Patents Examined by Minh Trinh
  • Patent number: 6216336
    Abstract: The present invention relates to an electronic parts mounting device designed to mount chip type electronic parts on a printed board. It is an object of the invention to provide a compact and high-speed electronic parts mounting device. To achieve this object, the present invention provides first and second drive systems (12) and (13) for driving first and second supplying portions (2) and (3) arranged on both sides of a table portion (6) and has arrangement pitches of suction nozzles (18) of each supplying portion, each of the drive systems (12) and (13), and each cassette (4) of the supplying portions identical with each other. This structure provides the compact and high-speed electronic parts mounting device.
    Type: Grant
    Filed: September 17, 1998
    Date of Patent: April 17, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takatoshi Mitsushima, Kunio Tanaka, Takashi Munezane
  • Patent number: 6217425
    Abstract: An apparatus for lapping a workpiece including a plurality of magnetic heads supported by a tool is disclosed. The lapping apparatus comprises a rotary lapping table, a lapping head attachment frame, an adjuster ring resiliently supported by the frame, a lapping head attached to the adjuster ring, a tilting assembly attached to the lapping head, and an up and down movable back plate pivotally attached to the lapping head. The apparatus further comprises first actuators or cylinders for correcting balance by applying forces on right and left sides of the pivotal point of the back plate, and second actuators or cylinders for correcting bow of the workpiece by applying operating forces on a plurality of predetermined locations of the tool so that the moving directions of movable parts of the second actuator means are substantially parallel with the directions of the operating forces.
    Type: Grant
    Filed: June 8, 1999
    Date of Patent: April 17, 2001
    Assignee: TDK Corporation
    Inventors: Hiroshi Shindou, Tetsuo Abe, Akio Ogawa, Tsugihiro Hasebe
  • Patent number: 6213846
    Abstract: A method is provided for detecting the endpoint of a film removal process such as chemical-mechanical polishing (CMP). The process uses a device having a shaft, and friction in the film removal causes torque on the shaft. Two axially displaced reflecting portions are provided on the shaft. Light reflected from these portions generates first and second reflected signals, respectively. A phase difference between the reflected signals is detected, and an output signal is generated in accordance therewith. A change in the output signal indicates a change in deformation of the shaft resulting from change in the torque, thereby indicating the endpoint of the film removal process.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: April 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Xinhui Wang
  • Patent number: 6209431
    Abstract: A general purpose molding and casting machine which will run unmanned to receive a casting assemblage and then separate the runners and sprue from the casting. Once the separation has taken place the casting is carried to the finished parts area and runners and sprue remnants are delivered to the scrap area for reuse.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: April 3, 2001
    Inventor: John L. Wickham
  • Patent number: 6209191
    Abstract: A disk material is plastic-formed to form an inner cylindrical portion of a rotor and a cover member which covers an end side of the rotor. After that, the disk material is slit inwardly from an outside thereof in a radial direction of the disk material to form an outer cylindrical portion of the rotor and a pulley corresponding portion which will be the pulley. Finally, the pulley corresponding portion is plastic-formed to form a pulley groove. Thereby, even when the location of the pulley relative to the outer cylindrical portion are different, same processes can be applied to these different type pulley integrated rotors until the disk material is slit. That is, many different type pulley integrated type rotors can be manufactured with low cost while maintaining high concentric accuracy between the pulley and the rotor.
    Type: Grant
    Filed: July 31, 1998
    Date of Patent: April 3, 2001
    Assignee: Denso Corporation
    Inventors: Yasuo Tabuchi, Hiroshi Shohara, Yasuji Kasuya, Satoshi Kawakami
  • Patent number: 6206766
    Abstract: The invention relates to a grinding wheel for machining metal circular-saw blades at relatively high rotational speeds, which have machining areas which contain in particular hard materials, such as for example diamond or cubic boron nitride. The grinding wheels according to the invention are intended in particular to improve the centring at relatively high rotational speeds, and consequently to prevent true running problems as far as possible. The base body of the grinding wheel is of contoured design, at least on one side, in the radially outer area of a tool-mounting bore, and at least one centring element can be designed to engage in a formfitting manner in the correspondingly designed contours, so that the grinding wheel and a centring element on a tool spindle of a grinding machine are held together in a force-fitting manner.
    Type: Grant
    Filed: July 7, 1999
    Date of Patent: March 27, 2001
    Assignee: August Heinr. Schmidt GmbH & Co. KG Maschinenfabrik
    Inventor: Richard Schuller
  • Patent number: 6205646
    Abstract: An air-wound, coil-type, passive inductor includes a surface which allows the coil to be picked-up using a vacuum probe of a head of a pick-an-place machine and the surface does not interfere with adjusting the spacing between the loops of the coil for tuning the coil after the coil is attached to a circuit board. Terminal ends of the coil are placed on solder paste on interconnection pads on the circuit board, then the board is heated to reflow the solder, and then washed to remove the flux contained in the solder paste. The surface may be adapted to be removed or at least degraded by the heating, or the washing, or afterwards by a mechanical method of removal without damaging the coil.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: March 27, 2001
    Assignee: Philips Electronics North America Corp.
