Abstract: A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

Abstract: A pluggable optical module includes: a casing with an internal space; a latching pocket disposed on a side wall of the casing; and a latch plane on a surface of the latching pocket. The surface is a beveled surface, and the beveled surface delimiting the latch plane has an angle of between 3 to 15 degrees.

Abstract: A passive optical alignment coupling between an optical connector having a first two-dimensional planar array of alignment features and a foundation having a second two-dimensional planar array of alignment features. One of the arrays is a network of orthogonally intersecting longitudinal grooves defining an array of discrete protrusions that are each in a generally pyramidal shape with a truncated top separated from one another by the orthogonally intersecting longitudinal grooves, and the other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the grooves, with protrusion surfaces of the cylindrical protrusions in contact with groove surfaces and the top of the discrete protrusions contacting the surface bound by the cylindrical protrusions.

Abstract: A photonic integrated circuit includes a substrate, an interconnection layer, and a plurality of silicon waveguides. The interconnection layer is over the substrate. The interconnection layer includes a seal ring structure and an interconnection structure surrounded by the seal ring structure. The seal ring structure has at least one recess from a top view. The recess concaves towards the interconnection structure. The silicon waveguides are embedded in the substrate.

Abstract: Methods and systems for generating a laser beam with different beam profile characteristics are provided. In one aspect, a method includes coupling an input laser beam into one fiber end of a multi-clad fiber, in particular a double-clad fiber and emitting an output laser beam from the other fiber end of the multi-clad fiber. To generate different beam profile characteristics of the output laser beam, the input laser beam is electively coupled either at least into the inner fiber core of the multi-clad fiber or at least into at least one outer ring core of the multi-clad fiber, or a first sub-beam of the input laser beam is coupled into at least into the inner fiber core of the multi-clad fiber and a second, different sub-beam of the input laser beam is coupled at least into the at least one outer ring core of the multi-clad fiber.

Abstract: A system including a sheath having a first end and a second end, at least one elongated member positioned within the sheath, the at least one elongated member extending at least between the first and the second end of the sheath, an anchor configured to be secured to the sheath, the anchor having a first dimension, and a stopper wall comprising an opening having an opening dimension, the opening dimension being smaller than the first dimension, wherein the opening is configured to receive the sheath when the anchor is secured to the at least one end of the sheath.

Abstract: An athermal arrayed waveguide grating includes a silicon-based substrate and an athermal arrayed waveguide disposed on the silicon-based substrate. The athermal arrayed waveguide includes a cladding layer and a waveguide chip layer, the waveguide chip layer is disposed on the cladding layer and has a refractive index greater than that of the cladding layer; the waveguide core layer includes multilayer structures having a periodic configuration, the multilayer structure includes two layers of silica material and a negative temperature coefficient material disposed between the two layers of silica material; the negative temperature coefficient material is used to compensate for a dimensional deformation of the silicon-based substrate after being heated.

Abstract: Handheld tools are provided for removing a wire from within an optical cable. For example, the handheld tool may be used to remove a copper wire from a fiber optic drop cable in an efficient manner without damaging other components of the fiber optic drop cable. Advantageously, the optical cable may be used immediately after the wire is removed without further steps by the technician, such as re-applying an outer protective sleeve, as is commonly required with known tools.

Abstract: An optical connector includes: at least a ferrule and n self-forming optical waveguides, wherein the ferrule includes n optical fiber insertion holes, and optical fibers are each inserted into and included in the optical fiber insertion holes, the number n indicates a natural number not including zero, there are variations in an angle of each optical fiber in a core axial direction and a core gap between adjacent ones of the optical fibers, an end surface of the ferrule is formed with roundness, and end portions of the self-forming optical waveguides are each optically connected to the optical fibers.

Abstract: An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.

Abstract: A receiver optical assembly includes: an optical platform, a receiver optical port and a wavelength division multiplexer being arranged along an optical path on the optical platform; a circuit board, a photodetector array being disposed on the circuit board; a mounting block, a focusing lens and an optical path shifter being disposed on t the mounting block, the mounting block being fixed on the circuit board, and the optical path shifter being placed above the photodetector array. Incident light containing a multi-channel optical signal enters through the receiver optical port, and the wavelength division multiplexer divides the incident light into a plurality of single-channel optical signal beams. The single-channel optical signal beams are coupled to photodetectors on the photodetector array after passing through the focusing lens and the optical path shifter on the mounting block.

