Abstract: In a method of identifying a direction of stacking in a stacked ceramic capacitor, while density of magnetic flux generated from a magnetism generation apparatus is measured with a magnetic flux density measurement instrument, a stacked ceramic capacitor is caused to pass between a magnetism generation apparatus and the magnetic flux density measurement instrument and variation in magnetic flux density at least at the time of passage of the stacked ceramic capacitor is measured. Based on a result of measurement of magnetic flux density, a direction in which a plurality of internal electrodes are stacked in the stacked ceramic capacitor is identified.

Abstract: A cutting machine for producing lamina elements includes a cutting mechanism for cutting out a first lamina element from a foil at a first position within the foil and for cutting out a second lamina element from the foil at a second position within the foil. With respect to a centerline of the foil the first position has a first distance and the second position has a second distance being different to the first distance. The cutting machine is adapted for releasing the cut out first lamina element and the cut out second lamina element, such that by utilizing the gravitational force the first lamina element and the second lamina element are transferred to a container, in which they are arranged in a stacked and in an aligned manner with respect to each other.

Abstract: This invention describes a process flow and method to assemble triple IG units without contaminating the center glass lite. A non-contact vacuum pad is used to lift a glass lite off from a horizontal or vertical support that conveys it from a glass washer to an assembly station. Each of multiple pads has a capacity to lift approximately seven to ten pounds. Use of multiple pads per glass sheet or lite allows lites having dimensions up to 70 by 100 inches (assuming glass thickness of one quarter inch) to be assembled.

Abstract: Antenna structures may be customized to compensate for manufacturing variations in electronic device antennas. The antenna structures may include an antenna resonating element and a ground. Customizations may be made to the antenna structures by performing customization operations such as adding material, removing material, deforming material, and making electrical adjustments. Customizations may be performed to a conductive antenna resonating element structure, to a ground structure, or to associated antenna structures such as parasitic antenna elements. During manufacturing operations, antenna structures may be characterized by making radio-frequency antenna performance measurements. Antenna performance can be compared to desired performance levels and compensating customizations for the antenna structures can be identified. Customized antenna structures can be installed in electronic devices during manufacturing to produce devices that meet desired specifications.

Abstract: An antenna electronics attachment system is disclosed. The antenna electronics attachment system includes a structural honeycomb panel having an array of cells. The antenna electronics attachment system further includes a nutplate coupled to a mounting plate via a plurality of embedded fastening structures. The mounting plate is shaped to fit substantially precisely to a cell of the structural honeycomb panel. The antenna electronics attachment system also includes an electronic component coupled to the nutplate. And, the antenna electronics attachment system further includes mechanical-electronic coupling means operable for change-out while in-service of the electronic component.

Abstract: A metal structure manufacture method for a multi-layer substrate comprises coating a photoresist layer on a first dielectric layer; proceeding a photolithography process to the photoresist layer to define a specific position for a first metal layer; removing the photoresist layer at the specific position; and forming the first metal layer at the specific position, wherein a base area of the first metal layer is larger than a top area thereof, and wherein the embedded base and the main body are formed in a same process and are monolithic formed. Said manufacturing method can be employed to manufacture a pad or a metal line of the flexible multi-layer substrate, and the manufactured metal structure cannot easily be delaminated or separated from the contacted dielectric layer.

Abstract: A method is provided which is suitable for manufacturing a solar module. When a defective solar cell (20a) is discovered in a solar cell string (25), a disconnecting step is performed to disconnect the wiring members (30a, 30b) bonded to the defective solar cell (20a) and to the solar cells (20b, 20c) adjacent to the defective solar cell (20a), and to remove the defective solar cell (20a) from the solar cell string (25). A reconnecting step is then performed to electrically connect the solar cells (20b, 20c) that were adjacent to the defective solar cell (20a) to a new solar cell (20d) by using new wiring members (34a, 34b), bonding each new wiring member (34a, 34b) using a resin adhesive to a region closer to the end than the region in which the disconnected end (30a1, 30b1) of the wiring member of the solar cell (20b, 20c) adjacent to the defective solar cell (20a) had been bonded in order to create a new solar cell string (25a).

Abstract: A storage device assembly fixture comprises a platform configured to receive an external cover for a storage device, the external cover having a first face and a second face generally parallel to and opposing the first face, the first face coupled to the second face at a back end of the external cover, the first face defining a first edge at a front end of the external cover opposite the back end, and the second face defining a second edge at the front end; a first finger configured to engage the first edge; a second finger configured to engage the second edge; and a pivot assembly coupled to the second finger, the pivot assembly rotatable about a pivot axis and configured to pivot the second finger away from the first finger.

Abstract: A method for producing one or more radio-frequency resonant patterns on a printed circuit includes a step of cutting one or more resonant patterns directly into the printed circuit while preserving means for mechanically securing the resonant patterns to said printed circuit. The method may be applied to the production of filters.