    Inventor: David H. Thibado
  • Patent number: 6203415
    Abstract: An improved multi-purpose, direct-drive, water-driven rotary tool having improved torque and power. The present invention includes a housing having a central cavity, an impeller with angled, beveled blades around its periphery, a drive shaft connected to a rotatable mounting pad or backing pad that contains a disk with a grinding or sanding surface that is removably attached thereto. A high pressure water inlet conduit includes a changeable nozzle to allow using the tool with different water sources. The water exiting the nozzle strikes the blades of the impeller, rotating the impeller, which rotates the backing pad and sanding disk. Water is strategically diverted through a bearing mounting plate having holes by a shroud or angular flange having an angular periphery that allows the expended water from the impeller to be efficiently expelled peripherally around the outside of the main cavity of the housing.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: March 20, 2001
    Inventors: Laura C. Torrance-Castanza, James J. Castanza
  • Patent number: 6203433
    Abstract: An object of the present invention is to relieve users of efforts to select play partners by themselves. Upon receipt of a game request, a game request response unit returns player request issuance timing information specifying time to issue a player request. A player selection processing unit determines combinations of games at a predetermined timing. Upon receipt of a player request, a player request response unit extracts information about opposing players of a user issuing the player request from a user information storage unit and returns it to a client as a response to the player request. A game request unit of the client outputs a game request to a server and receives player request issuance timing information from the server. When the time specified in the player request issuance timing information is reached, a player request unit outputs a player request to the server and receives information about play partners from the server.
    Type: Grant
    Filed: August 14, 1998
    Date of Patent: March 20, 2001
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Hiroshi Kume
  • Patent number: 6202293
    Abstract: A work holder assembly is provided for bonding wire to an electronic component in a package. The work holder assembly includes a base having a front wall and a back wall extending between a first end and a second end. The work holder assembly includes a fixture for removably securing the package to the base and a linear slide extending between the first and second ends of the base for moving the fixture between a wire bonding position, a heating position and a load/unload position. The work holder assembly also includes a gas heater supported by the base for directing heated gas onto the package when the fixture is in the heating position and a fixture heated connected to the fixture for heating and maintaining the fixture at a predetermined fixture temperature.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: March 20, 2001
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Alfred Schaller, Glenn Alan Quier
  • Patent number: 6195878
    Abstract: A method for mounting components using mounting heads for which a plurality of suction or mounting operating positions are set for suction nozzles in a state where the mounting head is at rest in a component supply position or component mounting position, it being possible to select any of these operating positions, comprising a first step of selecting a component supply position or component mounting position such that the amount of movement of component feeder holding components to be mounted, or the amount of movement of the substrate to the mounting position for the next component to be mounted becomes a minimum, and moving the component feeder or substrate accordingly; and a second step of selecting a suction nozzle position corresponding to the component suction position or component mounting position in the first step, whilst the mounting head is moving towards the component suction position.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: March 6, 2001
    Assignee: Matsushita Electrical Industrial Co., Ltd.
    Inventors: Kanji Hata, Shiro Oji, Shigetoshi Negishi, Makito Seno
  • Patent number: 6195883
    Abstract: A method provides for additive plating on a subcomposite having filled plated through holes. Fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through hole is plated and filled. Fine-line circuitry may be routed over landless, plated through holes thereby increasing the aspect ratio and the available surface area for additional components and wiring.
    Type: Grant
    Filed: March 25, 1998
    Date of Patent: March 6, 2001
    Assignee: International Business Machines Corporation
    Inventors: Anilkumar C. Bhatt, Voya R. Markovich, Irving Memis, William E. Wilson
  • Patent number: 6195884
    Abstract: A wire harness is made up of a plurality of partial harnesses. Each of the partial harnesses is arranged such that opposite end portions of a plurality of electric wires having terminals at ends thereof are retained in advance in U-shapes with predetermined intervals provided so as to correspond to a plurality of connectors into which the terminals are inserted, by a plurality of wire clamps juxtaposed at equal pitches on a wire clamping bar. The terminals at the ends of the plurality of electric wires in each of the partial harnesses are inserted into terminal accommodating chambers of predetermined connectors selected from the plurality of connectors, thereby aggregating the partial harnesses into a combined unit.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: March 6, 2001
    Assignee: Yazaki Corporation
    Inventors: Yutaka Miyamoto, Shigeji Kudo, Hiroo Suzuki, Tsutomu Nakayama, Jiro Aikawa
  • Patent number: 6196920
    Abstract: The playing of games with advertising over a network, such as the Internet, is provided. The system for on-line game playing and advertising includes one or more client machines, game servers with advertisement servers, together with at least one database server. One advertisement is displayed using the client machine immediately after a validated detection of the completion of the game is made by the game server. This advertisement is displayed using the client machine for at least a predetermined time interval during which the player is not provided with control for removing the advertisement. Another advertisement is displayed using the client machine at the time the game is being played using game elements, such as card backs and banners. Advertising data is stored related to each displayed advertisement including the identity of the advertisement, when the advertisement was displayed, and the reaction to the advertisement by each player playing the on-line game utilizing a client machine.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: March 6, 2001
    Assignee: Masque Publishing, Inc.
