Abstract: A deep body thermometer that includes a body temperature measurement unit having a thermal resistor layer formed of a thermal resistor having a predetermined thermal resistance value, four temperature sensors arranged in a thickness direction of the thermal resistor layer, and a wiring substrate on which a processing circuit for processing an output signal of each of the four temperature sensors is mounted. Moreover, the thermometer includes an upper exterior body made of a foamed material of a closed cell or a semi-closed cell having a waterproof property to accommodate the body temperature measurement unit, and a lower exterior body formed of a non-foamed resin film having a waterproof property, in which peripheral edge portions of the upper exterior body and the lower exterior body are fixed in a close contact manner.

Abstract: A method for measuring thermal resistance between a thermal component of an instrument and a consumable includes contacting a known consumable with a thermal component to be tested; driving the thermal component using a periodic sine wave input based on a predetermined interrogation frequency; measuring temperature outputs from a thermal sensor responsive to the periodic sine wave input; multiplying the temperature outputs by a reference signal in phase with the periodic sine wave input and calculating the resultant DC signal component to determine an in-phase component X; multiplying the plurality of temperature outputs by a 90° phase-shifted reference signal and calculating the resultant DC signal component to determine a quadrature, out-of-phase component Y; calculating a phase offset responsive to the periodic sine wave input based on tan?1 (Y/X) or atan2(X, Y); and determining a resistance value for the thermal interface using a calibrated resistance-phase offset equation and the calculated phase offset.

Abstract: A sensor device for determining at least one heat transfer parameter of a gas comprises a sensor unit (10) comprising at least one heater element and at least one temperature sensor. A first (inner) housing (20) receives the sensor unit. The first housing comprises a first membrane (22) allowing a diffusive gas exchange between the exterior and the interior of the first housing. The first housing is received in a second (outer) housing (30). The second housing comprises a second membrane (32) allowing a diffusive gas exchange between the exterior of the second housing and the exterior of the first housing. Thereby temperature gradients inside the first housing are reduced. The second housing can be made of metal and can be disposed on a support plate (40), taking the form of a cap. An auxiliary sensor (50) can be arranged in the space between the first and second housings.

Abstract: A system includes a measurement instrument including a first connector, a control module, and a display. A temperature probe includes a shaft and a tip. A second connector is coupled to a first end of the shaft. The tip is coupled to a second end of the shaft and measures a change in temperature of a sample. The second connector is received by the first connector when the temperature probe is attached to the measurement instrument. A storage module is housed within the second connector and stores parameters of the temperature probe. The control module receives the parameters, prompts a user to select the sample on the display, and determines a thermal conductivity and a stable time of the sample. When the stable time has elapsed, the control module determines a temperature measurement based on a change in voltage and displays the temperature measurement on the display.

Abstract: In some examples, a temperature distribution sensor may include a laser source to emit a laser beam that is tunable over a wavelength range. The wavelength range may be less than a Raman bandwidth in a device under test (DUT), or of-the-order-of the Raman bandwidth in the DUT. A pulsed source may apply a pulse drive signal to the laser beam or to a modulator to modulate the laser beam that is to be injected into the DUT. A bandpass filter may be operatively disposed between the laser source and the DUT, and may be configured to an anti-Stokes wavelength that is narrower than the Raman bandwidth. A photodiode may be operatively disposed between the bandpass filter and the DUT to acquire, from the DUT, anti-Stokes optical time-domain reflectometer traces for two preset wavelengths of the laser beam to determine a temperature distribution for the DUT.

Abstract: The present disclosure relates to an apparatus for determining and/or monitoring a process variable of a medium, comprising at least one sensor element arranged in a sensor head for determining and/or monitoring the process variable, wherein an internal volume of the sensor head is filled at least partially with a filler. The filler includes at least one fill material, for which at at least one predeterminable phase transformation temperature a phase change occurs, in which the material remains in the solid state, wherein the fill material is in a first phase state when a temperature of the fill material is less than the phase transformation temperature, and wherein the fill material is in a second phase state when the temperature of the fill material is greater than the phase transformation temperature.

