Abstract: Specific management of configuration of overlap of facets reduces non-uniformity in an image outcoupled toward a nominal point of observation. A waveguide including at least two parallel surfaces, first, middle, and last partially reflecting facets are configured such that in a geometrical projection of the facets onto one of the surfaces the facets overlap, preferably with adjacent facets overlapping and non-adjacent facets starts and ends coinciding along at least a portion of the waveguide.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: The LIDAR chip includes a utility waveguide that guides an outgoing LIDAR signal to a facet through which the outgoing LIDAR signal exits from the chip. The chip also includes a control branch that removes a portion of the outgoing LIDAR signal from the utility waveguide. The control branch includes a control light sensor that receives a light signal that includes light from the removed portion of the outgoing LIDAR signal. The chip also includes a data branch that removes a second portion of the outgoing LIDAR signal from the utility waveguide. The data branch includes a light-combining component that combines a reference light signal that includes light from the second portion of the outgoing LIDAR signal with a comparative light signal that includes light that was reflected off an object located off of the chip.

Abstract: A semiconductor structure according to the present disclosure includes a buried oxide layer, a first dielectric layer disposed over the buried oxide layer, a first waveguide feature disposed in the first dielectric layer, a second dielectric layer disposed over the first dielectric layer and the first waveguide feature, a third dielectric layer disposed over the second dielectric layer, and a second waveguide feature disposed in the second dielectric layer and the third dielectric layer. The second waveguide feature is disposed over the first waveguide feature and a portion of the second waveguide feature vertically overlaps a portion of the first waveguide feature.

Abstract: A multi-fiber push on (MPO) optical connector includes a housing supporting a ferrule body. The ferrule body forms an optical connection with a second MPO optical connector. The ferrule body includes a connection end having a distal end face arranged to face the second MPO optical connector when the ferrule body forms the optical connection with the second MPO optical connector. The connection end of the ferrule body defines a recess extending proximally into the ferrule body from the distal end face. A plurality of optical fibers are received in the ferrule body. Distal ends of the optical fibers are adjacent to a proximal end of the recess such that the distal ends of the optical fibers are spaced apart from the second MPO optical connector when the ferrule body forms an optical connection with the second MPO optical connector. The distal ends of the optical fibers are coated with an anti-reflective material.

Abstract: The present invention relates to an optical shape sensing system, comprising an optical fiber sensor comprising an optical fiber having embedded therein a number of at least four fiber cores (1 to 6) arranged spaced apart from a longitudinal center axis (0) of the optical fiber, the fiber cores each having a resonance wavelength in response to light introduced into the fiber cores (1 to 6) in an unstrained state thereof. The system further comprises an optical interrogation unit (21) configured to interrogate the fiber cores (1 to 6) with light in a scan wavelength range including the resonance wavelengths of the fiber cores in an unstrained state of the fiber cores (1 to 6). The scan wavelength range is set such that a center wavelength of the scan wavelength range is decentered with respect to the resonance wavelength of at least one of the fiber cores (1 to 6).

Abstract: Thin, multi-focal plane, augmented reality eyewear are disclosed. An example lens structure includes a two-layer waveguide including a first waveguide and a second waveguide. The two-layer waveguide produces a virtual object based on light from an image source. The two-layer waveguide causes the virtual object to appear at a first virtual object focal plane. The first waveguide propagates more of the light in a first wavelength range than in a second wavelength range. The second waveguide propagates more of the light in the second wavelength range than in the first wavelength range. The first wavelength range is associated with longer wavelengths than the second wavelength range. The lens structure further includes an optical lens to cause the virtual object to appear at a second virtual object focal plane associated with a shorter apparent distance from a user than the first virtual object focal plane.

Abstract: A connector for attachment to a planar surface, said connector comprising a shell housing configured for attachment to said planar surface, an insert housing connected to said shell and defining two or more insert ferrule openings, at least one retainer attached to said insert housing and defining two or more retainer ferrule openings aligned with said insert ferrule openings, and two or more ferrule assemblies disposed within said two or more insert ferrule openings.

Abstract: One illustrative backscattering generator disclosed herein includes a low-reflection waveguide structure, a slot waveguide structure comprising a first waveguide, a second waveguide and a slot located between the first waveguide and the second waveguide, and a variable direction coupler operatively coupled to the low-reflection waveguide structure and the slot waveguide structure.

Abstract: According to the present invention, an optical device includes: a first electro-optical member and a second electro-optical member. The first electro-optical member has two convex portions spaced from each other by a recessed portion and a connecting portion arranged under the recessed portion to connect the two convex portions, the first electro-optical member exhibiting an electro-optical effect. The second electro-optical member has a recessed portion member arranged within the recessed portion, the second electro-optical member exhibiting an electro-optical effect. The permittivity of the first electro-optical member is higher than the permittivity of the second electro-optical member. The refractive index of the first electro-optical member is higher than the refractive index of the second electro-optical member. During application of an electric field, light to be transmitted is applied to the recessed portion member.

