Patents Examined by Moazzam Hossain
  • Patent number: 11825750
    Abstract: A micro-electromechanical system (MEMS) device and a method of forming the same, the MEMS device includes a composite substrate, a cavity, a piezoelectric stacking structure and a proof mass. The composite substrate includes a first semiconductor layer, a bonding layer and a second semiconductor layer from bottom to top. The cavity is disposed in the composite substrate, and the cavity is extended from the second semiconductor layer into the first semiconductor layer and not penetrated the first semiconductor layer. The piezoelectric stacking structure is disposed on the composite substrate, with the piezoelectric stacking structure having a suspended region over the cavity. The proof mass is disposed in the cavity to connect to the piezoelectric stacking structure.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: November 21, 2023
    Assignee: Vanguard International Semiconductor Corporation
    Inventor: Jia Jie Xia
  • Patent number: 11823059
    Abstract: The present disclosure relates to a fashion recommendation system that employs a task-guided learning framework to jointly train a visually-aware personalized preference ranking network. In addition, the fashion recommendation system employs implicit feedback and generated user-based triplets to learn variances in the user's fashion preferences for items with which the user has not yet interacted. In particular, the fashion recommendation system uses triplets generated from implicit user data to jointly train a Siamese convolutional neural network and a personalized ranking model, which together produce a user preference predictor that determines personalized fashion recommendations for a user.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: November 21, 2023
    Assignees: Adobe Inc., The Regents of the University of California
    Inventors: Chen Fang, Zhaowen Wang, Wangcheng Kang, Julian McAuley
  • Patent number: 11825718
    Abstract: A multicolor light-emitting element that utilizes fluorescence and phosphorescence and is advantageous for practical application is provided. The light-emitting element has a stacked-layer structure of a first light-emitting layer containing a host material and a fluorescent substance and a second light-emitting layer containing two kinds of organic compounds and a substance that can convert triplet excitation energy into luminescence. Note that light emitted from the first light-emitting layer has an emission peak on the shorter wavelength side than light emitted from the second light-emitting layer.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: November 21, 2023
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Takahiro Ishisone, Satoshi Seo, Yusuke Nonaka, Nobuharu Ohsawa
  • Patent number: 11807519
    Abstract: A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: November 7, 2023
    Inventors: Domenico Giusti, Fabio Quaglia
  • Patent number: 11810808
    Abstract: An apparatus and method for facilitating the removal of layers from a die for an integrated circuit while maintaining the planarity of the surface of the die by avoiding rounding the corners and other edges of the die. A pocket is created in a sacrificial material, such that when the die is inserted into the pocket the edges of the die are contiguous with the walls of the pocket and a top surface of the die is coplanar with a top surface of the pocket. The sacrificial material may be the same material as the die. An adhesive substance is placed in the pocket, and the die is inserted into the pocket and against the adhesive substance which aids in retaining the die in the pocket. The layers may then be removed from the die and the sacrificial material around the die without rounding the edges of the die.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: November 7, 2023
    Inventors: Joshua Joseph Trujillo, Robert Allen Williams
  • Patent number: 11804425
    Abstract: An electronic device including: a semiconductor device including plural terminals input with voltages having a same potential; and a wiring board including a mounting region at which the semiconductor device is mounted, wherein the wiring board includes a board wiring line formed on the wiring board from a connection portion at which one terminal of the plural terminals is connected, via an inside of the mounting region, to a connection portion at which another terminal of the plural terminals is connected.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: October 31, 2023
    Inventor: Koya Shimazaki
  • Patent number: 11797839
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for training a neural network using a priority queue. One of the methods includes maintaining data identifying a set of K output sequences that were previously generated; selecting at least one of the output sequences from the set of output sequences; for each selected output sequence, determining a respective score; determining, for each selected sequence, a respective first update to the current values of the controller parameters; generating a batch of new output sequences using the controller neural network; obtaining a respective reward for each of the new output sequences; determining, from the new output sequences and the output sequences in the maintained data, the K output sequences that have the highest rewards; and modifying the maintained data.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: October 24, 2023
    Assignee: Google LLC
    Inventors: Mohammad Norouzi, Daniel Aaron Abolafia, Quoc V. Le
  • Patent number: 11795053
    Abstract: A sensor device includes a sensor chip with a micro-electromechanical systems (MEMS) structure, wherein the MEMS structure is arranged at a main surface of the sensor chip, and a gas-permeable cover arranged over the main surface of the sensor chip, which covers the MEMS structure and forms a cavity above the MEMS structure.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: October 24, 2023
    Assignee: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Klaus Elian, Horst Theuss
  • Patent number: 11782057
    Abstract: An integrated circuit (IC) chip includes ROIC circuitry in a CMOS wafer with a top dielectric layer and at least one graphene field effect transistor (gFET) sensor array added above the CMOS wafer. The IC chip includes access transistors controlled by the ROIC circuitry and further includes sensing circuitry which includes the at least one gFET sensor array and a passivation opening that allows direct contact of a sample liquid with the graphene channels of the gFETs in the at least one gFET sensor array, such that a liquid gate is formed above the graphene channel upon receipt of the sample liquid. In some examples, the IC chip includes a process, memory controller, and memory. A system and a method have similar structures and perform the functions of the apparatus.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: October 10, 2023
    Assignee: Cardea Bio, Inc.
