Patents Examined by Minh Trinh
  • Patent number: 6421904
    Abstract: A method for using a template to cut an aperture in a planar member at the point where a fixture is to be installed by positioning the template on the planar member and cutting the planar member about the edge of the template.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: July 23, 2002
    Assignee: Genlyte Thomas Group LLC
    Inventors: Robert James Wedekind, Mark Owen Jones, Graham Michael Rippel
  • Patent number: 6418616
    Abstract: A method provides for additive plating on a subcomposite having filled plated through holes. Fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through hole is plated and filled. Fine-line circuitry may be routed over landless, plated through holes thereby increasing the aspect ratio and the available surface area for additional components and wiring.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: July 16, 2002
    Assignee: International Business Machines Corporation
    Inventors: Anilkumar C. Bhatt, Voya R. Markovich, Irving Memis, William E. Wilson
  • Patent number: 6408511
    Abstract: A method for providing an enhanced ball grid array attachment in low-temperature co-fired ceramic (LTCC) substrate is provided. A termination cup is formed in a substrate. The termination cup has a bottom formed by a termination pad over a via in a first tape layer and side walls formed by termination sides formed over side walls of a via in a second tape layer. A diffusion layer is formed over the termination cup. The diffusion layer helps to reduce the oxidation of the termination cup and to provide greater mechanical attachment strength. An electrically conductive adhesive may be used to connect a solder ball to the diffusion layer. Reflow then is used to complete the solder ball connection process.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: June 25, 2002
    Assignee: National Semiconductor, Inc.
    Inventor: Shaul Branchevsky
  • Patent number: 6401333
    Abstract: A method and apparatus (10) are used for manufacturing a wire structure wherein a wire (13) is three-dimensionally aligned at prescribed pitches. The method comprises the steps of providing one or more frame bodies (12) which have a prescribed thickness, peripherally of a rotary shaft (11). By rotating rotary shaft (11) about a rotation axis thereof, wires (13) are wound, at prescribed pitches, around frame bodies (12). Another frame body (12) is stacked on at least one existing frame body and wire (13) is wound thereon at prescribed pitches. The above steps are repeated to yield a wire structure having a wire aligned three-dimensionally and accurately at prescribed pitches.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: June 11, 2002
    Assignee: NGK Insulators, Ltd.
    Inventors: Tomio Suzuki, Ritsu Tanaka
  • Patent number: 6393694
    Abstract: A gripping device for positioning a component (47) on a substrate, comprising three fingers (1, 2, 3) arranged in a triangle (7), and a drive device for moving the fingers along parallel paths (4, 5, 6) relative to each other to grip or release a component. A middle finger (2) is movable in opposite directions with respect to the outer fingers (1, 3).
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: May 28, 2002
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Cornelis J. G. Roovers
  • Patent number: 6394330
    Abstract: A method of converting a web of indefinite length into a plurality of web portions by slitting the web at a transverse point prior to processing the web portions into a plurality of use supply forms (such as rolls), wherein the plurality of web portions are separated by a two-stage process. A first stage of the process is a partial separation operation that almost entirely separates the web portions, but leaves the web portions connected, such as by a slitting operation that leaves a series of connected zones. The second stage includes the complete separation, such as by breaking of the connected zones. The complete separation of the web portions preferably occurs near the station at which the use supply forms are created, such as a winding station. Thus, the web portions, after substantial separation at the first stage can be handled (for example, guided and tensioned) as if the plurality of web portions were a full width web.
    Type: Grant
    Filed: August 13, 1998
    Date of Patent: May 28, 2002
    Assignee: 3M Innovative Properties Company
    Inventor: Byron M. Jackson
  • Patent number: 6389681
    Abstract: Methods of forming an electric heating/warming composite fabric article include the steps of applying an electricity-conducting paste upon a surface in a predetermined pattern of an electric circuit, and curing the electricity-conducting paste to form an electric heating/warming element in the form of a flexible, electricity-conducting film defining an electric circuit, the electric heating/warming element being adapted for connection to a power source, thereby to generate heating/warming. The fabric article includes a fabric layer, and may include a barrier layer joined to or associated with a surface of the fabric layer. The electric circuit may be formed directly upon a surface of the fabric layer or upon a surface of the barrier layer. The circuit may be formed and cured upon the barrier layer before or after it is joined to the fabric layer.
    Type: Grant
    Filed: September 2, 1999
    Date of Patent: May 21, 2002
    Assignee: Malden Mills Industries, Inc.