Abstract: A method of Silicon Selective Epitaxial Growth (SEG) applied to a Silicon on Insulator (SOI) wafer to provide a first region of customized thickness includes with the SOI wafer having a standard thickness, applying a hard mask to a plurality of regions of the SOI wafer including the first region; applying photo-lithography protection to cover the hard mask in all of the plurality of regions except the first region; removing the hard mask in the first region; and performing Silicon SEG in the first region to provide the customized thickness in the first region, wherein the customized thickness is greater than the standard thickness.

Abstract: The present disclosure generally relates to structures for use in optoelectronic/photonic applications and integrated circuit (IC) chips. The present disclosure also relates to semiconductor devices having a photodetector coupled with a waveguide, more particularly, a photodetector with a butt-end coupled waveguide. The present disclosure provides a structure having a substrate, a photodetector arranged above the substrate, the photodetector having a core body and a coupler that is adjacent to the core body, in which the core body is configured to absorb light received by the coupler, and the coupler including a plurality of grating structures having respective widths that vary as a function of position relative to the core body.

Abstract: A fiber node connector includes a first duct fitting and a second duct fitting. The first duct fitting is configured to be fixedly coupled with a flexible duct, to couple a nut with the flexible duct, to permit the nut to rotate relative to the flexible duct, and to permit limited relative axial movement between the nut and the flexible duct. The second duct fitting is configured to be axially and rotatably fixed to the flexible duct, to couple a connector body to the flexible duct, to permit the connector body to rotate relative to the flexible duct, and to permit limited relative axial movement between the connector body and the flexible duct.

Abstract: Structures for an optical component of a photonics chip and methods of forming a structure for an optical component of a photonics chip. The structure includes a slotted waveguide component having a first and second waveguide cores over a dielectric layer. The first waveguide core separated from the second waveguide core by a slot. The structure further includes a third waveguide core over the dielectric layer. The third waveguide core is positioned in a different level relative to the dielectric layer than the slotted waveguide component, and the third waveguide core and the first slot have an overlapping arrangement.

Abstract: A connector assembly includes housing and one or more light guide members. Each light guide member includes a tube body, an extension column, a positioning member, and a fixing member. The tube body is located on the housing. The extension column extends downward from the tube body to a rear side of the housing. The positioning member is located on the extension column and inserted into a rear wall of the housing. The fixing member is located on the extension column and inserted into the rear wall. The fixing member includes a first bump protruding from the extension column toward the rear wall and a hook structure located on the first bump. When each light guide member is assembled onto the housing, the first bump is inserted into the rear wall, and the hook structure is hooked into the rear wall.

Abstract: The present disclosure relates to a fiber optic adapter having a footprint/form factor compatible with an SC adapter mounting structure or an LC adapter mounting structure or both the SC and LC adapter mounting structures. The adapter body may include first and second co-axially aligned connector ports for respectively receiving first and second fiber optic connectors. The fiber optic adapter may also include a fiber alignment structure configured to accommodate at least 12 optical fibers (e.g., 12 non-ferrulized optical fibers) for each of the first and second connector ports. Another aspect of the present disclosure relates to a fiber optic adapter with linearly moveable, spring biased shutters. A further aspect of the present disclosure relates to a ferrule-less fiber optic connector that may include a telescopic shroud and a safety lock for locking the shroud in a fiber protecting position.

Abstract: Method of laser modifying an optical fibre to form a modified region at a target location within the fibre, comprising positioning at least a portion of an optical fibre in a laser system for modification by a laser, applying a correction to an active optical element of the laser system to modify wavefront properties of the laser to counteract an effect of aberration on laser focus, and laser modifying the optical fibre at the target location using the laser with the corrected wavefront properties to produce the modified region.

Abstract: A thin film transistor array panel includes a substrate; a plurality of gate lines that are formed on the substrate; a plurality of data lines that intersect the gate lines; a plurality of thin film transistors that are connected to the gate lines and the data lines; a plurality of color filters that are formed on upper parts of the gate lines, the data lines, and the thin film transistors; a common electrode that is formed on the color filters and that includes a transparent conductor; a passivation layer that is formed on an upper part of the common electrode; and a plurality of pixel electrodes that are formed on an upper part of the passivation layer and that are connected to a drain electrode of each of the thin film transistors.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a photonic die, an encapsulant and a wave guide structure. The photonic die includes: a substrate, having a wave guide pattern formed at front surface; and a dielectric layer, covering the front surface of the substrate, and having an opening overlapped with an end portion of the wave guide pattern. The encapsulant laterally encapsulates the photonic die. The wave guide structure lies on the encapsulant and the photonic die, and extends into the opening of the dielectric layer, to be optically coupled to the wave guide pattern.

Abstract: In an embodiment, a phase shifter includes: a light input end; a light output end; a p-type semiconductor material, and an n-type semiconductor material contacting the p-type semiconductor material along a boundary area, wherein the boundary area is greater than a length from the light input end to the light output end multiplied by a core width of the phase shifter.