Abstract: Crimp tooling for crimping a crimp barrel of an electrical terminal to a wire includes an insulation crimper having an insulation crimp profile for crimping an insulation barrel segment of the crimp barrel to insulation of the wire, a wire crimper having a wire crimp profile for crimping a wire barrel segment of the crimp barrel to a conductor of the wire, and a transition crimper between the wire crimper and the insulation crimper. The transition crimper has a blended profile segueing from the wire crimp profile to the insulation crimp profile. The blended profile is used for crimping a transition segment of the crimp barrel between the insulation barrel segment and the wire barrel segment.

Abstract: An apparatus for manufacturing a field pole magnetic body formed by laminating magnet segments produced by cutting and dividing a permanent magnet and to be arranged in a rotary electric machine includes a housing part adapted to successively house a plurality of the magnet segments having adhesive applied to cut surfaces with the cut surfaces facing each other and has an inner side surface adjacent to outer side surfaces of the housed magnet segments, and a pressing unit adapted to press the magnet segments housed in the housing part toward a bottom part of the housing part in a longitudinal direction. The magnet segments are restrained in a width direction and a thickness direction by the inner side surface of the housing part when the magnet segments are pressed by the pressing unit.

Abstract: The present invention relates to a method of producing a multilayer circuit board including: a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the film.

Abstract: A method for cleaving a plate-shaped workpiece formed with two or more linear recesses into three or more parts includes: a first positioning step of holding the workpiece by a positioning unit in place to position a first linear recess; a first clamping step of clamping one side of the first linear recess by a fixing clamp and the other side by a rotating clamp; a first cleaving step of moving back the positioning unit and rotationally separating the rotating clamp; a second positioning step of releasing the clamps and causing the positioning unit to position a second linear recess; a second clamping step of clamping one side of the second linear recess by the fixing clamp and the other side by the rotating clamp, and a second cleaving step of moving back the positioning unit and rotationally separating the rotating clamp.

Abstract: A computer program product for fabricating an optical assembly having stored computer readable program code including a first program to place a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate upon a horizontally movable stage of a flip-chip bonder, a second program to vertically move a clamp through the stage opening to place the waveguide exposed end in a vertical position, a third program to vertically downwardly move a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide, a fourth program to fixably mount the optical component to the substrate edge, and a fifth program to release the optical component from the bond head while moving the clamp vertically downward through the stage opening unbending the flexible portion of the substrate with the optical component mounted thereon.

Abstract: In manufacturing multilayer plastic laminates for printed circuits, a press with two surfaces exerts pressure under vacuum on a stack of laminates, the packs, alternated with separator plates made of anodized aluminum. The packs include prepreg layers. The metalizations present on the two sides of each pack are portions of a copper strip repeatedly folded 180° around each pack and each separator plate. A strong current circulates in the copper strip which heats the strip with resistive behavior: the heat causes the close fixing of the various layers. An auxiliary heater is applied to each surface of the press by element of an interposed insulating plate. This includes an aluminum plate with equidistant longitudinal holes containing the same number of armored candle-like resistors, connected in parallel. A main power supply provides direct current to the copper strip, two secondary power supplies provide alternating current to the two auxiliary heaters.

Abstract: A process for crimping stents includes a multi-stage process producing a desired stent retention and crimped profile in a reduced amount of time. The process achieves results by utilizing particular combinations of heat and pressure during the crimping process, which was found to produce the desired results.

Abstract: A method uses time-domain reflectometry to measure a signal reflection delay in a conductive trace formed on a specific passive printed circuit board, and uses the measured signal reflection delay as an index into a table storing a predetermined association between signal reflection delay and passive printed circuit board manufacturing information, wherein the table includes a plurality of predetermined signal reflection delay values, and wherein each of the predetermined signal reflection delay values is associated with unique passive printed circuit board manufacturing information. During manufacturing of the passive printed circuit board, a hole is drilled through the passive printed circuit board so that the hole intersects with the conductive trace and divides the conductive trace into a proximal segment extending from the connector to the hole and a distal segment that is electrically isolated from the proximal segment by the hole.

Abstract: Method for fabricating an electric miniature motor, substantially comprising a housing assembly, a rotor assembly, a power transmission and bearing assembly and a second bearing assembly, wherein the housing assembly comprises a housing tube having a division extending in the axial direction over an entire length of the housing tube, comprising the following steps of a) inserting a cylindrical core having a defined outer diameter into the housing assembly; b) adjusting an inner diameter of the housing assembly to an outer diameter of the core; c) fixing the inner diameter of the housing assembly by fixing the housing tube in an area of the division; and d) removing the cylindrical core.

Abstract: The invention relates to a method for fabricating a plug (18) formed from a plug housing (19) and elongate contacts (3), the contacts (3) comprising a bent longitudinal axis (23) inside the finished plug (18), characterized by: introducing front portions (3a) of the contacts (3) into contact receptacles (17) of a plug housing part (7); holding the plug housing part (7) by means of a first holding arrangement (15) of a plug fabrication device (20); holding rear portions (3b) of the contacts (3) by means of a second holding arrangement (21) of the plug fabrication device (20); pivoting the first holding arrangement (15) with the plug housing part (7) held thereby relative to the second holding arrangement (21) with the contacts (3) held thereby, whereby the longitudinal axis (23) of the contacts (3) is bent in the region between their front portions (3a) and their rear portions (3b).

