Abstract: A voice coil motor is attached to a shaft, that is installed in a component holding head, to drive the shaft in an axial direction. Also, a detecting device is arranged to detect movement of the shaft. The supply of power to the voice coil motor is controlled on the basis of a detection result of the detecting device, whereby movement of the shaft in the axial direction is controlled. The movement of the shaft in the axial direction is accordingly correctly known.

Abstract: A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The method is adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier.

Abstract: An electronic parts insertion head including a supporting block, an insertion guide movable between first and second positions with respect to the supporting block and configured to guide a lead wire of an electronic part to an attaching hole of a printed wiring board in the first position, an insertion guide moving mechanism configured to move the insertion guide between the first and second positions, a cam capable of moving with respect to the supporting block, a cam follower arranged on the insertion guide and positioned to move along a cam face of the cam, and a cam position changing mechanism configured to change a position of the cam with respect to the support block, wherein the insertion guide changes a movement locus when the position of the cam is changed by the cam position changing mechanisms.

Abstract: In order to provide a thin film magnetic head having a high performance as well as a method of manufacturing the same, in which throat height TH of a pole portion and MR height MRH can be formed accurately to have desired design values for improving a surface recording density and reducing a side fringe magnetic flux during a writing, after forming a MR element on a substrate 41, 42, a first magnetic film 47 is formed on the MR element, a write gap layer 48 is deposited on the first magnetic layer, a thin film coil 50, 52 supported by a coil supporting insulating layer 51, 53 is formed, a second magnetic layer 54 is formed on the insulating layer, non-magnetic side walls 55a are selectively formed on side surfaces of a pole portion of the second magnetic layer, a part of the write gap layer in the vicinity of the pole portion and a part of the first magnetic layer are selectively removed by anisotropic etching to form a recess 56 while said pole portion and side walls are used as a mask.

Abstract: An improved method of manufacturing an electrical probe test head is provided for testing electrical circuits, such as, e.g., IC-chips and circuit boards. The test head can be employed in circuit testers, such as, e.g., circuit board testers and probe cards, to provide an electrical connection between the terminals of the circuit to be tested and external test circuitry. The method of manufacturing the test head includes selecting an electrical circuit having terminals arranged in a terminal pattern. Vertical probe pitch series sets are provided, each of which includes a plurality of electrically conductive rigid pins, which is made of a suitable material, such as, e.g., tungsten. Each of the rigid pins has a pin shaft and a pin contact tip. The pin contact tips are configured in a pin pattern corresponding to the terminal pattern, i.e., the pattern in which the terminals of the circuit to be tested are arranged.

Abstract: Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and reflowed. The pad configuration helps to center the solder ball and keeps the solder ball down in the desired position thereby minimizing variations in height of the resulting solder bumps. Also, the solder pad may include non-wettable surfaces defined by a non-wettable metal, a metal compound or a dielectric material. The non-wettable areas on the pad confine the solder and avoid the need for a separate solder mask.

Abstract: Component placement machine with a frame (1) and a transport device (2) for transporting printed circuit boards (3) in an X-direction, which transport device is provided with a transport belt (9) having an outer surface (13) on which printed circuit boards (3) are positioned. During the transport of printed circuit boards (3) as well as during the placement of components (6) on the printed circuit boards (3) an edge portion (12) of the printed circuit board which extends in the X-direction is retained between the outer surface (13) of the transport belt (9) and a contact surface (11) of the frame (1). The outer surface (13) of the transport belt has a relatively high coefficient of friction in contact with said edge portion (12) of the printed circuit board, whereas said contact surface (11) of the frame has a relatively low coefficient of friction in contact with said edge portion (12) of the printed circuit board.

Abstract: Connectors and electrical wires of a wire harness are temporarily arranged on a plate, and an interior panel on which fixtures are provided is set on the plate on which the wire harness is temporarily arranged. Connectors and electric wires are held by the fixtures, and the interior panel is separated from the plate, so that the wire harness is integrated with the interior panel. Since connectors and electric wires are positively held by the fixtures, the shape of the wire harness is not collapsed, and the fixtures are used not only as temporary fixtures but also as final fixtures to attach the wire harness onto the interior panel. Accordingly, when the automobile manufacturer attaches the interior panel to an automobile body, the wire harness is simultaneously incorporated into the automobile body.

Abstract: In a mounting system including a loading station having a transport conveyor for conveying printed circuit boards, a mounting machine for fabricating circuit devices by attaching electronic assemblies on printed circuit boards supplied thereto from said loading station, and a unloading station having a transport conveyor for conveying circuit devices supplied thereto from the mounting machine, the loading station includes a discriminating device for discriminating the kind or type of printed circuit boards and generating a discrimination signal for instructing the kind or type of the printed circuit board. A mounting process in the mounting machine in selectively set by the discrimination signal from the discriminating device. According to this mounting system, even when many kinds of circuit devices are fabricated by many kinds of printed circuit boards, mounting processes can be successively carried out by one mounting line.

Abstract: An electric-machine rotor is composed of a field coil, a pair of pole cores having a plurality of claw poles to enclose the field coil, a plurality of auxiliary permanent magnets disposed between the claw poles, a shaft fixed to the pair of pole cores, and a pair of slip rings connected to the field coil. The rotor is provided with a pattern on a surface of the pole cores for indicating the polarity of the claw poles when the field coil is energized.

