Abstract: A multilayer film formed body comprises an outermost layer comprising a diamondlike carbon film, a substrate comprising an iron material, and an intermediate layer comprising a first layer on the substrate side, and a second layer on the outermost layer side. The first layer comprises at least either metal of Cr and Al, and a second layer comprises an amorphous layer including carbon and at least either metal of Cr and Al. The second layer has a gradient structure where the metal decreases as the position becomes closer to the outermost layer. The hardness of the second layer increases stepwise or continuously as the position becomes closer to the outermost layer. The hardness of the second layer close to the first layer is close to the hardness of the first layer. The hardness of the second layer close to the outermost layer is close to the hardness of the outermost layer.

Abstract: A coated cubic boron nitride (cBN) sintered body most suitable for a cutting tool having excellent resistance to wear and heat in the high-speed cutting of steel has been developed. The sintered body comprises (a) a base material made of a sintered body comprising at least 99.5 vol. % cBN and (b) a hard coating 0.1 to 10 &mgr;m in thickness formed on at least part of the surface of the base material by the PVD method. It is desirable that the hard coating comprise at least one compound layer consisting mainly of (a) at least one metal element selected from Al and the IV a-group elements and (b) at least one element selected from C, N, and O. It is desirable to provide between the base material and the hard coating an intermediate layer comprising a compound consisting mainly of boron and at least one metal element selected from the IV a-group elements.

Abstract: A method is described for making a reinforcing wire frame for embedding in a moulded polymer support frame over which woven wire cloth is to be stretched and secured to form a sifting screen. The method involves locating lengths of cut wire substantially equally spaced apart in a jig to form a first array. A second array of lengths of cut wire is located over the first array with the lengths of wire in the second array being substantially at right angles to those of the first array. The lengths of wire in the first and second arrays are resistance welded at points of mutual intersection so as to form a first substantially rectilinear matrix.

Abstract: A method is described for the manufacture of a Copper-Aluminium-Copper component (C-A-C “sandwich”) which can be used in the production of multilayer printed circuit boards, obtained by means of joining two external sheets of copper to one internal sheet of aluminium by means of a process of electro-mechanical joining, which does not require the use of additional material (such as, for example, an adhesive) and guarantees a consistently high level of quality. The joining process, normally continuous, is based on the use of a sonotrode to effect ultrasonic welding, wherein a single ultrasonic weld provides two joining zones between the two external copper sheets and the one internal aluminium sheet. According to a further embodiment, the component is manufactured with at least one layer of resin deposited externally on one of the external faces of the two copper sheets, which are not into contact with the internal aluminium sheet.

Abstract: A method of forming sheets of superplastically formable material into a three dimensional article, the sheets being joined together along diffusion bonds to form discrete cells, at least one gas path being provided through the bond between cells. The sheets are heated to a temperature at which they exhibit superplastic properties and a gas injected between the sheets to expand the cells, the gas paths allowing the injected gas to pass from cell to cell. The edges of the gas paths are locally heated to change the microstructure of the sheets in the edge areas, which reduces the flow resistance of the edges under superplastic forming conditions and thereby reduces the propensity of the diffusion bonds bordering the gas transfer holes to peel apart under the forces of the inert gas exerted on the sheets at the gas transfer paths.

Abstract: A method of producing a metal-coated steel strip includes the steps of forming a metal coating on a steel strip and conditioning the surface of the metal-coated steel strip by smoothing the surface of the strip. The method is characterised in that the conditioning step produces residual stress of no more than 100 MPa in the strip.

Abstract: The present invention describes a method including providing a component, the component having a bond pad; forming a passivation layer over the component; forming a via in the passivation layer to uncover the bond pad; and forming an under bump metallurgy (UBM) over the passivation layer, in the via, and over the bond pad, in which the UBM includes an alloy of Aluminum and Magnesium. The present invention also describes an under bump metallurgy (UBM) that includes a lower layer, the lower layer including an alloy of Aluminum and Magnesium; and an upper layer located over the lower layer.

Abstract: A highly porous alumina material and a method for applying such material that is useful in the hot section of a jet aircraft engine. In order to manufacture the porous alumina, an aluminum-based metal/alumina material known in the art is first placed onto a metal alloy substrate. The aluminum-based metal is then dissolved using a solution that will not affect the alumina or the underlying substrate. The alumina is then washed with deionized water and dried. The resulting alumina has a porosity in the range of about 20% to about 45%. The alumina has globular interconnected surface features in the range of about 0.5 &mgr;m to about 20 &mgr;m.

Abstract: The invention relates to a method for coating a composite cylinder. On top of said composite cylinder (1) is drawn or extruded a metal casing (2), whose metal surface is modified a metal treatment process and/or plated with a coating layer.

Abstract: The disclosed invention relates to a composite material for use in recovery of radionuclides, metals, and halogenated hydrocarbons from aqueous media. The material has very high surface area, and includes nanometer sized, zero-valent iron on a support. The material can be used to remediate aqueous media which have contaminants such as radionuclides, metals and halogenated hydrocarbons from aqueous media.