Abstract: A waveguide display assembly comprises a waveguide, including an in-coupling grating configured to in-couple light of a first wavelength band emitted by a light source into the waveguide, and cause propagation of the light of the first wavelength band through the waveguide via total internal reflection. An out-coupling grating is configured to out-couple the light of the first wavelength band from the waveguide and toward a user eye. One or more diffractive gratings are disposed along an optical path between the in-coupling grating and the out-coupling grating, the one or more diffractive gratings configured to diffract light outside the first wavelength band out of the waveguide and away from the user eye.

Abstract: A photonics transceiver is described herein, wherein the photonics transceiver exhibits improved areal bandwidth density and improved energy per bit consumption relative to conventional photonics transceivers. The photonics transceiver achieves an areal bandwidth density of at least 5 Tbps/mm2 with an energy consumption of less than 500 fJ/bit (sum of energy consumed for both a transmitted bit and a received bit). The photonics transceiver is a multi-chip module, where chips in the multi-chip module are tightly integrated with one another. The multi-chip module includes light source, photodetector, photonics, and control/logic chips. The photonics chip includes transparent conducting oxide integrated optical modulators and multiplexers and demultiplexers based on MEMS-tunable optical ring resonators.

Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

Abstract: An assembled electro-optical switch module includes a package substrate. Four optical socket members are disposed respectively to the package substrate. Each optical socket member includes four sockets closely packed in a row. Each socket has a recessed flat region with topside land grid array (LGA) interposer connected to bottom side solder bumps and a side notch opening aligned to an edge of the package substrate at the corresponding edge region. Sixteen optical modules in four sets are co-packaged in the package substrate. Each set has four optical modules respectively seated in the four sockets of each optical socket member with top side LGA interposer. Four clamp latch members are applied to clamp each of the four sets of optical modules in respective optical socket members. A data processor device with 51.2 Tbps data interface is disposed to the package substrate and electrically coupled to each of the sixteen optical modules.

Abstract: An optical fibre includes a glass core, a glass cladding, a primary coating layer and a secondary coating layer. The glass cladding surrounds the glass core. The glass cladding has a cladding refractive index. The primary coating layer is sandwiched between the glass cladding and the secondary coating layer. The primary coating layer may have one of a primary in-situ modulus in the range of 0.1 to 0.2 mega pascal and a primary coating thickness in the range of 2.5 micrometers to 10 micrometers. The secondary coating layer may have one or more of the secondary in-situ modulus greater than or equal to 1.2 giga pascal and the secondary coating thickness in a range of 2.5 to 17.5 micrometers.

Abstract: An optical fiber bundle manufacturing apparatus includes: a winding member; a guide member movable in a direction parallel to a rotary axis, the guide member being configured to guide an optical fiber wire to any one of first winding positions, a converging winding position and second winding positions; and a processor configured to perform processing to move the guide member such that a first branching portion branching into p branches, a converging portion converging the first branching portion branching into p branches into one, a second branching portion branching into q branches, and a connecting portion connecting the first branching portion and the second branching portion are formed in this order by the optical fiber wire.

Abstract: An optical coupler includes a first waveguide including a first multi-mode waveguide section having a cross-section characterized by a first height and a first width that is greater than the first height and a second waveguide including a second multi-mode waveguide section having a cross-section characterized by a second height and a second width that is greater than the second height. The first multi-mode waveguide section is positioned adjacent to the second multi-mode waveguide section at least partially above or below the second multi-mode waveguide so that light entering the first multi-mode waveguide section is coupled from the first multi-mode waveguide section to the second multi-mode waveguide section. Methods for coupling light between waveguides with the optical coupler and optical devices that include the optical coupler are also described.

Abstract: Disclosed are an optical assembly and a manufacturing method therefor. The optical assembly comprises a laser component (2) and a crystal (1). The crystal (1) is disposed on the laser component (2). The laser component (2) is used to produce a laser beam. The crystal (1) is used to split the laser beam incident onto the crystal (1) so as to generate a first beam (15) and a second beam (16). The first beam (15) is used for front light emission and the second beam (16) is used for backlight monitoring. The optical assembly can split a laser beam to achieve the backlight monitoring function without adding a splitter film. It has good stability in light splitting and reduces the risk of failure in an optical device.

Abstract: An optical device includes a light source configured to provide illumination light and a waveguide. The waveguide has an input surface, an output surface distinct from and non-parallel to the input surface, and an output coupler. The waveguide is configured to receive, at the input surface, the illumination light provided by the light source and propagate the illumination light via total internal reflection. The waveguide is also configured to redirect, by the output coupler, the illumination light so that the illumination light is output from the output surface for illuminating a spatial light modulator.