Patents Examined by Michael Stahl
  • Patent number: 11360274
    Abstract: A photonic crystal fiber (PCF) assembly including a PCF and at least one ferrule structure. The PCF includes a core region and a cladding region and a first fiber end section with a first fiber end. The ferrule structure is mounted to the first fiber end section. The ferrule structure includes an inner ferrule arrangement and an outer ferrule arrangement surrounding the first fiber end section. The inner ferrule arrangement includes an inner ferrule front section proximally to the first fiber end and an inner ferrule rear section distally to the first fiber end, and each of the sections has an inner diameter and in at least a length thereof fully surrounds the PCF. The inner ferrule rear section is anchored in an anchor length section to the first fiber end section and the inner ferrule front section supports the first fiber end section proximally to the first fiber end.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: June 14, 2022
    Assignee: NKT PHOTONICS A/S
    Inventors: Thomas Tanggaard Alkeskjold, Jens Kristian Lyngsoe, Christian Jakobsen, Martin Dybendal Maack, Mattia Michieletto, Sidsel Rubner Papior
  • Patent number: 11353772
    Abstract: A photonic device structure includes: an electro-optical structure including a layer of optical material sandwiched by a pair of electrodes, wherein the layer of optical material is arranged to undergo an electro-optic activity when subjected to a voltage bias across the pair of electrodes; and a cladding layer adjacent to the electro-optical structure.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: June 7, 2022
    Assignee: City University of Hong Kong
    Inventors: Kin Seng Chiang, Jingdong Luo
  • Patent number: 11353668
    Abstract: An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: June 7, 2022
    Assignee: Cisco Technology, Inc.
    Inventors: Ashley J. M. Erickson, Vipulkumar K. Patel, Aparna R. Prasad
  • Patent number: 11353661
    Abstract: A device includes a module comprising an arrayed waveguide grating (AWG), and a filter having a filter input port, a filter output port, and a filter COMM output port. The filter is operable such that a first range of wavelengths entering the filter at the filter input port is directed to the filter output port and a second range of wavelengths entering the filter at the filter input port is directed to the COMM output port. The AWG includes an AWG input port optically coupled to the filter output port to receive the first range of wavelengths, and a plurality of AWG output ports.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: June 7, 2022
    Assignee: Nexus Photonics LLC
    Inventor: Tin Komljenovic
  • Patent number: 11353653
    Abstract: An optical waveguide apparatus including a first dispersion unit and a separation unit. The first dispersion unit is connected to the separation unit, the first dispersion unit is configured to disperse a frequency component of at least one first optical signal, and the separation unit is configured to separate, into at least one second optical signal based on configuration information, the frequency component that is of the at least one first optical signal and that is dispersed by the first dispersion unit. The separation unit is implemented by a variable optical waveguide, and the variable optical waveguide is an optical waveguide that implements at least one of the following functions based on the configuration information: forming an optical waveguide, eliminating an optical waveguide, and changing a shape of an optical waveguide.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: June 7, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Shiyi Cao
  • Patent number: 11353652
    Abstract: An electronic device may have a display overlapped by a cover layer. Portions of the surface of the display and cover layer may have curved profiles. The display may include a flexible substrate and may have bent edge portions protruding from a central region. Gaps may be formed between regions of pixels on a common substrate or between separate display panels. An image transport layer formed from a coherent fiber bundle or a layer of Anderson localization material configured to exhibit two-dimensional transverse Anderson localization of light may have an input surface that receives an image from adjacent display pixels and an output surface on which the image is displayed. The output surface may have a curved profile and may exhibit compound curvature. The input surface may have a profile with curved portions or other shapes. Image transport layers can be used to cover gaps between sets of pixels.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: June 7, 2022
    Assignee: Apple Inc.
    Inventors: Michael B. Wittenberg, Jean-Pierre S. Guillou, Tyler R. Kakuda, Christopher D. Prest, Marwan Rammah, Rasamy Phouthavong, Richard H. Dinh, Steven P. Hotelling, Yi Qiao, Michael J. Brown, Hao Dong, David A. Pakula
  • Patent number: 11347012
    Abstract: A telecommunications panel assembly (10) includes a chassis (14) defining a front (16), a top (20), a bottom (22), and two sides (24) and a plurality of adapter mounting modules (26) mounted to the chassis (14) at the front (16), each adapter mounting module (26) including a plurality of fiber optic adapters (36) mounted in a line. At least one of the adapter mounting modules (26) is mounted to the chassis (14) with a pair of supports (50) that are pivotable with respect to the at least one adapter module (26) such that the at least one adapter module (26) is removable from the chassis (14) and remountable at a position spaced linearly apart from another of the adapter mounting modules (26), wherein all of the adapter mounting modules (26) are also pivotally mounted about horizontal rotation axes (42) extending parallel to the top (20) and bottom (22) and transversely to the sides (24).
