Abstract: A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.

Abstract: Compositions comprising at least one oxidant or adhesion promoter, and at least one molecule selected from an aromatic nitroso compound or an aromatic nitroso compound precursor dinitrosobenzene precursor and combinations thereof are provided. At least one of the components is encapsulated. The compositions may find utility in polymer to metal, in particular, rubber to metal bonding. The aromatic nitroso compound or an aromatic nitroso compound precursor may be nitrosobenzene/dinitrosobenzene or nitrosobenzene/dinitrosobenzene precursor respectfully. The nitrosobenzene or dinitrosobenzene precursor may be at least one of a quinone oxime or a quinone dioxime.

Abstract: A pressure sensitive adhesive composition includes (A) a bodied MQ resin containing (i) a resinous core and (ii) a nonresinous polyorganosiloxane group, where the nonresinous polyorganosiloxane group is terminated with a silicon-bonded hydroxyl group; (B) a treated MQ resin, where (B)/(A) ratio has a value of 0.3 to 5.0, and (C) a polydiorganosiloxane terminated with a condensation reactable group; where resin/polymer ratio has a value of 2.0 to 3.0; optionally (D) a crosslinker; optionally (E) a catalyst; and optionally (F) a solvent. A pressure sensitive adhesive product prepared by curing the pressure sensitive adhesive composition is useful in structural attachment applications such as structural glazing applications.

Abstract: The invention provides derivatives of poly(styrene-co-allylalcohol). These materials are useful as thermosetting monomers that can be incorporated into adhesive compositions. In some embodiments, the adhesive compositions are useful in the microelectronic packaging industry.

Abstract: A method for forming a semiconductor bearing thin film material. The method includes providing a metal precursor and a chalcogene precursor. The method forms a mixture of material comprising the metal precursor, the chalcogene precursor and a solvent material. The mixture of material is deposited overlying a surface region of a substrate member. In a specific embodiment, the method maintains the substrate member including the mixture of material in an inert environment and subjects the mixture of material to a first thermal process to cause a reaction between the metal precursor and the chalcogene material to form a semiconductor metal chalcogenide bearing material overlying the substrate member. The method then performs a second thermal process to remove any residual solvent and forms a substantially pure semiconductor metal chalcogenide thin film material overlying the substrate member.

Abstract: The present disclosure provides a cyanoacrylate-based composition comprising a cyanoacrylate component and an organic micropulp component dispersed in a curable (meth)acrylic monomer matrix. The composition is particularly useful as an adhesive composition for zero gap applications.

Abstract: The present invention provides an adhesive sheet for attaching to a plasticized vinyl chloride resin article such as a blood bag made of a plasticized vinyl chloride resin, and having a center-line surface roughness Ra of 1.0 ?m or higher, which includes a film substrate and a heat-sensitive adhesive layer formed on a backside surface of the film substrate, wherein the heat-sensitive adhesive layer is composed of a resin containing a crystalline polyester resin as a main component. The adhesive sheet of the present invention is excellent in adhesive property when the adhesive sheet is attached to the article made of a plasticized vinyl chloride resin. The adhesive strength of the adhesive sheet of the present invention is not decreased even after an autoclave treatment or storage at a low temperature.

Abstract: A high-temperature bonding composition comprising a silicon base polymer as a thermosetting binder is provided. The silicon base polymer is obtained from dehydrolytic condensation of a condensate precursor comprising a silane compound having at least one pair of silicon atoms tied by a crosslink composed of an aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group, and having at least three hydroxyl and/or hydrolyzable groups. Those silicon atoms having a direct bond to the crosslink composed of the aliphatic hydrocarbon, heterocyclic or aromatic hydrocarbon group are present in a proportion of at least 90 mol % relative to all silicon atoms in the polymer.

Abstract: A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3?,4?-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2?,3,3?-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.

Abstract: A production process is provided for a board of hydraulic binder with a facing on each of its sides. The process includes on one side first tapered parallel edges and on the same side or the other side, two second tapered parallel edges perpendicular to the first. The process also includes the use of a forming lath having at least two distal parts. The process can be used in a production line that includes a specific lath.