Abstract: A method for manufacturing a MEMS device includes the following operations. An SOI wafer including a device layer, an insulating layer and a handle layer is provided. The device layer is etched to form a recess and an annular protrusion surrounding the recess. A moving part and a spring of the MEMS device are formed on the recess by etching the device layer, the insulating layer and the handle layer. An anchor of the MEMS device is formed at the annular protrusion by etching the device layer, the insulating layer and the handle layer. The moving part and the anchor are connected to each other by the spring. The insulating layer is disposed between a first conductive portion and a second conductive portion of the moving part. The insulating layer is disposed between a first conductive portion and a second conductive portion of the anchor.

Abstract: A method of constructing a dipole antenna assembly is disclosed. The method includes providing a pair of mold halves and placing a feedline and a radiating portion within a cavity formed by the pair of mold halves, the radiating portion including a proximal portion and a distal portion separated from the proximal portion. The method further includes mating the pair of mold halves together to house the feedline and radiating portion within the cavity. A polyimide material may be injected through at least one inflow slot disposed through the mold halves into the cavity to adhere the distal portion to the proximal portion.

Abstract: A workpiece mounting apparatus includes a transfer apparatus having a nozzle, a first imaging unit, and an image processor. The nozzle has opposed first and second ends, a suction hole at the first end, and a transparent end face member sealing the second end. The first imaging unit captures a first pattern for positioning a workpiece. The image processor identifies a reference position of the workpiece based on the first pattern captured. The workpiece mounting apparatus also includes a substrate support supporting a substrate with a second pattern for positioning, a second imaging unit for capturing the second pattern, and a positioning unit for controlling position of the nozzle. The image processor identifies a mounting target position on the substrate, based on the second pattern capture, and the positioning unit controls the nozzle to mount the workpiece on the substrate, when the reference position coincides with the mounting target position.

Abstract: The present invention relates to a method of manufacturing an LED module, which enhances heat dissipation efficiency of the LED module through a configuration of installing a plurality of electrically separated conductive electrode plates to be close to each other on a same plane, stacking insulation layers on the top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and then grounding both electrodes of LED chips to the separated electrode plates.

Abstract: An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.

Abstract: A terminal treatment method for a coaxial cable including a core member having an inner conductor covered with an insulator, an outer conductor provided around the core member and formed of a plurality of wires, and a sheath covering an outer circumference of the outer conductor, includes exposing the outer conductor by removing the sheath on an end portion of the outer conductor, and widening a terminal of the outer conductor away from the core member by compressing a terminal-near portion of the exposed outer conductor from an outer circumferential side of the coaxial cable to deform the terminal-near portion of the exposed outer conductor.

Abstract: A terminal crimping device includes crimp tooling including an anvil and a ram movable toward the anvil. A crimp zone is defined between the anvil and the ram that receives a wire and a terminal configured to be crimped to the wire by the crimp tooling. An ultrasonic transducer assembly is held by at least one of the anvil and the ram. The ultrasonic transducer assembly is ultrasonically coupled to the terminal and is ultrasonically isolated from the crimp tooling. The ultrasonic transducer assembly may directly engage the terminal. The terminal crimping device may include an isolation member ultrasonically isolating the ultrasonic transducer assembly from the crimp tooling.

Abstract: A shear guide for a terminal crimping machine includes a body having a shear edge configured to face a terminal used to splice a magnet wire and a lead wire. A magnet wire channel is formed by the body and is configured to receive and hold the magnet wire. A lead wire channel is formed by the body and is configured to receive and hold the lead wire. The lead wire channel is vertically offset with respect to the magnet wire channel. The body may include a platform and a separating wall positioned vertically above the platform with a slot defined between the separating wall and the platform. The slot may receive the magnet wire and the separating wall may support the lead wire above the separating wall.

Abstract: A motor housing assembly is formed by positioning a stator relative to a motor housing to configure a fillable gap between the stator and the motor housing, and filling the fillable gap is at least partially with a polymeric material to form a thermally conductive layer. The polymeric material may include a metallic filler material. The thermally conductive layer is in contact with an exterior surface of the stator and an interior surface of the motor housing adjacent the exterior surface of the stator, and is configured to cover at least half of the exterior surface. A method to form the thermally conductive layer includes injecting a high flow polymeric material through a port defined by the housing and in fluid communication with the fillable gap.

Abstract: A method for manufacturing an electric motor stator, including: attaching a hollow bracket to an end of a hollow stator core and allowing a lead connected to the winding to pass through an opening formed in a peripheral surface of the bracket to take out the lead to an outside of the bracket; placing a core material inside the stator core and the bracket; attaching a sealing member to an outer peripheral surface of the bracket so as to block the opening while allowing the lead to pass through the through-hole; and filling a molten resin into an annular space between the stator core and the core material and between the bracket and the core material, to form a resin unit.

Abstract: In a particular embodiment, a method of manufacturing a printed circuit board (‘PCB’) with reduced dielectric loss includes fabricating conductive traces disposed upon layers of dielectric material; and fabricating the layers of dielectric material, including core layers and prepreg layers, with one or more of the layers of dielectric material including pockets of air that reduce an overall relative dielectric constant of the PCB. In the particular embodiment, the conductive traces are disposed upon layers of the dielectric material orthogonally with respect to one another and the pockets of air are aligned at an angle of 45 degrees with respect to the conductive traces.