Abstract: The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014?(content of component [D]/content of component [C])?0.045, [b]: 0.9?(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])?1.2, and [c]: 14?(content of component [A]/content of component [C])?25.

Abstract: Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic or non-polymeric organic phosphorous containing fire retardant; and from 1 to 30% by weight of the formulation of a curative system are provided. The formulations are particularly suitable for producing aircraft interior composite components having good fire retarding properties, low smoke emission, low smoke toxicity and low heat release properties. The formulations also have excellent processing and mechanical properties. Further components may be included in the compositions to improve various properties, including the fire retarding, low smoke emission, low smoke toxicity and low heat release properties and to also further improve the processing and mechanical properties, including toughness.

Abstract: A slow reacting epoxy resin system is disclosed. The slow reacting epoxy resin system comprises a high purity epoxy resin component selected from the group comprising of a high purity Bisphenol A(BPA), a high purity Bisphenol F (BPF), and a combination thereof, and an amine curing agent. The initial viscosity after mixing the high purity epoxy resin component and the amine curing agent is less than 350 mPa·s at 25° C.

Abstract: Self-healing mircrocapsules including: a) a polymeric shell; b) a healing-agent compartmentalized inside the polymeric shell; and c) a catalyst deposited on the surface of the polymeric shell; where the microcapsules are prepared by suspension polymerization, and the microcapsules may be present in a polymeric matrix and in composite materials that include such polymeric matrix.

Abstract: A thermosetting resin composition at least including: [A] an epoxy resin containing two or more glycidyl groups; [B] a cyanate ester resin containing two or more cyanate groups; and [C] an amine compound; and satisfying the following conditions (1) and (2): (1) 0.25?the number of moles of glycidyl groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition?1.5; and (2) 0.05?the number of moles of active hydrogen contained in the amino groups in the thermosetting resin composition/the number of moles of cyanate groups in the thermosetting resin composition<0.5; and a prepreg and a fiber reinforced composite material using the thermosetting resin composition.

Abstract: The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked.

Abstract: The present invention provides an epoxy compound indicated by chemical formula (1) (in chemical formula (1), X indicates a C1-10 aliphatic hydrocarbon group, R1 and R2 each independently indicate one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic group, an alkoxy group, and a halogen atom)

Abstract: A prepreg containing the following constituent elements [A] to [C], wherein a resin composition containing the constituent elements [B] and [C] has a higher-order structure derived from a diffraction angle 2? between 1.0° and 6.0° observed with X-ray diffraction after curing: [A]: carbon fibers [B]: epoxy resin [C]: curing agent of [B].

Abstract: A prepreg is provided. The prepreg is prepared by impregnating a liquid crystal polymer non-woven fabric with a thermal-curable resin composition or by coating a thermal-curable resin composition onto a liquid crystal polymer non-woven fabric and drying the impregnated or coated liquid crystal polymer non-woven fabric, wherein the thermal-curable resin composition includes: (A) an unsaturated monomer; and (B) a cyclic olefin copolymer including the following repeating units: (B-1) a repeating unit of formula (I), (B-2) a repeating unit of formula (II), and (B-3) a repeating unit of formula (III), R1 to R22, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1) to (B-3), the content of the repeating unit (B-2) is 19 mol % to 36 mol %, and wherein the weight ratio of the cyclic olefin copolymer (B) to the unsaturated monomer (A) is 0.5 to 7.

Abstract: The present invention relates to a composition suitable as epoxy adhesive composition comprising a multistage polymer in form of polymeric particles and a (meth)acrylic polymer its process of preparation and its use. In particular the present invention relates to a structural epoxy adhesive composition comprising a multistage polymer in form of polymeric particles made by a multistage process and a (meth)acrylic polymer its process of preparation and its use. More particularly the present invention relates to structural (epoxy adhesive composition made from a two part composition or a one part composition comprising a multistage polymer in form of polymeric particles made by a multistage process and a (meth)acrylic polymer its process of preparation and its use.

Abstract: A high thermal conductivity prepreg is provided. The high thermal conductivity prepreg includes a high thermal conductivity reinforcing material and a dielectric material layer formed on the surface of the high thermal conductivity reinforcing material, wherein the high thermal conductivity reinforcing material is prepared by a process which includes the following steps: (a) providing a precursor aqueous solution, the precursor aqueous solution includes a precursor selected from the group of organic salts, inorganic salts, and combinations thereof; (b) subjecting the precursor aqueous solution to a hydrolysis reaction to form an intermediate product aqueous solution; (c) subjecting the intermediate product aqueous solution to a condensation polymerization reaction to form a pretreatment solution; (d) impregnating a reinforcing material with the pretreatment solution; and (e) oven-drying the impregnated reinforcing material to obtain the high thermal conductivity reinforcing material.