Abstract: A weldable structural steel product having fine complex precipitates of TiN and CuS is provided which contains, in terms of percent by weight, 0.03 to 0.17%C, 0.01 to 0.05% Si, 0.4 to 2.0% Mn, 0.005 to 0.2% Ti, 0.0005 to 0.1% Al, 0.008 to 0.030% N, 0.0003 to 0.01% B, 0.001 to 0.2% W, 0.1 to 1.5% Cu, at most 0.03% P, 0.003 to 0.05% S, at most 0.005% O, and balance Fe and incidental impurities while satisfying conditions of 1.2≦Ti/N≦2.5, 10≦N/B≦40, 2.5≦Al/N≦7, 6.5≦(Ti+2Al+4B)/N≦14, and 10≦Cu/S≦90, and having a microstructure essentially consisting of a complex structure of ferrite and pearlite having a grain size of 20 &mgr;m or less.

Abstract: On the outer surface of a metal pipe 10 there is formed a zinc plating layer 20 having a predetermined thickness by electroplating method. A coating layer 30 predominantly composed of a chromium compound and a phosphoric acid compound is formed by dipping the metal pipe 10 with layers up to the zincplating layer 20 formed thereon in a coating liquid containing chromium (a source of chromium) and at least one substance selected from the group consisting of oxyacid of phosphorus, oxysalt of phosphorus, anhydride of oxyacid of phosphorus, and anhydride of oxysalt of phosphorus. A fluorocarbon resin layer 40 is formed by coating, with polyvinyl fluoride, the metal pipe 10 with layers up to the coating layer 30 formed thereon and baking at a predetermined temperature for a predetermined time.

Abstract: A cooling plate provided with a cooling medium passage therein is formed by integrally joining a plurality of metal plates each having a cooling medium passage forming groove on a joining surface thereof. An anodic oxide film is formed on at least the cooling medium passage forming groove on the joining surface, and the plurality of metal plates are integrally joined each other by a friction agitation joining method. This enhances corrosion resistance of the cooling medium passage, resulting in an improved durability and extended life, which enables uniform cooling performance.

Abstract: A method for protecting low-carbon steel and stainless steel from coking and corrosion at elevated temperatures in corrosive environments, such as during ethylene production by pyrolysis of hydrocarbons or the reduction of oxide ores, by coating the stainless steel with a coating of MCrAlXSiT in which M is nickel, cobalt, iron or a mixture thereof, X is yttrium, hafnium, zirconium, lanthanum, scandium or combination thereof, and T is tantalum, titanium, platinum, palladium, rhenium, molybdenum, tungsten, niobium, boron or combination thereof. A blended powder composition to produce a desired MCrAlXSiT surface alloy may be applied to the substrate. The overlay coating and stainless steel substrate preferably are heat-treated at about 1000 to 1200° C. for about 10 minutes or longer effective to metallurgically bond the overlay coating to the substrate and to form a multiphased microstructure.

Abstract: The subject of the invention is a glass-, ceramic- or vitroceramic-based substrate (1) provided on at least part of at least one of its faces with a coating (3) with a photocatalytic property containing at least partially crystalline titanium oxide. It also relates to the applications of such a substrate and to its method of preparation.

Abstract: A component for use in manufacturing articles such as printed circuit boards, the component comprising: a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element; a substrate sheet of aluminum which constitutes a discardable element, and a protective coating layer on a surface of said substrate, one surface of the copper sheet and the coating layer on said substrate aluminum sheet being essentially uncontaminated and engageable with each other at an interface, and the uncontaminated surfaces of the sheets being manufactured together to define a substantially uncontaminated central zone inwardly of the edges of the sheets and unjoined at the interface.

Abstract: A metallized multilayer film structure includes a core layer of a film-forming polyolefin having a first side and a second side. A metal receiving skin layer may be disposed on the first side of the core layer. A metal layer may be deposited on the surface of the metal receiving skin layer opposite the core layer. A topcoat layer may be disposed on the surface of the metal layer opposite the metal receiving skin layer. A polymer skin layer may be disposed on the second side of the core layer. The film structure may optionally include one or more tie layers. The film structure may also optionally include a primer layer interposed between the topcoat layer and the metal layer. The present metallized multilayer film structure may be suitable for use as a monoweb to package product as opposed to being used in a lamination. The film structure exhibits superior scratch resistance and resistance to other types of damage. The film structure may be directly surface printed and then used to directly package product.

Abstract: A process for providing bond enhancement and an etch resist for a printed circuit board is provided. A sheet comprising at least a layer of copper is immerses in a first immersion tin solution comprising a tin metal and a complexing agent in an acidic medium for a time sufficient to deposit a first heavy tin deposit on the sheet. The sheet is then immersed in a second immersion tin solution comprising stannous tin ions and stannic tin ions and a complexing agent in an acidic medium for a time sufficient to deposit a second thin tin deposit on the sheet. The second thin tin deposit has a thickness less than a thickness of the first heavy tin deposit. A rough surface texture providing mechanical adhesion sites results. The board is then treated with a coupling agent, such as silane, for enhanced bonding to a subsequent epoxy or other polymer prepreg. Additionally, the first heavy tin deposit may serve as an etch resist in subsequent fabrication of the provided circuit board.

Abstract: The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices.

Abstract: A steel sheet for magnetic shields is provided containing 0.15% by weight or less of C and having a thickness of 0.05-0.5 mm and an anhysteretic magnetic permeability of 7500 or higher.