    Inventors: Moshe Rock, Vikram Sharma
  • Patent number: 6385842
    Abstract: A tube feeder for feeding a plurality of components to a pick and place machine includes an elongated channel having a first end and a second end; the first end of the channel arranged so as to receive a component from a source of the component; the second end of the channel having a pick-up location; and the pick-up location including an elevated zone on which the component can pivot.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: May 14, 2002
    Assignee: Delaware Capital Formation, Inc.
    Inventor: Maurice M. Davis, III
  • Patent number: 6381833
    Abstract: A method for forming a top magnetic pole of an inductive magnetic head being begins with the step of forming a photolithographic material over a layer of insulating material at a hill region and gap region of the inductive magnetic head formed on a wafer and over a waste region of the wafer. Second, a mask is patterned on the photolithographic material defining a paddle region over the hill region, a feeder region over the waste region, and a trench region between the feeder region and the paddle region. The trench region extends over the gap region. Third solvent is admitted into the feeder region to flow in a laminar flow through the trench region to the paddle region to form the mask and expose a surface of the layer of insulating material in the paddle and trench regions of the mask.
    Type: Grant
    Filed: April 15, 1999
    Date of Patent: May 7, 2002
    Assignee: Seagate Technology LLC
    Inventors: Steven A. Mastain, Wallace A. Peck, Diana M. Simplair, Kurt A. Rothstein
  • Patent number: 6381837
    Abstract: A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: May 7, 2002
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Jay DeAvis Baker, Edward McLeskey, Delin Li, Cuong Van Pham, Robert Edward Belke, Vivek Amir Jairazbhoy, Thomas B Krautheim, Mohan R. Paruchuri, Lakhi Nandlal Goenka, Jun Ming Hu
  • Patent number: 6375547
    Abstract: A method of operating a fluid jet cutting machine with abrasive removal system. The fluid-jet cutting machine has a nozzle and a carrier assembly attached to the nozzole to move the nozzle along a cutting path. A high-pressure fluid source and an abrasive particle source are coupled to the nozzle to generate an abrasive fluid-jet having a fluid and a plurality of abrasive particles for cutting a work-piece. The cutting machine also has a particle removal device including a tank aligned with the nozzle, a settling container, and a fluid transport mechanism to transport fluid from the tank to the settling container. The tank includes at least one compartment configured to receive the fluid and the abrasive particles of the fluid-jet along at least a portion of the cutting path.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: April 23, 2002
    Assignee: Flow International Corporation
    Inventor: John C. Massenburg
  • Patent number: 6370764
    Abstract: An electronic-parts mounting apparatus includes an electronic-parts feeder. A mounting head operates for carrying electronic parts from the electronic-parts feeder. The mounting head includes a plurality of nozzles for holding the electronic parts respectively. An electronic-parts mounting portion operates for enabling the mounting head to mount the electronic parts on a circuit board. A first mechanism operates for rotating each of the nozzles. A second mechanism operates for moving each of the nozzles upward and downward. The first mechanism may include a pinion provided on an outer circumferential surface of each of the nozzles, and a rack meshing with the pinion.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: April 16, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoichi Kinoshita, Takashi Munezane, Kunio Tanaka, Shigeki Nakatsuka, Toshihiko Nagaya
  • Patent number: 6363607
    Abstract: A method of manufacturing a high density connector comprises five steps. The first step is to prepare essential elements of the connector, such as a dielectric cover, a metallic shell, a pair of guiding members and a plurality of contacts. Each contact is L-shaped and comprises a horizontal soldering portion. The second step is to first insert mold a pair of dielectric bases around the contacts to produce a contact subassembly. The three step is to second insert mold a dielectric housing around the contact subassembly to form a contact module. The forth step is to adjust the horizontal soldering portions of the contacts for ensuring a good coplanarity thereof. The fifth step is to assemble the contact module with the cover, the shell and the guiding members, thereby completing the connector.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: April 2, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chao-Hsu Chen, Ming-Wu Lee, Kun-Tsan Wu
  • Patent number: 6363605
    Abstract: A method for fabricating precision non-symmetrical L-shape waveguide end-launching probe for launching microwave signals in both vertical and horizontal polarizations is disclosed. The L-shape waveguide probe is in a form of thin plate, has a first arm and a second arm, and is precisely fabricated and attached to one end of the central metal pin of a feedthrough. The feedthrough is installed to an aperture formed in a major wall of the universal conductive housing to achieve hermetic sealing. The L-shape waveguide probe is aligned by means of a specially designed alignment tool so that long axis of the second arm is always perpendicular to the broad walls of the output waveguide, which is mounted to the universal housing with the broad walls of the output waveguide either horizontally or vertically. Hence, in this invention, an end-launching arrangement using the L-shape probes that could yield a flexible waveguide interface either in horizontal polarization or vertical polarization is provided.