Abstract: A measurement device for measuring a temperature prevailing inside a container is disclosed. The measurement device comprises: a process connector including a connector body and a fastener configured to be mounted onto a corresponding counterpart surrounding an opening of the container; a measurement unit secured in an opening of the process connector such that a front surface of the measurement unit is facing into the container when the measurement device is mounted on the container; the measurement unit including or consisting of: a heat pipe and a temperature sensor; the heat pipe having two thermally conductive interfaces including a front interface exposable to the temperature to be measured and a second interface in thermal contact with the temperature sensor; and a thermal insulation surrounding the heat pipe and the temperature sensor.

Abstract: A process fluid multivariable measurement system is provided. The multivariable measurement system includes a thermowell configured to couple to a process fluid conduit and extend through a wall of the process fluid conduit. The multivariable measurement system also includes a temperature sensor assembly disposed within the thermowell, the temperature sensor assembly having at least one temperature sensitive element disposed therein. The multivariable measurement system also includes a pressure sensor assembly coupled to the thermowell, the pressure sensor assembly having at least one pressure sensitive element disposed therein. The multivariable measurement system further includes transmitter circuitry, communicatively coupled to the temperature sensor assembly and the pressure sensor assembly, configured to receive a temperature sensor signal from the at least one temperature sensitive element and responsively generate a temperature measurement output based on the temperature sensor signal.

Abstract: Various non-invasive sensors are adapted to be placed on a surface of an object having a volume with an internal region. The internal region of the object has internal properties indicated by corresponding internal parameters and an internal temperature distribution that is a function of the internal parameters and surface thermal signals. Each non-invasive sensor includes a heat flux sensor having one or more heat flux sensor output terminals to provide a measured heat transfer signal for the surface of the object, and a temperature sensor having one or more temperature sensor output terminals to provide a measured temperature signal for the surface of the object. Systems including one or more of the sensors perform non-invasive sensing of the object including accurate and rapid determination of an internal temperature distribution of the internal region of the object as well as one or more other internal properties of the object.

Abstract: This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.

Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

Abstract: Provided are a controller for a thermal analysis apparatus, with which thermal characteristics of a measurement target can be grasped, and a thermal analysis apparatus. A controller (51) for a thermal analysis apparatus, which is configured to measure thermal behavior accompanying a temperature change caused by one of heating and cooling of a measurement target (X, Y), is configured to: acquire an intensity of a response signal of the measurement target to an electromagnetic wave with which the measurement target is irradiated with respect to a variable of one of a time and a temperature; differentiate the intensity with respect to the variable; and output a derivative value obtained as a result of the differentiation with respect to one of the temperature and the time, or display the derivative value with respect to one of the temperature and the time on a predetermined display (53).

Abstract: A temperature-to-digital converter includes a temperature sensor circuit, an analog-to-digital converter (ADC), and a digital processing circuit. The temperature sensor circuit is configured to generate first and second complementary-to-absolute-temperature (CTAT) voltages based on a sensed absolute temperature. The ADC is configured to receive the first and second CTAT voltages. Further, during first and second conversion cycles of the ADC, the ADC is configured to receive the first and second CTAT voltages, and generate first and second digital voltages, respectively. The first and second digital voltages are generated based on the first and second CTAT voltages, respectively, and a difference between the first and second CTAT voltages. The digital processing circuit is configured to generate, based on the first and second digital voltages, a temperature output voltage that is independent of a gain of the ADC and a digital representation of the absolute temperature.