Abstract: The present invention relates to an epoxy resin composition (A) containing an epoxy resin represented by the following formula (1): and an epoxy resin represented by the following formula (2): wherein in formula (2), n represents an integer of from 0 to 2, wherein a content of the epoxy resin represented by formula (1) is from 0.01 to 0.99% by weight, and relates to an epoxy resin composition (B) containing a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A).

Abstract: A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure below or an imidazole represented by the structure below: where R1=H, a C1-C20 straight chain or branched alkyl, or a monocyclic aryl; R2=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The carboxylic acid is represented by RCOOH; R=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The composition comprises a lower ratio of epoxy resin to anhydride (1:0.4-0.6) than typically used (1:0.8-1.1). In addition, it uses a higher loading of the hindered latent tertiary amine or the imidazole in combination with the carboxylic acid (wt % ratio of combined amine and carboxylic acid to anhydride ˜10%). With this composition a full cure can be achieved in less than 2 hr at a significantly lower temperature (˜100° C.).

Abstract: A curing agent for epoxy resin compositions containing at least one amine of formula (I) and at least one amine of formula (II). The curing agent is a low-odor, low-viscosity, low-toxicity curing agent and has a low propensity for carbamatization and a high reactivity toward epoxy resins. It enables low-odor and low-emission epoxy resin products which are readily processable and which even at low temperatures and high humidities undergo rapid and problem-free curing to afford high-quality plastics having a high hardness and a regular, non-tacky surface with high gloss.

Abstract: An ultra-high solids content primer coating composition comprising: (i) 5.0 to 50 wt % of at least one bisphenol F epoxy resin; (ii) 1.5 to 12 wt % of at least one silane; (iii) 0 to 20 wt % of at least one hydrocarbon resin; (iv) 0 to 15 wt % of at least one reactive diluent; (v) at least one curing agent; wherein said composition has a solids content of at least 90 wt % according to ASTM D5201-05; wherein said composition has a viscosity of 200 to 800 cps at 23° C. and 50% RH (ASTM D4287); and wherein the ratio between hydrogen equivalents in the curing agent and epoxy equivalents of the coating composition is in the range 50:100 to 120:100.

Abstract: The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a thermosetting resin mixture and a fiber material component of a heat resistant fiber, such as carbon fiber, having an areal weight of from 500 to 3,000 g/m2 having a coating of from 0.5 to 4 phr of a latent, particulate curative or solid curative, preferably, dicyandiamide, wherein the prepregs are infused with a thermosetting resin mixture comprising (a) at least one liquid epoxy resin, and (b) a hardener and/or a catalyst, as well as methods of making the same. The prepregs of present invention enables the simple provision of lightweight composites having consistent resin cure throughout.

Abstract: An epoxy resin composition includes a polyol (A) having a hydroxyl value of 130 to 600 mgKOH/g, an epoxy resin (B), an amine curing agent (C), and a toughener (D). The epoxy resin composition may satisfy both 0.1?Wt2/Wp?8.0 and 0.1?Wp?8.0, where Wp represents the polyol (A) content of the composition in % by weight and Wt represents the toughener (D) content of the composition in % by weight, relative to a total amount of the polyol (A), the epoxy resin (B), the amine curing agent (C), and the toughener (D).

Abstract: The one-part moisture-curable urethane composition of the present technology includes: a urethane prepolymer (A) having an isocyanate group; at least one type of compound (B) selected from the group consisting of an aliphatic isocyanate compound and a modified product of the aliphatic isocyanate compound; and a monoalcohol compound (C) having a hydroxy group, the monoalcohol compound (C) being blended in an amount such that the amount of the hydroxy group in the monoalcohol compound (C) is from 0.025 to 0.4 mol per 1 mol of the isocyanate group in the urethane prepolymer (A).

Abstract: Provided herein is an aqueous polymer dispersion including A) a polymer synthesized from monomers including a) 1.0 to 90% by weight of at least one alkyl (meth)acrylate; b) 0.1 to 10% by weight of at least one ethylenically unsaturated acid or vinyl monomer with latent ionic groups; c) 0 to 5.0% by weight of at least one monoethylenically unsaturated monomer having at least one keto or aldehyde group; d) 1.0 to 90% by weight of at least one vinyl ester of saturated aliphatic monocarboxylic acid in which the carboxyl groups are attached to tertiary and/or quaternary carbon atoms; e) 0 to 20% by weight of at least one vinyl aromatics; and f) 0 to 20% by weight, based on the total amount of monomers for the synthesis of polymer A), of at least one hydroxyalkyl (meth)acrylate. Also included herein is an ink anchorage primer that enhances ink bonding.

Abstract: Lactide-based random polyester polyols for use in polyurethane compositions are disclosed. The polyester polyols have an OH value in the range of greater than 400 mg KOH/g up to 1100 mg KOH/g and are the reaction product of at least one polycarboxylic acid, at least one lactide, and one or more polyalcohols. The polyester polyols can be formulated into the B-side of a two part polyurethane composition to obtain a polyurethane having improved hardness and solvent resistance and a low VOC content. The polyurethane composition is particularly suitable for polyurethane coating applications.