Abstract: A reactor device includes a coil, a magnetic core having the coil thereon, a case accommodating the coil and the magnetic core, a cooling plate fixed to the case, an insulating sheet disposed between the coil and the cooling plate, a compressible graphite sheet disposed between the coil and the cooling plate, and a screw to fix the cooling plate to the case. The case has a screw hole and an opening provided therein. The screw passes through the screw hole to fix the cooling plate to the case. The coil contacts the insulating sheet through the opening of the case. The graphite sheet contacts the cooling plate. The reactor has high cooling performance and reliability.

Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

Abstract: A solid electrolytic capacitor that includes a multilayer body element having a number of first layers that are laminated together, the multilayer body element having first and second main surfaces that oppose each other in a lamination direction, first and second side surface that oppose each other in a width direction, and first and second end surfaces that oppose each other in a length direction; a sealing portion covering the first and the second main surfaces and the first and the second side surfaces, wherein in the first layers, a cutting region is formed at an end of the multilayer body element on a side of the second end surface and a sealing portion filled with a sealing material in the cutting region is exposed at the second end surface.

Abstract: A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, and internal electrodes disposed between the ceramic layers, positions of end portions of the internal electrodes in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m in the second direction. The side margin includes a center portion in the first direction and a third direction orthogonal to the first direction and the second direction, and corner portions in the first direction and the third direction, the corner portions having a lower porosity than a porosity of the center portion, the side margin covering the multi-layer unit from the second direction.

Abstract: A multilayer ceramic electronic component includes a stacked body, and an external electrode including an underlying electrode layer containing a conductive metal and a glass component, a resin layer containing a thermosetting resin and no metal component, and a plating layer. The underlying electrode layer extends from a first or second end surface, and covers a portion of each of first and second main surfaces and first and second lateral surfaces. The resin layer covers the underlying electrode layer on the second main surface adjacent to the first or second end surface. The plating layer covers a portion of the surface of the underlying electrode layer that is not covered with the resin layer, and covers the surface of the resin layer.

Abstract: A multi-layer ceramic capacitor having a weight of 8 mg or more includes a capacitance forming unit and a protective unit. The capacitance forming unit includes internal electrodes that are laminated in a first direction and includes end portions, positions of the end portions in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m in the second direction. The protective unit covers the capacitance forming unit in the first direction and the second direction and includes an outer surface, a shortest distance between the outer surface and the end portion of an outermost layer in the internal electrodes in the first direction exceeding 10 ?m.

Abstract: A multilayer ceramic capacitor that includes a ceramic body including a stack of a plurality of dielectric layers and a plurality of internal electrodes; a first external electrode on a first end surface of the ceramic body and electrically connected to a first set of the plurality of internal electrodes; and a second external electrode on a second end surface of the ceramic body and electrically connected to a second set of the plurality of internal electrodes. The dielectric layer includes a plurality of dielectric grains including Ca, Zr, Ti and a rare earth element, P is present between the plurality of dielectric grains, and where at least a portion of the rare earth element is in a solid solution in the dielectric grains.

Abstract: A multilayer ceramic electronic component includes a multilayer body and a protective layer provided at least on a first main surface or a second main surface of the multilayer body, in which the protective layer includes a carbon material, has a carbon content of about 70 atm % or more determined through exclusion of hydrogen, oxygen, and halogen contents, and has a sp3 percentage of about 10% or more as an index of C—C bond type.

Abstract: A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894?L2/L1?1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894?L2/L4?1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183?LOA/LiA?0.309 is satisfied, where LiA represents a length of the first land in the longitudinal direction, and LOA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183?LOB/LiB?0.309 is satisfied, where LiB represents a length of the second land in the longitudinal direction, and LOB represents a thickness of solder on an end surface of the second electrode.

Abstract: In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on a side of a second external electrode in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first joining electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second joining electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.

