Abstract: An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.
Type:
Grant
Filed:
January 8, 2009
Date of Patent:
January 3, 2012
Inventors:
John L. Cordani, Jr., Kesheng Feng, Steven A. Castaldi, Colleen Mckirryher
Abstract: The invention relates to compositions which contain at least one isocyanate-containing polyurethane polymer P, which is produced from at least one polyisocyanate and at least one polyol, in addition to at least one aldimine-containing compound of formula (I). The compositions are stable during storage and harden quickly under the influence of moisture, are non-porous and do no not separate rich substances. Said compositions, the hardened compositions, and the resulting separated products are odor-less. The compositions can be used as an adhesive, sealant or coating which exhibit good mechanical properties and adhesion.
Abstract: Core-shell rubbers are incorporated into epoxy adhesives. The adhesives are structural type adhesives that contain an epoxy resin and a toughener, and may contain a liquid rubber in addition to the core-shell rubber. The adhesives have good modulus and tensile strength, which are obtained without loss of elongation and adhesive properties.
Type:
Grant
Filed:
April 9, 2008
Date of Patent:
January 3, 2012
Assignee:
Dow Global Technologies LLC
Inventors:
Andreas Lutz, Jeannine Fluekiger, Cathy Grossnickel
Abstract: The instant invention relates to compositions comprising a benzoxazine resin and an advancement resin based on bisphenol A diglycidyl ether and bisphenol S and, optionally, ferrocene and aluminium trihydrate. Such compositions are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compositions may especially be used in the production of printed wiring boards.
Abstract: Two-component adhesives (K), which includes two components K1 and K2. Component K1 includes at least one epoxy resin A with more than one epoxy group per molecule on average; at least one epoxy adduct B with more than one epoxy group per molecule on average that is an epoxy adduct of type B1 and optionally combined with an epoxy adduct of type B2; at least one reaction product F between an epoxy adduct B and a compound C, which has at least two isocyanate groups, in addition to at least one curing agent D for epoxy resins, which is activated by increased temperature. The component K2 comprises a compound E, which includes at least two isocyanate groups.
Abstract: A base material for adhesion to be adhered to a solid body comprising; a substrate made from metal, polymer resin, glass or ceramics whose surface is adhesive to the solid body by silyl-ether-linkage that at least one active silyl group selected from the group consisting of a hydrosilyl-containing silyl group, a vinyl-containing silyl group, an alkoxysilyl-containing silyl group and a hydrolytic group-containing silyl group having reactivity with a reactive group on the surface of the solid body is bound to a dehydrogenated residue of hydroxyl group on the surface of the substrate.
Abstract: Styrenic block copolymers are blended with propylene copolymers to provide polymeric compositions with an improved balance between processability and elasticity. The compositions have improved processability by facilitating the ease with which a rubbery material, usually difficult to melt process, can be processed at high line speeds, which in turn improves the formation of the composition into films or other articles, assisted by a desired level of melt elasticity, i.e., a high elastic extension and recovery.
Type:
Grant
Filed:
February 15, 2008
Date of Patent:
November 8, 2011
Assignee:
ExxonMobil Chemical Patents Inc.
Inventors:
Sudhin Datta, Mun Fu Tse, Abdelhadi Sahnoune, Charles L. Sims, James N. Coffey
Abstract: The invention relates to photopolymerizable compositions containing an oxonol dye, which compositions cure by exposure to ultraviolet and/or visible radiation and whose visible color is substantially reduced during exposure. More particularly, the invention pertains to photopolymerizable compositions comprising a pyridin-2,6-dione oxonol dye in an admixture of a polymerizable component and a photopolymerization initiator. Such compositions find use as adhesives, coatings, and the like. The disappearance of the visible color of the oxonol dye acts as an indicator of full cure of a photopolymerizable composition.
Type:
Grant
Filed:
October 26, 2007
Date of Patent:
November 8, 2011
Assignee:
Dymax Corporation
Inventors:
Stephan J. W. Platzer, Patrick S. Vaughn
Abstract: To provide a resin composition for e.g. a temporary fixing adhesive which has a high adhesive strength and which is readily removable in water, and a temporary fixing method for a member by means thereof. A resin composition comprising component (A): N,N-diethylacrylamide and/or N-isopropylacrylamide, component (B): at least one member selected from the group consisting of a homopolymer of N-vinyl-2-pyrrolidone, a homopolymer of N,N-dimethylacrylamide, a homopolymer of N,N-diethylacrylamide, a homopolymer of acryloylmorpholine, a homopolymer of N-isopropylacrylamide, and a copolymer of at least two monomers selected from the group consisting of N-vinyl-2-pyrrolidone, N,N-dimethylacrylamide, N,N-diethylacrylamide, acryloylmorpholine and N-isopropylacrylamide, and component (C): a polymerization initiator. A temporary fixing method for a member and a surface protecting method for a member, by means the resin composition.
Abstract: An object of the present invention is to provide a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set. The invention relates to a curable composition comprising (a) a vinyl-based polymer containing at least one (meth)acryloyl group in a molecule thereof and having a number average molecular weight of 500 to 1,000,000, (b) an ethylenic unsaturated group-containing compound, (c) a thixotropic property-imparting agent, (d) fumed silica surface-treated with a (meth)acryloyl group-containing silane and (e) a photopolymerization initiator.
Abstract: Repulped fiber that has been treated with an aqueous solution of a caustic selected from sodium hydroxide, potassium hydroxide and sodium carbonate, is used to make wallboard paper that is used to make a gypsum wallboard having improved nail pulling strength compared to gypsum wallboard made with fiber wallboard paper that has not been treated with caustic.
Abstract: The invention relates to a heat-sealing system consisting of an olefin polymer or olefin copolymer A, a methacrylate copolymer B, a graft polymer AB that is composed of the aforementioned components, a polyester C and an optional polymer D or an optional polymer blend DA, in addition to a solvent or solvent mixture L. The heat-sealing system is characterised by a high heat resistance, excellent barrier properties and short sealing times in relation to various plastics and aluminium foil or PET film.
Type:
Grant
Filed:
June 6, 2006
Date of Patent:
September 27, 2011
Assignee:
Evonik Rohm GmbH
Inventors:
Gerd Loehden, Sven Balk, Manfred Braum, Juergen Hartmann, Marita Kaufmann, Michael Wicke
Abstract: A cross-linked starch adhesive for use in producing moisture resistant wax free corrugated paperboard and the recyclable paperboard produced using the adhesive.
Type:
Grant
Filed:
April 29, 2008
Date of Patent:
August 9, 2011
Assignee:
Oel Chemical & Supplies, Inc.
Inventors:
Jimmie Franklin Messenger, Shawn Messenger, Sharlan Wilkins