Abstract: The inventive method for placing and fixing (bonding) a first object, whose surface is functionalized by compounds of formula I Y (X), A? (I), on the surface of a second object whose surface is functionalized by compounds of formula II Y (X)n A (II), wherein A and A? are functional groups enabling to be bonded at least by a link in a covalent manner to an object surface X and X? are aliphatic, linear, branched or cyclic spacers which can comprise one or several hetero or aromatic, or heteroaromatic atoms or consist of several aromatic or heteroaromatic cycles and optionally of alternating aliphatic chains having aromatic or heteroaromatic groups, n and n?=0 or 1 and Y and Y are functions for generating one or several non-covalent bonds wherein said Y or Y? are selected such that they are complementary or can complex a metal atom or an identical metal compound.

Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

Abstract: The subject of the invention is a novel plasterboard and its manufacturing processes. The novel board comprises, on one side, two first parallel feathered edges and, on the other side, two other, second, parallel feathered edges that are perpendicular to the first ones; or, on one side, two first parallel feathered edges and, either on the same side or on the other side, two second parallel feathered edges that are perpendicular to the first ones, the said other parallel feathered edges having a width of between 100 and 200 mm; or, on one side, two first parallel feathered edges and, either on the same side or on the other side, two second parallel feathered edges that are perpendicular to the first ones, the said second parallel feathered edges having a width such that the ratio of the width of the said second parallel feathered edges to the width of the said first parallel feathered edges is between 1.5 and 5.

Abstract: Aspects of this disclosure relate to a method of manufacturing wallboard which includes providing a first layer of facing material, creasing the first layer facing material intermittently to create a series of creased portions, providing a gypsum slurry on the first layer of facing material and providing a second layer of facing material over the gypsum slurry. Further, creasing the first layer of facing material intermittently can include intermittently creasing the first layer of facing material in a substantially linear fashion extending in a first direction of the first layer of facing material so that the first layer of facing material exhibits a linear series of creased portions extending in the first direction of the first layer of facing material and a series of portions that are not creased extending in the first direction of the first layer of facing material.

Abstract: The present invention relates to the manufacturing of honeycomb sandwich panels. Particularly a two component polyurethane adhesive having a Polyol P1 with a bisphenol-A or bisphenol-F moiety in its structure, a polyester or polyether Polyol P2, a heat-activated polyurethane catalyst CA and a polyisocyanate PI. The adhesive is remarkably well suited for the manufacturing of honeycomb sandwich panels showing particularly a short curing time combined with a long open time and good wetting and bonding properties.

Abstract: The invention concerns a sealing liquid comprising water and a penetration agent for sealing of mail pieces, the use of said sealing liquid as well as sealing devices and franking machines containing such a sealing liquid.

Abstract: A method for fabricating a grid-stiffened structure from fiber-reinforced composite materials. A skin is applied to a smooth, hard base tool. Ribs comprised of carbon-fiber tows are formed on the skin, and shallow cavities are formed between the ribs and the skin. An expansion block is placed in each of the cavities, and is held in place by an elastomeric contact adhesive having adhesive properties that are substantially diminished when the adhesive is heated to an elevated curing temperature. The assembly is then autoclave cured. After cooling, the formed structure is separated from the base tool and the expansion blocks are removed from the cavities. A grid-stiffened sandwich structure is formed by applying an outer skin over the ribs and expansion blocks, before curing the assembly. After cooling, the outer skin is removed to allow extraction of the blocks, and subsequently bonded to the ribs.

Abstract: [Problem] To provide a thermoplastic resin composition which is excellent in transparency and adhesion properties and hardly causes staining of an adherend after it is separated, a multilayer laminate using the composition, an article, and a method for protecting a surface of an article. [Means for solving problem] A thermoplastic resin composition (X) comprising the following components (A) to (C): (A) isotactic polypropylene containing not less than 90% by mol of propylene units, in an amount of 1 to 65% by weight, (B) a propylene copolymer which is a copolymer of propylene and at least one ?-olefin of 2 to 20 carbon atoms (excluding propylene) and whose melting point, as measured by DSC, is lower than 65° C.

Abstract: One embodiment provides an attachment pad including a multilayer thermo-reversible adhesive including a shape memory polymer layer and a dry adhesive layer underlying the shape memory polymer layer, the multilayer thermo-reversible adhesive having a curved surface when the shape memory polymer layer is below its glass transition temperature and unaffected by a load; and a means for evenly applying a load and/or detaching force on the perimeter of the multilayer thermo-reversible adhesive including a spring.

Abstract: Adhesive material and adhesive parts are formed according to the present invention along with used therefore. The adhesive parts typically include a handling layer.