Abstract: When internal electrode layers are viewed in a stacking direction, the internal electrode layers include an internal electrode main body portion defining an effective region, and an internal electrode lead-out portion that leads to a first or second end surface of a stacked body, and a length of the internal electrode lead-out portion in a width direction of the stacked body is less than or equal to about ½ of a length of the internal electrode main body portion. The internal electrode layer includes a first region having relatively high continuity of a conductive component defining the internal electrode layer, and a second region having relatively continuity of the conductive component. A central portion of the internal electrode main body portion is defined by the first region, and a portion of the internal electrode lead-out portion is defined by the second region.

Abstract: A distributed sensor system is disclosed that provides spatial and temporal data in an operating environment. The distributed sensor nodes can be coupled together to form a distributed sensor system. For example, a distributed sensor system comprises a collection of Sensor Nodes (SN) that are physically coupled and are able to collect data about the environment in a distributed manner. For example, a first sensor node and a second sensor node is formed respectively in a first region and a second region of the semiconductor substrate. A flexible interconnect is formed overlying the semiconductor substrate and couples the first sensor node to the second sensor node. A portion of the semiconductor substrate is removed by etching beneath the flexible interconnect such that the distributed sensor system has multiple degrees of freedom that support following surface contours or sudden changes of direction.

Abstract: A capacitor assembly has a capacitor, a first terminal, a cooling device and a housing which contains the capacitor. The first terminal has a first heat absorbing part and a first heat dissipating part. The first terminal dissipates heat from a first side of the capacitor to the cooling device via the first heat absorbing part and the first heat dissipating part. The first side of the capacitor faces away from the cooling device.

Abstract: An electrolytic capacitor includes a capacitor element. The capacitor element includes an anode including a dielectric layer thereon and a cathode member including a conductive polymer and in contact with the dielectric layer. The capacitor element is impregnated with a liquid containing at least one of polyalkylene glycol and derivatives of polyalkylene glycol. The liquid further contains an oxidation inhibitor.

Abstract: A capacitor component includes a laminate including dielectric layers and internal electrode layers, first and second external electrodes respectively provided on first and second end surfaces of the laminate, and a third external electrode provided on at least one of first and second lateral surfaces of the laminate. The internal electrode layers include a first internal electrode layer connected to the first external electrode and not connected to either the second or the third external electrode; a second internal electrode layer connected to the second external electrode and not connected to either the first or the third external electrode; a third internal electrode layer not connected to any of the first, the second, or the third external electrode; and a fourth internal electrode layer connected to the third external electrode and not connected to either the first or the second external electrode.

Abstract: A multilayer electronic component includes a body including dielectric layers and a capacitance forming portion and upper and lower cover portions respectively disposed on and below the capacitance forming portion, and including first and second surfaces opposing each other in a layering direction, an external electrode disposed on the third or fourth surface, connected to the first or second internal electrode, and including an electrode layer extending to a portion of each of the first and second surfaces and a conductive resin layer covering the electrode layer. Tp/Rmax is 30 or higher, in which Rmax is defined as a maximum surface roughness of each of the first and second surfaces on an end of the conductive resin layer, and Tp is defined as a thickness of each of the upper and lower cover portions.

Abstract: A multilayer ceramic capacitor includes a capacitive element including a stack of ceramic layers and internal electrodes, and external electrodes on a surface of the capacitive element. Each of the external electrodes includes a base electrode layer on the surface of the capacitive element and a Cu-plated electrode layer on a surface of the base electrode layer and including an edge portion facing the surface of the capacitive element. Sn is provided between the edge portion of the Cu-plated electrode layer and the surface of the capacitive element. On a surface of the Cu-plated electrode layer, at least one second plated electrode layer including an edge portion facing the surface of the capacitive element is provided.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.

Abstract: An electronic component includes a capacitor body having first to sixth surfaces, the capacitor body including a plurality of dielectric layers stacked in a first direction connecting the fifth and sixth surfaces and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes disposed on the first surface of the capacitor body, to be spaced apart from each other in a second direction connecting the third and fourth surfaces; and first and second metal frames connected to the first and second external electrodes, respectively. The first internal electrode includes a first lead portion exposed through the first surface of the capacitor body and connected to the first external electrode. The second internal electrode includes a second lead portion exposed through the first surface of the capacitor body and connected to the second external electrode.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.