Abstract: A composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body and first and second external electrodes, and the ceramic chip is disposed below the multilayer ceramic capacitor and includes a second ceramic body having first and second terminal electrodes. The multilayer ceramic capacitor and the ceramic chip are coupled by solder disposed between the first and second external electrodes and the first and second terminal electrodes, and each angle (?) defined by inner side surfaces of the solder, respectively disposed on inner ends of bent portions of the first and second terminal electrodes disposed on an upper surface of the second ceramic body, and an upper plane of the second ceramic body of the ceramic chip satisfies 45 degrees or less.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween, and an external electrode disposed on the body and connected to the internal electrodes . An end portion of at least one of the internal electrodes in a longitudinal direction of the body is thicker than a central portion of the internal electrode, and a ratio t2/t1 of a thickness t2 of the end portion to a thickness t1 of the central portion satisfies 1.1?t2/t1?1.5.

Abstract: A composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which dielectric layers and internal electrodes disposed to face each other with one of the dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on opposite end portions of the first ceramic body, respectively. The ceramic chip is disposed below the multilayer ceramic capacitor, and includes a second ceramic body including ceramic and first and second terminal electrodes disposed on opposite end portions of the second ceramic body, respectively, and connected to the first and second external electrodes, respectively. A ratio (T1/T2) of a thickness (T1) of the multilayer ceramic capacitor to a thickness (T2) of the ceramic chip satisfies 1.6?(T1/T2)?3.5.

Abstract: A multilayer ceramic capacitor includes a ceramic body including first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces, a plurality of internal electrodes disposed inside the ceramic body, exposed from the first and second surfaces, and having an end exposed from the third surface or the fourth surface, and a first side margin and a second side margin respectively disposed on the first and second surfaces, from which end portions of the plurality of internal electrodes are exposed. The first and second side margins include a base material powder of a barium titanate-based base powder and a subcomponent. The subcomponent includes terbium (Tb) as a first subcomponent including a lanthanide rare earth element, and a content ratio of the terbium (Tb) to a content of the first subcomponent (RE) excluding the terbium (Tb) satisfies 0.110?Tb/RE?2.333.

Abstract: Provided is a multilayer capacitor and a board on which the multilayer capacitor is mounted. The multilayer capacitor includes a capacitor body including first to six surfaces, first and second dielectric layers, and first and second internal electrodes; first and second external electrodes disposed on the first surface of the capacitor body; the first and second dielectric layers are alternately layered in a first direction such that the first internal electrode of the first dielectric layer overlaps the second internal electrode of the second dielectric layer in the first direction, and the second internal electrode of the first dielectric layer overlaps the first internal electrode of the second dielectric layer in the first direction.

Abstract: An electric storage device includes a case having a substantially rectangular shape including a cutout part. An electrode body is disposed in the case and includes a first electrode, a second electrode, and a separator disposed between the first and second electrodes. An electrolyte is located in the case and at least partially impregnating the electrode body. A first electrode terminal is located on a first part of a side surface of the case and is electrically connected to the first electrode by a first connection member which has elasticity in a direction extending from the first electrode terminal to the first electrode. A second electrode terminal is located on a second part of the side surface of the case and is electrically connected to the second electrode by a second elastic connection member which has elasticity in a direction extending from the second electrode terminal to the second electrode.

Abstract: A multilayer body of a multilayer ceramic capacitor includes first and second side margin portions that each have an average amount of grain boundary segregation of Ni larger than that an average amount of grain boundary segregation of Ni in a plurality of dielectric layers at a portion located in an inner layer portion of the multilayer body.

Abstract: A multilayer ceramic capacitor includes a capacitive element including ceramic layers and internal electrodes, and external electrodes on the capacitive element. The external electrodes include a Ni underlying electrode layer mainly made of Ni, a Cu plating electrode layer, and at least one second plating electrode layer. The Cu plating electrode layer includes a Ni diffused Cu plating electrode layer on a side closer to the Ni underlying electrode layer and including Ni diffused therein and a non-Ni diffused Cu plating electrode layer on a side closer to the second plating electrode layer and not including Ni diffused therein. The Cu plating electrode layer has a thickness of about 3 ?m or more and about 12 ?m or less and the non-Ni diffused Cu plating electrode layer has a thickness of about 0.5 ?m or more.

Abstract: A multilayer ceramic capacitor includes a multilayer body and outer electrodes. The multilayer body includes first and second multilayer ceramic structures and an intermediate body between the first and second multilayer ceramic structures, first to fourth connection electrodes electrically connecting first inner electrodes, second inner electrodes, third inner electrodes, and fourth inner electrodes, respectively, a first connection wire electrically connecting the first connection electrode and one of the third connection electrode and the fourth connection electrode, and a second connection wire electrically connecting the second connection electrode and the other connection electrode. A current route from the first connection electrode via the first connection wire to the one connection electrode and a current route from the second connection electrode via the second connection wire to the other connection electrode have different lengths.