Abstract: A system for estimating junction temperatures of a power semiconductor module includes a constant current source to apply constant drain current to a drain terminal of a power semiconductor device, an adjustable gate voltage source to apply a gate voltage signal to a gate terminal, a drain-source voltage sensor between the drain terminal and the source terminal and configured to measure a value of the current drain-source voltage across the power semiconductor device and output a corresponding drain-source voltage signal, a gate controller to determine a difference between the drain-source voltage signal and a constant reference voltage and control output of the adjustable gate voltage source dependent on the determined difference, and a system controller to switch the power semiconductor device to its fully conducting state and to estimate junction temperature within the power semiconductor device in dependency from the on-state resistance in the fully conducting state.

Abstract: A biological data measurement device in which a living organism having a first thermal resistance Rth1 from a core to a surface is a measuring object, includes a heat insulating layer which is disposed on a body surface of the measuring object and has a second thermal resistance Rth2; a measurement device for measuring a first and a second temperatures, which is segregated by the heat insulating layer; and an adding device for adding a predetermined delay time to the second temperature in order to correct a response delay of the first temperature as compared with the second temperature. The first temperature is a bottom side temperature of a bottom surface of the heat insulating layer, which is in contact with the body surface, and the second temperature is a top side temperature of a top surface of the heat insulating layer.

Abstract: A temperature measurement system configured to measure a temperature of a target object having a first main surface and a second main surface includes a light source unit configured to emit output light penetrating the target object and including a first wavelength range and a second wavelength range; a measurement unit configured to measure a spectrum of reflected light; an optical path length ratio calculator configured to calculate an optical path length ratio between the output light of the first wavelength range and the output light of the second wavelength range; and a temperature calculator configured to calculate the temperature of the target object based on the optical path length ratio and a previously investigated relationship between the temperature of the target object and a refractive index ratio between the output light of the first wavelength range and the output light of the second wavelength range.

Abstract: A method is disclosed for determining whether piezoelectric materials have defects such as cracks. The method includes applying a voltage signal to a piezoelectric micro-actuator, measuring a temperature of the piezoelectric micro-actuator while applying the voltage signal, and determining that the piezoelectric micro-actuator includes a defect based on the measured temperature.

Abstract: Apparatuses and methods for measuring substrate temperature are provided. In one or more embodiments, an apparatus for estimating a temperature is provided and includes a plurality of electromagnetic radiation sources positioned to emit electromagnetic radiation toward a reflection plane, and a plurality of electromagnetic radiation detectors. Each electromagnetic radiation detector is positioned to sample the electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources. The apparatus also includes a pyrometer positioned to receive electromagnetic radiation emitted by plurality of electromagnetic radiation sources and reflected from a substrate disposed at a reflection plane and electromagnetic radiation emitted by the substrate. The apparatus includes a processor configured to estimate a temperature of the substrate based on the electromagnetic radiation emitted by the substrate.

Abstract: A thermometer includes an input unit, a control unit, a temperature sensor and an output unit. In response to an input operation is applied on the input unit, the control unit starts to perform a temperature detecting procedure, wherein the control unit instructs the temperature sensor to periodically perform a plurality of temperature detecting operations to obtain a plurality of detected temperature values corresponding to the temperature detecting operations, and only records X largest valid temperature values among the obtained temperature values. In response to determining that the performed temperature to detecting procedure is completed, the control unit removes the largest one among the recorded valid temperature values and calculates an average value of the remaining one or more target temperature values as a temperature of a target object, so as to instruct the output unit display the temperature.

Abstract: The present disclosure relates to a device for determining and/or monitoring the temperature of a medium, comprising a temperature sensor with a temperature-sensitive sensor element which is placed in electrical contact by means of at least a first connection line and a second connection line, wherein the first connection line is divided into a first section and a second section, wherein the first section which faces the sensor element is composed of a first material, and wherein the second section which faces away from the sensor element is composed of a second material which differs from the first material, wherein the second connection line is composed of the second material, and wherein the first section of the first connection line and at least one part of the second connection line form a first difference temperature sensor in the form of a thermocouple.