Abstract: This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.

Abstract: Various non-invasive sensors are adapted to be placed on a surface of an object having a volume with an internal region. The internal region of the object has internal properties indicated by corresponding internal parameters and an internal temperature distribution that is a function of the internal parameters and surface thermal signals. Each non-invasive sensor includes a heat flux sensor having one or more heat flux sensor output terminals to provide a measured heat transfer signal for the surface of the object, and a temperature sensor having one or more temperature sensor output terminals to provide a measured temperature signal for the surface of the object. Systems including one or more of the sensors perform non-invasive sensing of the object including accurate and rapid determination of an internal temperature distribution of the internal region of the object as well as one or more other internal properties of the object.

Abstract: Provided are a controller for a thermal analysis apparatus, with which thermal characteristics of a measurement target can be grasped, and a thermal analysis apparatus. A controller (51) for a thermal analysis apparatus, which is configured to measure thermal behavior accompanying a temperature change caused by one of heating and cooling of a measurement target (X, Y), is configured to: acquire an intensity of a response signal of the measurement target to an electromagnetic wave with which the measurement target is irradiated with respect to a variable of one of a time and a temperature; differentiate the intensity with respect to the variable; and output a derivative value obtained as a result of the differentiation with respect to one of the temperature and the time, or display the derivative value with respect to one of the temperature and the time on a predetermined display (53).

Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

Abstract: A system for estimating junction temperatures of a power semiconductor module includes a constant current source to apply constant drain current to a drain terminal of a power semiconductor device, an adjustable gate voltage source to apply a gate voltage signal to a gate terminal, a drain-source voltage sensor between the drain terminal and the source terminal and configured to measure a value of the current drain-source voltage across the power semiconductor device and output a corresponding drain-source voltage signal, a gate controller to determine a difference between the drain-source voltage signal and a constant reference voltage and control output of the adjustable gate voltage source dependent on the determined difference, and a system controller to switch the power semiconductor device to its fully conducting state and to estimate junction temperature within the power semiconductor device in dependency from the on-state resistance in the fully conducting state.

Abstract: A temperature-to-digital converter includes a temperature sensor circuit, an analog-to-digital converter (ADC), and a digital processing circuit. The temperature sensor circuit is configured to generate first and second complementary-to-absolute-temperature (CTAT) voltages based on a sensed absolute temperature. The ADC is configured to receive the first and second CTAT voltages. Further, during first and second conversion cycles of the ADC, the ADC is configured to receive the first and second CTAT voltages, and generate first and second digital voltages, respectively. The first and second digital voltages are generated based on the first and second CTAT voltages, respectively, and a difference between the first and second CTAT voltages. The digital processing circuit is configured to generate, based on the first and second digital voltages, a temperature output voltage that is independent of a gain of the ADC and a digital representation of the absolute temperature.

Abstract: A biological data measurement device in which a living organism having a first thermal resistance Rth1 from a core to a surface is a measuring object, includes a heat insulating layer which is disposed on a body surface of the measuring object and has a second thermal resistance Rth2; a measurement device for measuring a first and a second temperatures, which is segregated by the heat insulating layer; and an adding device for adding a predetermined delay time to the second temperature in order to correct a response delay of the first temperature as compared with the second temperature. The first temperature is a bottom side temperature of a bottom surface of the heat insulating layer, which is in contact with the body surface, and the second temperature is a top side temperature of a top surface of the heat insulating layer.

Abstract: A temperature measurement system configured to measure a temperature of a target object having a first main surface and a second main surface includes a light source unit configured to emit output light penetrating the target object and including a first wavelength range and a second wavelength range; a measurement unit configured to measure a spectrum of reflected light; an optical path length ratio calculator configured to calculate an optical path length ratio between the output light of the first wavelength range and the output light of the second wavelength range; and a temperature calculator configured to calculate the temperature of the target object based on the optical path length ratio and a previously investigated relationship between the temperature of the target object and a refractive index ratio between the output light of the first wavelength range and the output light of the second wavelength range.

Abstract: A method is disclosed for determining whether piezoelectric materials have defects such as cracks. The method includes applying a voltage signal to a piezoelectric micro-actuator, measuring a temperature of the piezoelectric micro-actuator while applying the voltage signal, and determining that the piezoelectric micro-actuator includes a defect based on the measured temperature.

Abstract: The present disclosure relates to a device for determining and/or monitoring the temperature of a medium, comprising a temperature sensor with a temperature-sensitive sensor element which is placed in electrical contact by means of at least a first connection line and a second connection line, wherein the first connection line is divided into a first section and a second section, wherein the first section which faces the sensor element is composed of a first material, and wherein the second section which faces away from the sensor element is composed of a second material which differs from the first material, wherein the second connection line is composed of the second material, and wherein the first section of the first connection line and at least one part of the second connection line form a first difference temperature sensor in the form of a thermocouple.