    Type: Grant
    Filed: November 3, 1999
    Date of Patent: April 2, 2002
    Inventors: Yi-Chi Shih, Long Q. Bui, Tsuneo C. Shishido
  • Patent number: 6361411
    Abstract: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: March 26, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Dinesh Chopra, Scott E. Moore
  • Patent number: 6357110
    Abstract: A stud electrical connection method is provided that employs a stud having a patterned external surface and a nut operably secured to the stud in a radially compressive manner, wherein the patterned external surface of the stud comprises a nonconductive coating on a portion thereof. Accordingly, installation of the nut onto the stud creates an electrically conductive path between an attached conductive member and a panel.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: March 19, 2002
    Assignee: Emhart Inc.
    Inventors: Philip A. Shipp, Allen Dale Moring
  • Patent number: 6353998
    Abstract: A fixture for aligning the leads of SMT components with the corresponding pads of the printed circuit board, which is to receive such components, before soldering the leads to the pads. The fixture includes clamps for applying forces directly to the leads of the SMT components, alone or in conjunction with the clamping forces which are traditionally applied to the body of the component, the applied forces sufficient to seat the leads on the corresponding pads. In a preferred embodiment, the forces are applied by providing the fixture with a series of rocker-type clamps, each having an edge for engaging the several leads associated with a particular SMT component to be joined to the printed circuit board. The clamp is preferably constructed of a non-wettable material so that the edge of the clamp will not be wet by the molten solder during the soldering procedure, and the edge is preferably thin so that the clamping surface in contact with a particular lead is minimized.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: March 12, 2002
    Assignee: International Business Machines Corporation
    Inventors: Wilton L. Cox, Terry R. Richards, Robert W. Wagner
  • Patent number: 6354947
    Abstract: A screen-based host with processing and I/O facilities interacts with distributed items that are arranged for storing and exchanging digital information with the host. In particular, under proximity conditions and initially without user interaction, the items exchange accordingly with the host without requiring formatted berth facilities of the host. The various items through associated self-identifying evoke specific iconizing by the host for signaling to the user an associated service field. The host allows a user person to activate data processing operations with respect to the service field. During proximity conditions, the items keep abreast of host-generated results relevant to a corresponding service field. The host allows free styling of the items with respect to the item's physical shape.
    Type: Grant
    Filed: February 27, 1998
    Date of Patent: March 12, 2002
    Assignee: U.S. Philips Corporation
    Inventors: Christoph Dobrusskin, Jacoba J. Van Dorssen, Paul D. McGroary, Roger P. Swales, Jan P. C. Van Der Voet
  • Patent number: 6350199
    Abstract: A method and apparatus for an interactive video game to be displayed on a video display device. The gaming apparatus includes a game controller adapted to control the outcome of a game played on the gaming machine for display on the display device. A player interface is coupled to the gaming apparatus and is configured to input information data personally identifying a player operating the gaming machine. This personal identification data, such as a players name, birthdate, digitized facial pictures of player, etc., is then integrated into the game for integral display in the game outcome on the display device. Thus, player interaction is increased by customizing the game screen presentation to include their personal information.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: February 26, 2002
    Assignee: International Game Technology
    Inventors: James R. Williams, Timothy Gilbert
  • Patent number: 6345434
    Abstract: A process for the production of an inductor device comprising the steps of forming a green sheet to form an insulating layer; forming a plurality of conductive coil pattern units on the surface of the green sheet in order that a plurality of unit sections each including a single coil pattern unit are arranged on the surface of the green sheet and each two coil pattern units adjoining in the substantially perpendicular direction to the longitudinal direction of the unit sections are arranged centro-symmetrically with respect to a center point of a boundary line of adjoining unit sections; stacking a plurality of green sheets formed with the plurality of coil pattern units arranged in centro-symmetry and connecting the upper and lower coil pattern units separated by the green sheets to form a coil shape; and sintering the stacked green sheets. It is possible to obtain an inductor device able to suppress the stack deviation without complicating the production process even if the device is made small in size.
    Type: Grant
    Filed: July 2, 1999
    Date of Patent: February 12, 2002
    Assignee: TDK Corporation
    Inventors: Toshiyuki Anbo, Fumio Uchikoba