    Inventors: Charles W. Spaur, Edward Lappin, James M. Wisler
  • Patent number: 6196899
    Abstract: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads.
    Type: Grant
    Filed: June 21, 1999
    Date of Patent: March 6, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Dinesh Chopra, Scott E. Moore
  • Patent number: 6193616
    Abstract: The present invention is directed to improved cover compositions for golf ball construction and the resulting low modulus golf balls produced utilizing the improved cover compositions. The novel golf ball cover compositions of the invention comprise a blend of a relatively low amount of at least one hard ionomeric resins and a relatively large amount (i.e. from about 75 to about 85-90 percent) of at least one soft ionomer resin. When the cover compositions of the invention are utilized to manufacture golf balls, the golf balls produced thereby, exhibit properties of improved playability at low swing speeds without substantial sacrifices in durability and/or distance characteristics when compared to known hard-soft ionomer blends.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: February 27, 2001
    Assignee: Spalding Sports Worldwide, Inc.
    Inventors: Michael J. Sullivan, R. Dennis Nesbitt, Terence Melvin
  • Patent number: 6192574
    Abstract: A method of manufacturing a coil and attaching the coil to contact points of an electric circuit. One end of a winding filament is brought in a stretched state to a first position in a winding machine, the filament is wound to provide a coil, and the filament after the finished coil is stretched to a second position and cut. The first and second positions are located inwardly of the coil. A circuit fixture carrying an electric circuit at a third position, which corresponds to the first and second positions inwardly of the coil, is caused to collect the wound coil, and the filament ends are welded together at the contact points on the electric circuit. The ends of the winding filament are held firmly at the first and second positions, respectively, by means of a hole with subpressure in the winding machine, and at the third position by means of a hole with subpressure in the circuit fixture.
    Type: Grant
    Filed: May 11, 1999
    Date of Patent: February 27, 2001
    Assignee: Metget AB
    Inventor: Bengt Wargren
  • Patent number: 6192577
    Abstract: In a method for shielding electronics, a plurality of components to be shielded are arranged on a part of an assembly base to be shielded, each of the plurality of components having a first side including a first contact surface connectable to a common earth connection of the assembly base, each of the plurality of components further having a second contact surface, the plurality of components being arranged such that, for each of the plurality of components, the first side with the first contact surface faces out toward a periphery of the part of the assembly base. For each of the plurality of components, the first contact surface is connected to the earth connection. The plurality of components are shielded with a shielding device. For each of the plurality of components, the first contact surface is closer to the shielding device than the second contact surface.
    Type: Grant
    Filed: October 20, 1997
    Date of Patent: February 27, 2001
    Assignee: Telefonaktiebolaget LM Ericsson
    Inventor: Anders Larsson
  • Patent number: 6189210
    Abstract: A fixture for aligning the leads of SMT components with the corresponding pads of the printed circuit board, which is to receive such components, before soldering the leads to the pads. The fixture includes clamps for applying forces directly to the leads of the SMT components, alone or in conjunction with the clamping forces which are traditionally applied to the body of the component, the applied forces sufficient to seat the leads on the corresponding pads. In a preferred embodiment, the forces are applied by providing the fixture with a series of rocker-type clamps, each having an edge for engaging the several leads associated with a particular SMT component to be joined to the printed circuit board. The clamp is preferably constructed of a non-wettable material so that the edge of the clamp will not be wet by the molten solder during the soldering procedure, and the edge is preferably thin so that the clamping surface in contact with a particular lead is minimized.
    Type: Grant
    Filed: March 24, 1998
    Date of Patent: February 20, 2001
    Assignee: International Business Machines Corporation
    Inventors: Wilton L. Cox, Terry R. Richards, Robert W. Wagner
  • Patent number: 6185809
    Abstract: A method of manufacturing a diaphragm for an electroacoustic transducer which operates in accordance with the electrodynamic principle and has portions with different thicknesses made from a thermoplastically deformable material having a constant thickness, wherein, in a first work step, that portion of the diaphragm material which is to have the greater thickness in the finished diaphragm, is held by an inner positioning device, while the remaining area of the diaphragm is additionally held by an outer positioning device, and the remaining area of the diaphragm is pulled or stretched with the influence of tension and heat to reduce the thickness thereof. In a second workstep, the entire diaphragm is thermoplastically stamped in a mold.
    Type: Grant
    Filed: June 19, 1997
    Date of Patent: February 13, 2001
    Assignee: AKG Acoustics GmbH
    Inventor: Gino Pavlovic