    Inventors: Brett R. Goldsmith, Mitchell Lerner, Paul Hoffman
  • Patent number: 11780725
    Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: October 10, 2023
    Assignee: Nanusens SL
    Inventor: Josep Montanyà Silvestre
  • Patent number: 11774437
    Abstract: A method of making a portion of a microfluidic channel includes lithographically patterning a first pattern into a first layer of photoresist disposed on a substrate, the first pattern representative of morphology of a reservoir rock; etching the first pattern into the substrate to form a patterned substrate; disposing a second layer of photoresist onto the patterned substrate; lithographically patterning a second pattern into the second layer of photoresist to reveal portions of the patterned substrate; and depositing calcite onto the exposed portions of the patterned substrate.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: October 3, 2023
    Assignee: Saudi Arabian Oil Company
    Inventors: Dong Kyu Cha, Ahmed Gmira, Mohammed Badri AlOtaibi, Ali Abdallah Al-Yousef
  • Patent number: 11777056
    Abstract: Provided is a nanorod light-emitting device including a first semiconductor layer doped with a first conductive type impurity, an emission layer disposed above the first semiconductor layer, a second semiconductor layer disposed above the emission layer and doped with a second conductive type impurity that is electrically opposite to the first conductive type impurity, a conductive layer disposed between at least one of a center portion of a lower surface of the emission layer and the first semiconductor layer and a center portion of an upper surface of the emission layer and the second semiconductor layer, and a current blocking layer surrounding a sidewall of the conductive layer.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: October 3, 2023
    Inventors: Junhee Choi, Nakhyun Kim, Jinjoo Park, Joohun Han
  • Patent number: 11764256
    Abstract: Provided are MIM capacitor and semiconductor structure including MIM capacitor. The MIM capacitor includes a dielectric structure, a bottom electrode on the dielectric structure, a first insulating layer covering the bottom electrode and the dielectric structure, a middle electrode stacked on the bottom electrode, a spacer, a second insulating layer and a top electrode. The middle electrode is separate from the bottom electrode by the first insulating layer therebetween. A bottommost surface of the middle electrode is lower than a top surface of the bottom electrode and higher than a bottom surface of the bottom electrode. The spacer is disposed on the first insulating layer and laterally aside and covers a sidewall of the middle electrode. The second insulating layer covers the middle electrode and the spacer. The top electrode is stacked on the middle electrode and separate from the middle electrode by the second insulating layer therebetween.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Jiun Wu, Shun-Yi Lee
  • Patent number: 11762042
    Abstract: A magnetic field sensor may include a semiconductor structure having a planar surface, and first, second, and third sensing devices. The semiconductor structure may include a semiconductor member having a two-dimensional electron gas therein, and an insulator member disposed on the semiconductor member. The first sensing device may be configured to sense magnetic field along a first axis parallel to the planar surface. The second sensing device may be configured to sense magnetic field along a second axis parallel to the planar surface, and orthogonal to the first axis. The third sensing device may be configured to sense a magnetic field along a third axis normal to the planar surface. Each of the first, second, and third sensing devices may be formed in the semiconductor structure and may include electrodes that extend from the insulator member to the two-dimensional electron gas.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: September 19, 2023
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Ping Zheng, Eng Huat Toh, Yongshun Sun
  • Patent number: 11765528
    Abstract: A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 19, 2023
    Inventors: Guang-Li Song, Suresh Basoor Nijaguna, Qian Pang
  • Patent number: 11760625
    Abstract: A microfluidic device (100) for mixing a liquid L is provided. The microfluidic device (100) comprises a microfluidic chamber (20), having an inlet (30), and arranged to receive the liquid L therein. In use, the microfluidic device (100) is arranged to control translation through the liquid L of a body B introduced therein, wherein the translation of the body B is due to a potential field acting on the body. In this way, the controlled translation of the body B mixes the liquid L in the microfluidic chamber (20).
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: September 19, 2023
    Inventors: Maiwenn Kersaudy-Kerhoas, Antonio Liga
  • Patent number: 11753296
    Abstract: A MEMS device includes a lower substrate having a resonator, an upper substrate disposed to oppose an upper electrode of the resonator, a bonding layer sealing an internal space between the lower substrate and the upper substrate, and wiring layers that contain the same metal material as the bonding layer. Moreover, a rare gas content of each of the wiring layers is less than 1×1020 (atoms/cm3).
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: September 12, 2023
    Inventor: Masakazu Fukumitsu
  • Patent number: 11756810
    Abstract: A pick-up head picks up a semiconductor device from a carrier substrate. The pick-up head includes a first leg portion, a second leg portion, a raised bridge base portion between the first and second leg portions, and a tip portion mounted on the raised bridge base portion. The tip portion engages with the semiconductor device to pick up the semiconductor device from the carrier substrate. The pick-up head is associated with a force detection mechanism that detects a force applied to the pick-up head for picking up the semiconductor device. The force detection mechanism includes cavities formed on the first leg portion and/or second leg portion, pillars arranged on the pick-up head, a force detection device arranged in a mount assembly that is attached on the pick-up head, or electrodes arranged on the mount assembly. Actuation of the pick-up head is determined based on the detected force.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: September 12, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Oscar Torrents Abad, Daniel Brodoceanu, Ali Sengül, Pooya Saketi
  • Patent number: 11747515
    Abstract: A sensor based system for capturing localized weather data and a server system for communicating with a plurality of reporting and recipient mobile communication devices. The communication devices are enabled to capture additional weather information to supplement the sensor based system.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: September 5, 2023
    Inventors: Eugene T. Smyth, Deborah D. Fox, Roopak Hooda, Kristen Sara Mattson, Kristian L. Sanders
  • Patent number: 11749590
    Abstract: A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: September 5, 2023
    Inventor: Tatsuya Koike