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 31, 2022
    Assignee: CommScope Connectivity Belgium BVBA
    Inventors: Johan Geens, Pieter Vermeulen, Bart Vos
  • Patent number: 11347006
    Abstract: A system for connecting a fiber optic connector to a fiber optic adapter includes various alternative improvements, including improvements to the shutter, the alignment device, and the adapter in general.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: May 31, 2022
    Assignee: CommScope Technologies LLc
    Inventors: Michael Aaron Kadar-Kallen, Michael Ward Zitsch, Dwight Andrew Bretz, Michael James Ott, Robert Charles Flaig
  • Patent number: 11340416
    Abstract: A fiber optic telecommunications device (2302/2402/2502) includes a first fiber optic connection location (2308) defined on the telecommunications device (2302/2402/2502), wherein a plurality of optical fibers (2307) extends into the telecommunications device (2302/2402/2502) from the first fiber optic connection location (2308). A plurality of second fiber optic connection locations (2309) are movably disposed on the telecommunications device (2302/2402/2502). A flexible substrate (2306/2506) is positioned between the first fiber optic connection location (2308) and the plurality of second fiber optic connection locations (2309), the flexible substrate (2306/2506) rigidly supporting the plurality of optical fibers (2307) and relaying the plurality of fibers (2307) from the first fiber optic connection location (2308) to each of the second fiber optic connection locations (2309).
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: May 24, 2022
    Assignee: CommScope Connectivity Belgium BVBA
    Inventors: Johan Geens, Kristof Vastmans, Pieter Vermeulen, Eric Marcel M. Keustermans
  • Patent number: 11333950
    Abstract: An optical module of a configuration that ensures use of commercially available electronic components and reduction of the number of current generation circuits and electric wirings. The optical module includes an electronic component mounted on a separate board from a light wave circuit board provided with an optical component such as an optical switch, and they are each electrically connected by wire bonding. For this reason, the optical module can use a commercially available electronic component. In addition, the module has a configuration in which heaters of optical switches, which do not simultaneously flow currents, are grouped and a current from one current generation circuit is supplied to any one of the heaters in the group by means of one electrical switch. For this reason, the optical module does not have to be prepared with the same number of electrical switches and current generation circuits as the number of heaters.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: May 17, 2022
    Assignee: NTT ELECTRONICS CORPORATION
    Inventors: Atsushi Kusayama, Yasuyuki Nanaumi, Kiyoshi Kido, Yuji Akahori
  • Patent number: 11327262
    Abstract: Certain types of fiber termination enclosures include an enclosure and at least one of a plurality of plate module mounting assemblies. Example plate module mounting assemblies include a termination panel plate assembly; a splice tray plate assembly; a cable spool plate assembly; and a drop-in plate assembly. Example cable spool plate assemblies include a cable spool arrangement rotationally coupled to a mounting plate, which fixedly mounts within the enclosure housing. A stand-off mount element may be disposed on the front of the cable spool arrangement to rotate in unison with the cable spool arrangement. The stand-off mount element may include one or more termination adapters.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: May 10, 2022
    Assignee: CommScope Technologies LLC
    Inventors: Jonathan Walter Coan, Dennis Krampotich, Jonathan R. Kaml
  • Patent number: 11320256
    Abstract: Exemplary apparatus can be provided which can include a laser arrangement that is configured to provide a laser radiation, and including an optical cavity. The optical cavity can include a dispersive optical waveguide first arrangement having first and second sides, and which is configured to (i) receive at least one first electro-magnetic radiation at the first side so as to provide at least one second electro-magnetic radiation, and (ii) to receive at least one third electro-magnetic radiation at the second side so as to provide at least one fourth electro-magnetic radiation. The first and second sides are different from one another, and the second and third radiations are related to one another. The optical cavity can also include an active optical modulator second arrangement which can be configured to receive and modulate the fourth radiation so as to provide the first electro-magnetic radiation to the first arrangement.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: May 3, 2022
    Assignee: The General Hospital Corporation
    Inventors: Benjamin Vakoc, Meena Siddiqui
  • Patent number: 11320585
    Abstract: A plurality of waveguide structures are formed in at least one silicon layer of a first member. The first member includes: a first surface of a first silicon dioxide layer that is attached to a second member that consists essentially of an optically transmissive material having a thermal conductivity less than about 50 W/(m·K), and a second surface of material that was deposited over at least some of the plurality of waveguide structures. An array of phase shifters is formed in one or more layers of the first member. An array of temperature controlling elements are in proximity to the array of phase shifters.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: May 3, 2022
    Assignee: Analog Photonics LLC
    Inventors: Michael Robert Watts, Benjamin Roy Moss, Ehsan Shah Hosseini, Christopher Vincent Poulton, Peter Nicholas Russo
  • Patent number: 11320617
    Abstract: It is disclosed a connection box for housing a connection between a distribution cable and a drop cable of an optical access network. The connection box comprises an outer casing and a detachable connection plate, which may be completely housed therein. The outer casing comprises a fixing member for fixing the distribution cable. The connection plate comprises a first surface with a fixing member for fixing an end of the drop cable and a second, opposite surface with a connector holder for holding the optical connector between a distribution fiber extracted from the distribution cable and a drop fiber extracted from the drop cable. The perimeter edge of the connection plate exhibits an indentation forming a fiber passage allowing the drop fiber passing from the first surface to the second surface of the connection plate. It is also disclosed a method for connecting two optical cables using such connection box.
