Abstract: An optical modulator includes a dielectric layer and a waveguide. The waveguide is disposed on the dielectric layer. The waveguide includes an electrical coupling portion, a slab portion, and an optical coupling portion. The slab portion is sandwiched between the electrical coupling portion and the optical coupling portion. The slab portion has at least two sub-portions having different heights. A maximum height of the slab portion is smaller than a height of the electrical coupling portion.

Abstract: An optoelectronic module includes a housing and a printed circuit board (“PCB”) positioned within the housing. A positioning member is coupled to the PCB and includes one or more receptacles each configured to receive and secure positioning of an optical component relative to the PCB. The positioning member may include a plurality of receptacles positioned relative to one another in an arrangement defining a vertical array of receptacles, a lateral array of receptacles, or both. In one form, an optical component, when positioned in a receptacle of the positioning member, is spaced from the PCB. The positioning member may be formed of a thermally insulative or thermally conductive material, and a number of optical fibers may be routed between the positioning member and the housing.

Abstract: A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.

Abstract: An optical fiber is contacted by a first guide part on the inside of a bend. The first guide part is disposed apart from a region of a fixing member from which the optical fiber is drawn out. Specifically, a first non-contact part in which the optical fiber does not contact a guide member is provided between the first guide part and the drawn out part of the optical fiber from the fixing member. The optical fiber also contacts a second guide part on the outside of the bend. The second guide part is disposed apart from the first guide part, and a second non-contact part in which the optical fiber does not contact the guide member is also provided between the first guide part and the second guide part.

Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.

Abstract: Ferrule assemblies having a lens array are disclosed. In one embodiment, a ferrule assembly includes a ferrule body and a fiber array ferrule. The ferrule body includes a first end face and a second end face, at least one cavity for receiving one or more optical fibers disposed between the first end face and the second end face, and at least one body alignment feature at an outer surface of the body. The fiber array ferrule includes a first end face and a second end face, an array of alignment holes extending between the first end face and the second end face, and at least one ferrule alignment feature at an outer perimeter of the fiber array ferrule. The second end face of the fiber array ferrule is coupled to the first end face of the body.

Abstract: An example photonic integrated circuit includes a transmitter circuit with a optical communication path to an optical coupler configured to couple with an optical fiber. The optical communication path has a propagation direction away from the transmitter circuit and towards the optical coupler. A counter-propagating tap diverts light sent by a light source backward against the propagation direction of the optical communication path. A photodiode receives the diverted light and measures its power level. The photodiode generates a feedback signal for the optical coupler and provides the feedback signal to the optical coupler. The optical coupler receives the feedback signal and adjusts a coupling alignment of the optical communication path to the optical fiber based on the feedback signal, which indicates the measured power level of the diverted counter-propagating light.

Abstract: A fiber optic cable clamp has two identical halves that snap together forming the clamp. The clamp can be made of thermoplastic materials and designed to permit stacking of multiple clamps without damaging the cables.

Abstract: The present invention provides a pin retainer comprising a base, and a retaining structure coupled to the base. The base has a through slot, two through-holes respectively formed at two opposite sides of an opening of the through-slot formed on a surface of the base for respectively accommodating guide pins, and first engaging structures respectively formed on two lateral surfaces of the base. The retaining structure has a pair of lateral plates slidably coupled to the two lateral surfaces. Each lateral plate has second engaging structure corresponding to the first engaging structure, and a positioning plate having a holding structure. The second engaging structure is combined with or released from the first engaging structure depending on the positions of the retaining structure. Alternatively, the present invention also presents an optical connector using the pin retainer.

Abstract: A patch panel includes a cabinet and a cassette. A pair of cassette guides is positioned within the cabinet. The pair of cassette guides are spaced along a lateral direction such that the cassette is receivable between the pair of cassette guides. The cassette is slidable along a transverse direction on the pair of cassette guides. At least one of the pair of cassette guides includes a first rail and a second rail that are spaced apart along a vertical direction. The cassette is slidable along the transverse direction between the first and second rails. Each end of the first rail is cantilevered such that each end of the first rail is moveable along the vertical direction.

Abstract: According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.

Abstract: An optical mode converter is disclosed. The optical mode converter includes a substrate and a luminescent layer on the substrate. The luminescent layer includes an optical waveguide and an inclined mirror at an end of the optical waveguide. A light signal passes through the optical waveguide and is reflected by the inclined mirror to penetrate into the substrate. A method for manufacturing the optical mode converter is also disclosed.

Abstract: The invention relates to a method for manufacturing a waveguide (2a, 2b) comprising: A supplying of a substrate (1) comprising a stack of a first layer (11) based on a first material on a second layer (12) based on a second material, and at least one sequence successively comprising: An etching of the first material, in such a way as to define at least one pattern (20, 22a) having etching flanks (200, 201), A smoothing annealing assisted by hydrogen in such a way as to smooth the etching flanks (200, 201) of the at least one pattern (20, 22a), A re-epitaxy of the first material on the pattern (20, 22a) based on the first material.

Abstract: A vertical directional coupler or switch comprising a lower and an upper waveguide, integrated with an optical phase change material disposed between the lower and upper waveguides to control a directional of optical coupling between the lower and upper waveguides.

Abstract: Fiber optic modules for managing optical fibers and optical connections. In some examples, multiple modules are stackable. In some examples, the modules are configured to facilitate cable/fiber routing. Stacking elements can be used to serially stack multiple modules together. Components, such as lids and covers of the modules, can be substituted for components of different configurations. The modules and stacking elements are configured to reduce/minimize space taken up by stacking.

Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.

Abstract: A fabrication-tolerant non-linear waveguide taper for a waveguide transition can be designed by computing the scattering rate associated with the waveguide transition as a function of waveguide width of the waveguide taper for each of multiple sets of parameter values characterizing the waveguide transition (e.g., a set of nominal parameter values and sets of parameter values associated with process corners representing process variations from the nominal parameter values), determining an envelope of the computed width-dependent scattering rates, and computing a non-linear taper profile of the waveguide taper based on the envelope.

Abstract: A power and optical fiber interface system includes a housing having an interior. A cable inlet is configured to receive a hybrid cable having an electrical conductor and an optical fiber. An insulation displacement connector (IDC) is situated in the interior of the housing configured to electrically terminate the conductor, and a cable outlet is configured to receive an output cable that is connectable to the IDC and configured to output signals received via the optical fiber.

Abstract: The invention relates to a device comprising a first optical Mach-Zehnder interferometric sensor (MZI1) with a large FSR, wherein a plasmonic waveguide (107) thin-film or hybrid slot, is incorporated as transducer element planar integrated on Si3N4 photonic waveguides and a second optical interferometric Mach-Zehnder (MZI2), both comprising thermo-optic phase shifters (104, 106) for optimally biasing said MZI sensor (MZI1) and MZI as variable optical attenuator VOA.

Abstract: Aspects described herein include a method comprising arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The method further comprises aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die comprises rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.