Abstract: A composition of matter includes a first compatible material having particles containing chemical elements similar to a first substrate, and second compatible material having particles containing chemical elements similar to a second substrate, wherein the first substrate and the second substrate are chemically different. The particles are dispersed into a matrix that is in between the first and the second substrate. A deposition system has a multi-material printhead, a first reservoir of a first compatible material having particles containing chemical elements similar to a first substrate, a second reservoir of a second compatible material having particles containing chemical elements similar to a second substrate, a third reservoir of an polymer precursor material, and at least one mixer.
Type:
Grant
Filed:
July 23, 2018
Date of Patent:
March 16, 2021
Assignee:
PALO ALTO RESEARCH CENTER INCORPORATED
Inventors:
Gabriel Iftime, David Mathew Johnson, Jessica Louis Baker Rivest
Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.
Type:
Grant
Filed:
December 7, 2015
Date of Patent:
March 16, 2021
Assignee:
PPG Industries Ohio, Inc.
Inventors:
Umesh C. Desai, Tien-Chieh Chao, Masayuki Nakajima, Kaliappa G. Ragunathan
Abstract: This invention provides a process for manufacturing high performance polyester polyols with high proportion of renewable content derived from biological sources. The polyester polyols with high content of renewable biological materials produced according to the present invention display no color or odor issues and are used in the manufacture of two component polyurethanes, thermoplastic urethanes, polyurethane dispersions and polyester and polyester/urethane acrylates with outstanding physical properties.
Type:
Grant
Filed:
September 25, 2017
Date of Patent:
March 9, 2021
Assignee:
PTT Global Chemical Public Company Limited
Inventors:
Arne Matthew Terwillegar, Charliss Denniston
Abstract: Disclosed herein are amphiphilic surfactants which comprise a polymer chain having a hydrophobic unit and hydrophilic unit wherein the polymer is tethered to an inorganic nanoparticle. Further disclosed are methods for preparing the disclosed amphiphilic surfactants.
Type:
Grant
Filed:
January 26, 2016
Date of Patent:
February 23, 2021
Assignee:
ADMINISTRATORS OF THE TULANE EDUCATIONAL FUND
Inventors:
Scott Grayson, Alina Alb, Muhammad Ejaz
Abstract: A prepreg including: a component (A); a component (B); and a component (C), in which the component (A) is a reinforced fiber substrate, the component (B) is an epoxy resin composition, the component (C) is a component (c1) or a component (c2), the component (c1) includes polyamide particles and thermosetting polyimide particles, and the component (c2) includes spherical polyamide particles having a melting point of 140° C. to 175° C.
Abstract: An epoxy resin, comprising a first epoxy compound having a mesogenic structure and a second epoxy compound having two or more mesogenic structures that are the same as the mesogenic structure of the first epoxy compound, a proportion, determined by liquid chromatography, of the first epoxy compound being from 40% to 50% with respect to a total amount of the epoxy resin.
Abstract: This disclosure relates to wear-resistant rubber compositions, such as those, for example, comprising at least one hydroxy-terminated polybutadiene, at least one natural rubber, at least one polymerization accelerant; at least one sulfur; and at least one polybutadiene, wherein the wear-resistant rubber composition may have an effective cross-linking density of at least about 30×10?5 moles/cm3.
Type:
Grant
Filed:
April 14, 2020
Date of Patent:
February 9, 2021
Assignee:
Weir Slurry Group, Inc.
Inventors:
Francisco A. Gozalo, Sanford W. Clark, Tham Meng, Timothy Lane
Abstract: The present invention relates to the use of bis-anhydrohexitol ethers as reactive diluents in a crosslinkable resin, adhesive, coating or composite matrix composition. Not only do these products make it possible to advantageously reduce the viscosity of the mixtures obtained, but they also lead to a very small reduction in the glass transition temperature of the crosslinked mixtures, compared to other reactive diluents, while spectacularly improving the mechanical properties of the latter such as the Young's modulus, the tensile strength, the elongation at break and the toughness.
Abstract: The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: wherein n represents an integer of 0 to 10.
Abstract: An elastomer is provided, which is a product of reacting C4-12 lactam, poly(C2-4 alkylene glycol), C4-12 diacid, and multi-ester aliphatic monomer. The C4-12 lactam and the poly(C2-4 alkylene glycol) have a weight ratio of 20:80 to 80:20. The total weight of the C4-12 lactam and the poly(C2-4 alkylene glycol) and the weight of the C4-12 diacid have a ratio of 100:0.5 to 100:10. The total weight of the C4-12 lactam and the poly(C2-4 alkylene glycol) and the weight of the multi-ester aliphatic monomer have a ratio of 100:0.01 to 100:5.
Type:
Grant
Filed:
December 26, 2019
Date of Patent:
February 2, 2021
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.
Abstract: An epoxy oligomerization catalyst can be employed to prepare an epoxy resin employing a method including admixing a first epoxy resin having a first epoxy equivalent weight of from about 100 to about 600 with a diphenolic compound, and a catalyst, thereby forming a second epoxy resin having a second epoxy equivalent weight of from about 200 to about 10,000; wherein the catalyst is a guanidinium catalyst. The second equivalent weight is greater than the first equivalent weight.
