisocyanates and is low in monomeric diisocyanates, “low in monomeric diisocyanates” meaning that the polyisocyanate composition A) has a content of monomeric diisocyanates of not more than 20% by weight, and b) catalytically trimerizing the polyisocyanate composition A) in the presence of at least one fibrous filler B) and of a trimerization catalyst C) to give the composite polyisocyanurate material, where the trimerization catalyst C) comprises at least one metal salt and/or quaternary ammonium salt. The invention further relates to composite polyisocyanurate materials obtainable by the process according to the invention and to the use thereof for production of a component, and to components consisting of or comprising a composite polyisocyanurate material according to the invention.

Abstract: Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.

Abstract: The present invention relates to a process for removing ketazine from polyurethane dispersions by means of distillation below the boiling point of ketazine.

Abstract: A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

Abstract: A sheet formed from a carbon fiber reinforced thermoplastic resin with a simplified production process and excellent mechanical characteristics, and a production method of said sheet is provided. This sheet is formed from a carbon fiber reinforced thermoplastic resin that contains carbon fibers, dichloromethane, and a thermoplastic resin containing at least one of a polycarbonate resin and a polyarylate resin, and the content of the dichloromethane contained in the sheet is 10-10,000 ppm by mass.

Abstract: Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy resin component, polyethersulfone as a toughening agent, a thermoplastic particle component, a nanoparticle component and a curing agent.

Abstract: The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

Abstract: Provided is a prepeg resin composition, containing: a urethane (meth)acrylate (A) that is a reaction product of polyisocyanate (a1), polyol (a2), and hydroxy alkyl (meth)acrylate (a3); and a polymerization initiator (B), as an essential component, in which the polyisocyanate (a1) is at least one polyisocyanate selected from 2,4?-diphenyl methane diisocyanate, 4,4?-diphenyl methane diisocyanate, a carbodiimide modified product of 4,4?-diphenyl methane diisocyanate, and polymethylene polyphenyl polyisocyanate, and the polyol (a2) has an aromatic-ring and an oxyalkylene structure. The prepreg resin composition of the invention is excellent in workability and molding properties, and is capable of forming a molded article excellent in various physical properties such as external appearance and heat resistance, and thus, can be preferably used in a prepreg and a molded article thereof.

Abstract: Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (wherein R1, R2, R3 and R4 are each independently hydrogen or CnH2nSH (wherein n is 2 to 6), at least one of R1, R2, R3 and R4 is CnH2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.