Abstract: A capacitor according to one embodiment of the present invention relates to a thin film capacitor including a base member and a MIM structure provided on the base member. The thin film capacitor includes a first external electrode and a second external electrode that are electrically connected to the MIM structure. The base member has a plurality of through holes penetrating between a first surface and a second surface of the base member. The MIM structure includes a first portion extending along the first surface of the base member, a second portion extending along the second surface of the base member, and a third portion provided in the plurality of through holes of the base member so as to connect the first portion to the second portion.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.

Abstract: A lithium-ion capacitor (LIC) is provided which includes positive electrodes, negative electrodes pre-loaded on surface with lithium sources including lithium strips and ultra-thin lithium films having holes, separators and organic solvent electrolyte with lithium salt for high performance including high energy density, high power density, long cycle life, long DC life and wide temperature ranges. A method for making an LIC is also provided, where cell components important to optimize the electrochemical performance of LIC's are configured, said components include PE active material and binders, NE active material and binders, thickness/mass ratio of positive electrode (PE) to negative electrode (NE) active layers, PE and NE's size designs and layer numbers, types of material for Separators and NE pre-lithiation methods, NE pre-lithiation includes loading various lithium (Li) sources including lithium strips and ultra-thin lithium films having holes onto the surface of NE.

Abstract: An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.

Abstract: An electronic component includes a capacitor body having first to sixth surfaces, and including a plurality of dielectric layers and first and second internal electrodes; first and second external electrodes disposed on both ends of the capacitor body in a second direction in which the third and fourth surfaces oppose each other, respectively; a third external electrode disposed on the first surface of the capacitor body; and first to third metal frames connected to the first to third external electrodes, respectively, both ends of the first internal electrode are exposed through the third and fourth surfaces of the capacitor body, respectively, and the second internal electrode includes a lead portion exposed through the first surface of the capacitor body and connected to the third external electrode.

Abstract: A multilayer ceramic capacitor includes a laminate including a plurality of dielectric layers laminated one on the other, the laminate being in a cuboid or substantially cuboid shape. The multilayer ceramic capacitor includes external electrodes on the end surfaces of the laminate. A first inner electrode layer exposed through the first end surface and a second inner electrode layer exposed through the second end surface are provided on the dielectric layer. A first region and a second region are defined in the first inner electrode layer and the second inner electrode layer, in which coverages of the first inner electrode layer and the second inner electrode layer to the dielectric layer are greater in the first region than in the second region.

Abstract: Disclosed are apparatus and a method for providing an integrated multiterminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.

Abstract: A multilayer capacitor includes: a capacitor body formed by placing two or more stacked units in a row in a stacking direction of dielectric layers, each stacked unit including a plurality of dielectric layers, and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween; and first and second external electrodes disposed on the capacitor body to be electrically connected to the first and second internal electrodes, respectively, and, in the capacitor body, adjacent stacked units are disposed to allow surfaces with similar density to be adjacent to each other.

Abstract: An electronic component includes a multilayer capacitor and an interposer. First and second internal electrodes of the multilayer capacitor are such that 0.95?{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}?4.93, in which Lm2 is a distance between a first internal electrode and a fourth surface of a capacitor body, Lm1 is a distance between a second internal electrode and a third surface of the capacitor body opposite the fourth surface in a first direction, Wm1 is a distance between the first or second internal electrode and a second surface of the capacitor body, Wm2 is a distance between the first or second internal electrode and a first surface of the capacitor body opposite the second surface in a third direction, La is a length in the first direction of a region of overlap of the first and second internal electrodes, and Wa is a length in the third direction of the region of overlap.

Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes: a body; an electrode disposed on an end of the body in a first direction; a metal frame including a support layer bonded to the external electrode, a mounting portion extending in the first direction in a lower end of the support layer and having a protruding portion on a lower surface, and a coating film formed to cover an upper surface of the protruding portion on an upper surface of the mounting portion and including titanium (Ti).

Abstract: A multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrode layers laminated together in a lamination direction, and a pair of external electrodes on both end surfaces of the laminate, the external electrodes being connected to the internal electrode layers, wherein a barrier is provided on a widthwise end of at least one internal electrode layer, the barrier having a thickness that decreases from the widthwise end of the internal electrode layer toward a side margin in a width direction, a void is defined by the widthwise end of the internal electrode layer, the barrier, and the side margin, and the barrier contains Ni and Sn.