Type:
Grant
Filed:
September 12, 2017
Date of Patent:
January 26, 2021
Assignee:
HEXION INC.
Inventors:
David Flosser, Jerry R. Hite, Larry Steven Corley, Bedri Erdem
Abstract: A process of preparing polybenzoxazines using an alkylammonium salt of an acid having a pKa in acetonitrile of 9 or more as catalyst is described.
Abstract: A composition comprising (A) from 30 wt % to 70 wt % of a propylene component including at least one propylene based polymer having a propylene content of at least 70.0 wt %, based on the total weight of the propylene based polymer, and a melt flow rate from 1.0 g/10 min to 100.0 g/10 min (ASTM D-1238 at 230° C., 2.16 kg); (B) from 1 wt % to 20 wt % of an ethylene component including at least one ethylene based polymer having an ethylene content of at least 85.0 wt %, based on the total weight of the ethylene based polymer, and a melt index from 0.1 g/10 min to 50.0 g/10 min (ASTM D-1238 at 190° C., 2.16 kg); (C) from 1 wt % to 40 wt % of an olefin block copolymer; and at least one of (D) from 1 wt % to 40 wt % of a polyolefin elastomer and (E) from 1 wt % to 30 wt % of a filler.
Type:
Grant
Filed:
May 31, 2016
Date of Patent:
December 29, 2020
Assignee:
Dow Global Technologies LLC
Inventors:
Hang Wu, Wei Li, Yushan Hu, Jeffrey C. Munro, James Hemphill
Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.
Abstract: The present invention relates to a pressure-sensitive adhesive tape comprising or consisting of a moisture-curing composition comprising or consisting of: A 5 to 60 parts by weight of at least one film-former component; B 40 to 95 parts by weight of at least one epoxide component; C 10 to 500 parts by weight of at least one moisture-activatable curing agent; D optionally 0.1 to 15 parts by weight of at least one stabilizer, and E optionally 0.1 to 200 parts by weight of at least one additive, based in each case on the moisture-curing composition, with the parts by weight of components A and B adding up to 100 and with the moisture-curing composition being characterized in that the moisture-activatable hardener C comprises or consists of at least one blocked amine. The invention further relates to a method for assembling two components using such adhesive tape.
Type:
Grant
Filed:
April 18, 2017
Date of Patent:
December 8, 2020
Assignee:
TESA SE
Inventors:
Christian Schuh, Olga Kirpicenok, Yvonne Querdel
Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, (A) a carboxyl-containing benzotriazole derivative, and (B) an alkoxysilyl-containing aminoalkylsilane derivative is suited for encapsulating semiconductor devices. The sum of (A)+(B) is 0.5-5.0 pbw per 100 pbw of the sum of the epoxy resin and the curing agent, and a molar ratio (A)/(B) is 0.5-1.5. The composition is free of sulfur and highly adhesive to metal substrates.
Abstract: Provided are: an epoxy resin composition that gives a carbon fiber-reinforced composite material having excellent moldability, heat resistance, and mechanical properties such as tensile strength and compressive strength; and a prepreg. An epoxy resin composition containing at least the following constituent elements [A]-[D]. The epoxy resin composition contains 5-50 parts by mass of constituent element [A] and 20-95 parts by mass of constituent element [B], as well as 1-25 parts by mass of constituent element [C], relative to 100 parts by mass of the total amount of epoxy resin. Constituent element [A] is an epoxy resin having primarily two epoxy groups and one or more condensed polycyclic aromatic hydrocarbon skeletons within a repeating unit of a specific structure; [B] is a glycidylamine epoxy resin having three or more glycidyl groups in the molecule; [C] is a sulfone or imide thermoplastic resin; and [D] is an epoxy resin curing agent.
Abstract: The present disclosure discloses a hexagonal boron nitride epoxy compound anticorrosive paint, and a preparation method and use thereof. The anticorrosive paint mainly comprises hexagonal boron nitride, an oligoaniline or polyaniline nanofiber, an epoxy resin, a dispersing medium, a paint additive, an epoxy resin curing agent, and a solvent. The hexagonal boron nitride epoxy compound anticorrosive paint provided by the present disclosure has the advantages, such as good stability, simple preparation process, and low cost, does not tend to precipitate, is suitable for large-scale production, forms a coating that has excellent barrier properties and lasting corrosion resistance, and has very good application prospects in the industries, such as chemical industry, petroleum, electric power, shipping, light textile, storage, transport, and spaceflight.
Type:
Grant
Filed:
December 6, 2016
Date of Patent:
November 3, 2020
Assignee:
Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences
Abstract: A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.
Type:
Grant
Filed:
January 9, 2017
Date of Patent:
October 27, 2020
Assignee:
DOW GLOBAL TECHNOLOGIES LLC
Inventors:
Benjamin Haag, Andreas Lutz, Cathy Grossnickel, Raymond F. Bis