    Type: Grant
    Filed: November 23, 2017
    Date of Patent: May 3, 2022
    Assignee: PRYSMIAN S.P.A.
    Inventors: Fabio Abbiati, Gianluigi Radaelli
  • Patent number: 11314015
    Abstract: An MCF according to the disclosure has a structure preventing deterioration in quality of optical transmission signals. The MCF comprises cores, a common cladding, and a coating. Any of the cores has a coating leakage loss of 0.01 dB/km or more at a wavelength within a wavelength range of from 850 nm to 1700 nm. The coating includes a leaked light propagation suppressive coating layer having a first optical property or a second optical property to light with a wavelength within a wavelength range of from 850 nm to 1700 nm or from 1260 nm to 1625 nm. The first optical property is defined by, as an attenuation index of the light, an absorbance per 1 ?m thickness being 0.1 dB or more. The second optical property is defined by a product of absorbance per 1 ?m thickness and a thickness being 0.1 dB or more.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: April 26, 2022
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tetsuya Hayashi, Takuji Nagashima
  • Patent number: 11300729
    Abstract: An active medium piece (109), which has been taken out using a nanoprobe (108), is processed so as to match the shape of a nanoslot (104), and thus an active medium small piece (111) that is smaller than the active medium piece (109) is formed (a fourth step). For example, irradiation with an ion beam (110) is performed so that the active medium piece (109) is shaped (processed) into an active medium small piece (111) that has a three-dimensional shape suitable for being placed in the nanoslot (104). The active medium piece (109) is processed into the active medium small piece (111) in the state of being held by the nanoprobe (108).
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: April 12, 2022
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Eiichi Kuramochi, Hisashi Sumikura, Masaaki Ono, Akihiko Shinya, Masaya Notomi
  • Patent number: 11300728
    Abstract: Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: April 12, 2022
    Assignee: Cisco Technology, Inc.
    Inventors: Matthew J. Traverso, Jock T. Bovington, Ashley J. M. Erickson
  • Patent number: 11300734
    Abstract: Embodiments of the present invention are directed to an interlacing boot and methods of using the same to automatically interleave optical fibers in a two-row array, such from a two rows ferrule. In a non-limiting embodiment of the invention, the optical fibers are inserted into a first end of an interlacing boot in a first direction. The interlacing boot can include a guiding structure having one or more channels. Each channel can be adapted to receive a single optical fiber. Each channel can include a first end and a second end, and the second end can be offset with respect to the first end in a second direction orthogonal to the first direction. The interlacing boot can be pushed towards the ferrule to feed the optical fibers through the guiding structure. The first row of fibers can be physically offset from and interlaced with the second row of fibers by the guiding structure.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 12, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Barnim Alexander Janta-Polczynski
  • Patent number: 11294123
    Abstract: A modulator comprises one or more resonators. Each resonator has a light confining closed loop structure, such as a ring structure, and two, three or more electrodes associated with the light-confining structure, and may be a micro-resonator. An optical signal is modulated by a digital signal using the resonator. The procedure comprises obtaining the digital signal, mapping the signal using a mapping function to produce a transformed digital signal, the transformed digital signal being selected to produce, say linear, output from the resonator, inputting the transformed digital signal via electrodes onto the resonator; and modulating the optical signal via coupling from the resonator. Suitable mapping produces 16 QAM and other modulation schemes.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: April 5, 2022
    Assignee: Ramot at Tel-Aviv University Ltd.
    Inventors: Yossef Ehrlichman, Ofer Amrani, Shlomo Ruschin
  • Patent number: 11294135
    Abstract: High-connection density and bandwidth fiber optic apparatuses and related equipment and methods are disclosed. In certain embodiments, fiber optic apparatuses are provided and comprise a chassis defining one or more U space fiber optic equipment units. At least one of the one or more U space fiber optic equipment units may be configured to support particular fiber optic connection densities and bandwidths in a given 1-U space. The fiber optic connection densities and bandwidths may be supported by one or more fiber optic components, including but not limited to fiber optic adapters and fiber optic connectors, including but not limited to simplex, duplex, and other multi-fiber fiber optic components. The fiber optic components may also be disposed in fiber optic modules, fiber optic patch panels, or other types of fiber optic equipment.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: April 5, 2022
    Assignee: Corning Optical Communications LLC
    Inventors: Terry Lee Cooke, David Lee Dean, Jr., Harley Joseph Staber, Kevin Lee Strause, Alan William Ugolini