Abstract: An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.

Abstract: A method of manufacturing a rotor for an electric motor that includes producing a generally flat metal strip, bending one section of the strip relative to another section, and rolling the strip to form a cup-shaped shell.

Abstract: A method facilitates transmission of electric signals across well components which move relative to each other in a wellbore environment. The method utilizes well components which are movably, e.g. rotatably, coupled to each other via one or more conductive bearings. Each conductive bearing has a conductive rolling element which enables relative movement, e.g. rotation, between the well components while simultaneously facilitating transmission of electric signals through the bearing. The method also involves coupling portions of the bearing to each of the well components, and those bearing portions may be connected with electric leads to enable flow of electric signals through the bearing during operation of the system downhole.

Abstract: A battery pack assembly and a method of making the same. The method includes using lifters with a cammed conveyor delivery mechanism to facilitate edgewise stacking of generally planar battery cells. The lifter spacing and cam profile are designed in such a way as to orient individual battery cell tabs and cooling fin assemblies to keep them close together but without applying significant forces to the stackable components. Combining conveyor streams allows components to be processed in parallel and sequenced correctly onto a single conveyor. Use of lifter integrated conveyor belt with cams and guides for individual battery cell orientation and sequencing promotes high speed assembly without a need to change component directions. The use of high-speed component delivery high is compatible with allowing more component placement variation, while the edgewise orientation of the components being assembled permits the use of small manufacturing footprints.

Abstract: A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Abstract: Systems and methods for personalizing prosthetic and orthotic devices are disclosed. In some embodiments, a method of personalizing a portion of a device configured to be worn by a wearer as at least one of a prosthetic or an orthosis may include facilitating an application of a wearer-selected artwork to the portion of the device. For example, in various specific embodiments, the facilitating an application of a wearer-selected artwork to the portion of the device may include creating a portion of material having a wearer-specified personalization artwork, and providing the portion of material having the wearer-specified personalization artwork to at least one of the wearer or a third party for application onto the portion of the device. In some embodiments, the portion of material may be provided to at least one of the wearer or a third party for application when the portion of the device is being fabricated.

Abstract: A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions.

Abstract: An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

Abstract: A method to form a pipe system which meets level II fire endurance standard according to IMO A 18/Res.753 fire testing protocol, for use in oil, gas, exploration, refining and petrochemical applications is provided. In the pipe system, each pipe section comprises a plurality of layers, an inner layer in contact with the corrosive petroleum product comprising a thermoplastic material, a structural layer comprising a composite material, and an outer layer comprising a fire resistive material. The method comprises applying energy to join the corrosion resistant layers of the separate pipe sections together forming a joint, applying an external wrap around the joint and at least a portion of the composite structural layers of the at least two pipe sections, and bonding the external wrap to the joint and the composite structural layers by chemical curing, thermal treatment, or combinations thereof.

Abstract: A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.

Abstract: A method of making articles from electrically active textiles. First and second fabric pieces include conductors therein. A seam is established between the first and second fabric pieces. A determination is made, at the seam, based on one or more predetermined factors, which conductors of the first fabric piece intersect or overlap with which conductors of the second fabric piece. At the seam, an electrical and mechanical connection is formed between select conductors of the first fabric piece and select conductors of the second fabric piece.

Abstract: A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.

Abstract: A method of fabricating an electric machine stator includes inserting one or more electrical coils into a form and partially curing the one or more electrical coils. The method also includes populating the electric machine stator with the one or more electrical coils and curing the electric machine stator with one or more electrical coils.

Abstract: A method of assembling an electromechanical device in a gas-turbine engine, including mounting a rotor of the device on a rotor support, securing a stator of the device to a stator support, coupling the rotor support to the stator support such that said rotor is rotatable about said stator, securing the device to a bearing support, securing a bearing assembly on the low pressure shaft, coupling the device to the low pressure shaft by installing the bearing support over the bearing assembly, and drivingly engaging the rotor support to the high pressure shaft.

Abstract: A PNP apparatus may include a robotic arm, and a PNP tool head carried by the robotic arm. The PNP tool head may include a body configured to apply bonding pressure to a first area of an electronic device, and a pick-up tip movable between an extended position and a retracted position relative to the body as the pick-up tip rests against a second area of the electronic device. The pick-up tip may define a vacuum passageway therethrough to couple a vacuum source to the second area of the electronic device.

Abstract: A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

Abstract: A Method and machine tool for compensating a wear of an electrode that machines a workpiece. The method includes selecting a current pocket from plural pockets of the workpiece; updating a wear compensation to be applied to the electrode for the current pocket based on wear compensation of a previous pocket, where the previous pocket is adjacent to the current pocket; and applying the updated wear compensation to the electrode for machining the current pocket.

Abstract: A thin film capacitor and a method of manufacturing the same are provided. The thin film capacitor includes a metal foil, dielectric layers and internal electrode layers alternately disposed on the metal foil, and a top electrode layer on the topmost layer among the two or more dielectric layers. These layers have peripheries that define an outer profile flaring toward the metal foil as viewed from the stacking direction of the thin film capacitor, and at least one dielectric layer of two or more dielectric layers satisfies a relationship B>A>0 wherein A is a gap of the periphery of the internal electrode layer directly below the dielectric layer protruding from the periphery of the dielectric layer, and B is a gap of the periphery of the dielectric layer protruding from the periphery of the internal electrode layer or the top electrode layer directly above the dielectric layer. The thin film capacitor has a structure free from short-circuiting and reducing debris of broken dielectric material.

Abstract: An auxiliary tool for assembling a number of voice coil motors includes a number of trays, a rod member, and two limiting members. Each tray defines a through hole. The rod member passes through the through holes of the trays. The two limiting members are sleeved over the rod member at two ends of the rod member, the trays being between the two limiting members, each two neighboring trays being configured for clamping a respective one of the voice coil motors.

Abstract: A method for forming an armature for an electric motor includes: securing a lamination stack having slots therein on an armature shaft, securing a commutator on one end of the armature shaft, winding magnet wires in the slots in the lamination stack and securing ends of the magnet wires to the commutator, the magnet wires having armature lead wires that extend from the slots to the commutator; and molding plastic over the magnet wires to encase at least the armature lead wires in plastic. Alternatively and/or additionally, plastic is molded over the magnet wires to retain them in the slots and to support the armature lead wires and prevent them from vibrating when the armature rotates during operation.