Abstract: An apparatus for measuring a temperature of an assembly that is internal to a process chamber. The apparatus may include a light pipe positioned between a lamp radiation filtering window and the assembly, the light pipe has a first end with a bevel configured to redirect infrared radiation emitted from the assembly through the light pipe and has a second end distal to the first end, an optical assembly configured to collimate, filter, and focus infrared radiation from the second end of the light pipe, an optical detector configured to receive an output from the optical assembly and generate at least one signal representative of the infrared radiation, a temperature circuit that transforms the at least one signal into a temperature value, and a controller that is configured to receive the temperature value and to make adjustments to other process parameters of process chamber based on the temperature value.

Abstract: A thermometer includes an input unit, a control unit, a temperature sensor and an output unit. In response to an input operation is applied on the input unit, the control unit starts to perform a temperature detecting procedure, wherein the control unit instructs the temperature sensor to periodically perform a plurality of temperature detecting operations to obtain a plurality of detected temperature values corresponding to the temperature detecting operations, and only records X largest valid temperature values among the obtained temperature values. In response to determining that the performed temperature to detecting procedure is completed, the control unit removes the largest one among the recorded valid temperature values and calculates an average value of the remaining one or more target temperature values as a temperature of a target object, so as to instruct the output unit display the temperature.

Abstract: Apparatuses and methods for measuring substrate temperature are provided. In one or more embodiments, an apparatus for estimating a temperature is provided and includes a plurality of electromagnetic radiation sources positioned to emit electromagnetic radiation toward a reflection plane, and a plurality of electromagnetic radiation detectors. Each electromagnetic radiation detector is positioned to sample the electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources. The apparatus also includes a pyrometer positioned to receive electromagnetic radiation emitted by plurality of electromagnetic radiation sources and reflected from a substrate disposed at a reflection plane and electromagnetic radiation emitted by the substrate. The apparatus includes a processor configured to estimate a temperature of the substrate based on the electromagnetic radiation emitted by the substrate.

Abstract: Apparatus for use in sensing temperature in a wellbore, comprising: tubing comprising a plurality of temperature sensor modules provided at locations along the inside of the tubing, said temperature sensor modules comprising temperature sensors provided at least in part by at least one semiconductor element having electrical properties that vary with temperature; an electrical network configured to electrically connect to the semiconductor elements to in use allow measuring of the respective electrical properties of the semiconductor elements to infer a thermal characteristic of the semiconductor element; and at least one control module electrically connected to multiple temperature sensor modules, via the electrical network, and configured to receive and process an electrical signal associated with the temperature sensor modules to enable inference of the temperature of the semiconductor elements and the environment to which the tubing is exposed at the location of that semiconductor element.

Abstract: Provided herein is technology relating to measuring temperature and particularly, but not exclusively, to devices, methods, systems, and kits for doing measuring temperature at high resolution, e.g., in living organisms.

Abstract: A temperature measurement system of a vehicle includes a controller, a first temperature sensor associated with a first location, and a second temperature sensor associated with a second location. The temperature measurement system is calibratable based upon a comparison of a temperature of the first location and a temperature of the second location, wherein the temperature of at least one of the first location and the second location is determined after a predetermined time from an end of operation of the vehicle.

Abstract: Aspects of the present disclosure describe monitoring of optical fiber by distributed temperature sensing (DTS) and determining optical fiber degradation and/or abnormal environmental events including landslides, fires, etc., from DTS data.

Abstract: Methods of determining thermal properties of a contact region are provided. The method comprises receiving temperature data of a sensor; determining a temperature distribution of heat penetration from a sensor to at least one material; applying a correction to the temperature distribution; iteratively analyzing the corrected temperature distribution; and outputting thermal properties of a contact region, the contact region being a region between the sensor and the at least one material. The method may further comprise determining thermal properties of the at least one material; and determining corrected thermal properties of the material using the thermal properties of the contact region. The method may further comprise automatically determining an appropriate time window for measuring properties of the at least one material to minimize effects of the contact region.

Abstract: A first heat generator heats a mixture of fluids to a first temperature. A predetermined thermal property value of the mixture set to the first temperature is obtained, the first heat generator heats the mixture to a second temperature, the thermal property value of the mixture set to the second temperature is obtained. First relationship information between the thermal property value of the mixture set to the first temperature and a mixture ratio of a first fluid is obtained. Second relationship information between the thermal property value of the mixture set to the second temperature and the mixture ratio of the first fluid is obtained. Mixture ratios are calculated based on the thermal property value of the mixture set to the first temperature, the thermal property value of the mixture of fluids set to the second temperature, the first relationship information, and the second relationship information.

Abstract: A biological data measurement device includes a substrate disposed at a position spaced a predetermined distance from a body surface of a living organism as a measuring object via a support member so that an air layer is formed between the substrate and the body surface. The substrate is provided with a temperature measurement device including an infrared thermometer for measuring a body surface temperature Tsk of the body surface and a substrate thermometer for measuring a substrate temperature Tsub of the substrate. The temperature measurement device measures the body surface temperature Tsk and the substrate temperature Tsub in the same place at least twice of a first timing A and a second timing B.