Abstract: This invention is directed to a method of forming a patterned multi-piece insert for an ophthalmic lens. The method may include forming first insert front and back curve pieces. The method may further include depositing a conductive material onto one or both of the first insert front and back curve pieces and attaching an electronic component at least in part to the conductive material. The method may further include placing an adhesive material onto a surface of one or both of the first insert front and back curve pieces so that a first ophthalmic insert is sealed when the first insert front and back curve pieces are combined. The method may further include combining the first insert back and front curve pieces to form the first ophthalmic insert and applying a colorant to at least one surface of one or both of the first insert back and front curve pieces.

Abstract: A method for manufacturing a printed circuit board is disclosed, which comprises the following steps. A basic board having an upper surface and a bottom surface opposite to the upper surface is provided. A plurality of the electronic components temporarily disposed on the basic board is provided. At least one locating pin temporarily disposed on a place of the basic board is provided, in which the electronic components are not temporarily disposed on the place. Surface mount technology is used simultaneously to joint at least one locating pin and the electronic components on the basic board.

Abstract: A method for producing a radio frequency identification transponder includes forming a first groove in a conductive sheet such that a portion of said conductive sheet surrounds the first groove, attaching an RFID chip to the conductive sheet after the first groove has been formed such that the first groove is located between a first connecting element of the chip and a second connecting element of the chip, and forming a second groove in the conductive sheet after the chip has been attached so as to form an antenna element of said transponder.

Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

Abstract: Embodiments provide a horizontally movable stage, with an opening, of a flip-chip bonder, a substrate including at least one flexible portion and a waveguide, the waveguide exposed at one end edge of the substrate positioned upon the stage with the end edge over the opening, a vertically upwardly movable clamp sized to penetrate the stage opening and positioned underneath the stage, a vertically downwardly movable bond head above the stage opening, an optical component positioned in the head, a glue dispenser positioned to provide glue to either a mating surface of the substrate exposed end edge or a mating surface of the optical component, and a controller connected to the stage, clamp, head and dispenser, including a control circuit for positioning the substrate waveguide exposed end edge underneath the optical component while dispensing glue for fixably bonding the mating surfaces of the optical component and the substrate exposed end edge.

Abstract: This disclosure provides methods of fabricating a transducer array. The methods can include creating a lens shaped depression in a backing material, printing an electrode, printing a thick layer of lead zirconate titanate material, printing a ground electrode, and placing a plurality of equally spaced cuts into the depression.

Abstract: A method of manufacturing a laminated ceramic capacitor having a dielectric ceramic which contains, as its main constituent, a perovskite-type compound containing Ca and Zr and optionally containing Sr, Ba, and Ti, and further contains Si, Mn, and Al, and when the total content of Zr and Ti is regarded as 100 parts by mol, the total content (100×m) of Ca, Sr, and Ba meets 1.002?m?1.100 in terms of parts by mol, the Si content n meets 0.5?n?10 in terms of parts by mol, the Mn content u meets 0.5?u?10 in terms of parts by mol, and the Al content w meets 0.02?w?4 in terms of parts by mol, m and n satisfying ?0.4?100(m?1)?n?3.9.

Abstract: A method of manufacturing a stamped antenna includes providing a sheet of metallic material for a first partial stamping that forms an antenna including at least one pilot hole, traces, contacts, carriers connected to the traces, and tie-bars between the traces. The antenna is placed on a fixture having at least one fixture pin that is inserted through the at least one lot hole. A pressure sensitive adhesive including at least one die cut hole is placed on the fixture, with the fixture pin being inserted through the die cut hole aligning the antenna and the pressure sensitive adhesive such that an adhesive region of the pressure sensitive adhesive is positioned on the traces of the antenna. The pressure sensitive adhesive is then bonded to the traces of the antenna. A second complete stamping is then performed on the antenna, including pressure sensitive adhesive, to remove the carriers and tie-bars.

Abstract: A method of manufacturing an index device of a machine tool includes providing a jig having an outer periphery of the same outer diameter as an outer diameter of a motor for driving the index device, inserting the jig into a casing configured to house the motor for driving the index device prior to setting the motor into the casing, filling a material with higher thermal conductivity than the air into gap space created between the casing and the outer periphery of the jig through an opening provided in the casing; removing the jig from the casing when the material filled in the gap space becomes solidified; and setting the motor into the casing with the jig removed therefrom.

Abstract: The present invention is a method for producing ready to use RFID devices in a convenient and economical manner. The method in one embodiment includes a substrate having a first a second face and applying a pattern of adhesive to the first face of the substrate. A conductive foil is then laminated to the pattern of adhesive, and the conductive foil is cut to form a plurality of antenna patterns. A chip is applied to each of the antenna patterns. Printing is applied on the second face of the substrate to create distinct printed areas. Each of the printed areas is then read and the information is matched with each of the distinct printed areas to information encoded in each of the chips. Finally, each distinct printed area is separated from the substrate.