Abstract: In a flip-chip bonding apparatus, a die inverting device is installed on an optical recognition device so that a vacuum suction chucking nozzle that is provided on the die inverting device can rotate in the direction of a pick-up position and in the direction of a die transfer position in an outside area of an open window of the optical recognition device, so that the bonding apparatus can be compact and has an improved precision of recognition of the amount of positional deviation of the die.

Abstract: A method of manufacturing a bead inductor prevents deformation of a metal coil or dislocation of the axis position of the metal coil caused by injection pressure at the time of injecting a molten resin material from a gate. A coil is fitted onto a coil supporting pin provided on a first lower mold used for injection molding in a cavity of the mold such that the inner periphery of the coil is in close contact with the coil supporting pin. A molten, resin material is injected into the cavity. Then, the coil supporting pin and the first lower mold are removed from the molded product, and a second lower mold without a coil supporting pin is provided for replacing the first lower mold. A molten resin material is injected into the space which had been occupied by the coil supporting pin. After removing the hardened resin molded product from the mold for injection molding, the end parts of the coil are cut so as to be exposed.

Abstract: A head assembly for a part mounting apparatus includes a housing, a plurality of rod housings installed to be capable of elevating with respect to the housing, a plurality of voice coil motors fixed to the housing to be capable of elevating the respective rod housings, a plurality of spindle motors, each having a part picking device at an end portion thereof, installed to be capable or rotating with respect to the respective rod housings and elevating together according to the elevation of the rod housings, a plurality of linear position transformers installed at the respective voice coil motors for detecting and controlling the position of elevation of each of the rod housings, a first pinion gear installed at the outer circumferential surface of the spindle unit to rotate the spindle unit, a rack gear engaged with the first pinion gear and reciprocating with respect to the housing, a rack gear driving motor installed at one side of the housing to linearly reciprocate the rack gear, and second pinion gear co

Abstract: An apparatus for transferring of integrated circuit devices or other devices into and/or out of a plurality of sockets includes at least one guide rod; a presser housing slidingly coupled to the at least one guide rod; a socket presser block movably coupled to the presser housing and a handle assembly. The presser block defines a matrix of cutouts and ribs and is configured to assume a first position in which the presser housing is slideable on the guide rod and a second position in which the matrix of cutouts is aligned with corresponding underlying sockets mounted to a board and in which at least some of the ribs push on the underlying sockets to retract contacts thereof to allow the devices to be transferred into and/or out of the underlying sockets through the cutouts.

Abstract: A system to smooth and radius a microhole in a workplace to calibrate the mircohole which comprises means for preconditioning a microhole with a liquid abrasive slurry at a first station, means for flowing a calibration fluid through the preconditioned microhole and means for flowing a slurry through the microhole for a predetermined time based on the flow rate of the calibration fluid.

Abstract: A golf ball having a cover, a core, and, optionally, an intermediate layer between the cover and the core and a method of making such a golf ball, where at least a portion of the core is formed from a core blend of an elastomer, a metal salt acrylate or diacrylate, and at least one low modulus ionomer terpolymer or acid terpolymer. The low modulus ionomer or acid terpolymer is present in the core blend in an amount of up to about 50 pph based on the weight of the elastomer.

Abstract: An applicator die for crimping open loop type terminals to wire leads comprising applicator housing, a plurality of blades and a plurality of housing. An applicator housing is provided which is extended or retracted vertically in response to an applicator force applied thereto. An insulation blade housing with an insulation blade and a core blade housing, with a core blade are movingly disposed inside the applicator housing. Prior to a crimping operation, the applicator housing is retracted and a terminal is moved into position and aligned with the insulation and core blades. A lead wire is also positioned inside the terminal. As the applicator housing descends in response to the applicator force, it pushes the lead wire down into contact with the terminal. A cam lever, acting under the influence of the applicator force, moves a cam vertically, bringing together complementary members of an insulation anvil and a core anvil.

Abstract: The fixture for dismounting a CPU from a portable-type computer system having a motherboard with a CPU-mounting location is provided. The fixture includes a first device capable of displacing, a second device and a third device. The second device receives the first device and limits the displacement of the first device. The third device is responsive to an external force and forces the first device to make displacement such that CPU is dismounted from the motherboard.

Abstract: Process for mechanical chemical polishing of a layer in a copper-based material using a polishing composition, characterized in that said polishing composition comprises an aqueous suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, the average diameter of which is comprised between 10 and 100 nm, the pH of the aqueous suspension being comprised between 1 and 5.

Abstract: Disclosed herein is a method of fabricating a high frequency thin film coil element having a main coil body composed of a rod shaped ceramic substrate, a thin metallic film layer covering the ceramic substrate, a conductor layer covering the thin metallic film layer, and a plurality of notches which being cut from the conductor layer down to the substrate thereon, and conductor terminals provided at two sides of the main coil body. A protecting layer covering the main body and an anti-oxidation layer, being cut in the similar way as the conductor layer, are sandwiched between the conductor and protecting layers of the main coil body.