Abstract: An apparatus includes a controller adapted to be coupled to memory components in parallel and configured to provide memory address signals and a controller clock signal to the memory components, a memory enable logic circuit coupled to the controller and adapted to be coupled to the memory components in parallel and configured to provide test-enable signals to the memory components. The test-enable signals enable, with the controller clock signal, the memory components to read locally stored memory values. The apparatus includes a multiplexer adapted to be coupled to the memory components in parallel and configured to receive from the memory components memory signals that include the memory values in respective sequences of the memory clock signals, and a pipeline coupled to the multiplexer and the controller and configured to receive the memory values from the multiplexer and send the memory values to a multiple input signature register of the controller.

Abstract: A TPM with programmable fuses in an SOC includes an on-die RAM storing a blown-fuse count and a TPM state read from off-die NV memory. During initialization, if the blown-fuse count is greater than a TPM state fuse count, a TPM state PIN-attempt-failure count is incremented, thereby thwarting a replay attack. If a PIN satisfies a PIN failure policy, and if a TPM state previously-passed-PIN indicator is set to true, a fuse is blown and the blown-fuse count incremented depending on the PIN being incorrect, but if the TPM state previously-passed-PIN indicator is set to false, a fuse is blown and the blown-fuse count incremented independent of whether the PIN is correct or incorrect. The TPM state fuse count is set equal to the blown-fuse count. If a counter cleared before processing the PIN remains cleared during the next initialization, a fuse voltage cut is detected and a penalty imposed.

Abstract: A memory device which can perform various memory tests without increasing a size of the memory device. The memory device includes: a first pad for receiving external ROM data from a memory controller; a second pad for receiving an external clock signal corresponding to the external ROM data from the memory controller; and a control logic connected to the first pad and the second pad and configured to perform an operation corresponding to the external ROM data in response to the external clock signal in a test mode.

Abstract: Embodiments of a system and method for providing a flexible memory system are generally described herein. In some embodiments, a substrate is provided, wherein a stack of memory is coupled to the substrate. The stack of memory includes a number of vaults. A controller is also coupled to the substrate and includes a number of vault interface blocks coupled to the number of vaults of the stack of memory, wherein the number of vault interface blocks is less than the number of vaults.

Abstract: A method of operating a non-volatile memory device includes performing a first sensing operation on the non-volatile memory device during a first sensing time including a first section, a second section, and a third section. The performing of the first sensing operation includes applying a first voltage level, which is variable according to a first target voltage level, to a selected word line in the first section, applying a second voltage level, which is different from the first voltage level, to the selected word line in the second section, and applying the first target voltage level, which is different from the second voltage level, to the selected word line in the third section. The first voltage level becomes greater as the first target voltage level becomes greater.

Abstract: A memory device includes a memory cell array, a data accessing circuit, a data bus inversion calculator, a multiplexer, and an output result judging circuit. The data accessing circuit performs a data write-in operation or a data read-out operation on the memory cell array. The data accessing circuit reads read-out data from the memory cell array. The data bus inversion calculator generates inversion indication data according to the read-out data. The multiplexer outputs the inversion indication data or test data according to a mode signal. The output result judging circuit compares the read-out data with the inversion indication data or the test data to generate output information.

Abstract: The present disclosure relates to a neural network system comprising: a data input configured to receive an input data signal and analog neural network circuitry having an input coupled with the data input. The analog neural network circuitry is operative to apply a weight to a signal received at its input to generate a weighted output signal. The neural network system further comprises compensation circuitry configured to apply a compensating term to the input data signal to compensate for error in the analog neural network circuitry.

Abstract: Disclosed herein is an apparatus that includes a fuse array circuit including a plurality of fuse sets each assigned to a corresponding one of a plurality of fuse addresses and configured to operatively store a fuse data, and a first circuit configured to generate and sequentially update a fuse address to sequentially read the fuse data from the plurality of fuse sets. The first circuit is configured to change a frequency of updating the fuse address based on a first signal.

Abstract: A TPM with programmable fuses in an SOC includes an on-die RAM storing a blown-fuse count and a TPM state read from off-die NV memory. During initialization, if the blown-fuse count is greater than a TPM state fuse count, a TPM state PIN-attempt-failure count is incremented, thereby thwarting a replay attack. If a PIN satisfies a PIN failure policy, and if a TPM state previously-passed-PIN indicator is set to true, a fuse is blown and the blown-fuse count incremented depending on the PIN being incorrect, but if the TPM state previously-passed-PIN indicator is set to false, a fuse is blown and the blown-fuse count incremented independent of whether the PIN is correct or incorrect. The TPM state fuse count is set equal to the blown-fuse count. If a counter cleared before processing the PIN remains cleared during the next initialization, a fuse voltage cut is detected and a penalty imposed.

Abstract: Technology is disclosed herein for loading redundancy information during a memory system power on read (POR). A memory structure has primary regions (e.g., primary columns) and a number of redundant regions (e.g., redundant columns). The status of the regions is stored in isolation latches during the POR. Initially, simultaneously all latches for primary regions are reset to used and all latches for redundant regions are reset to unused. Then, isolation latches for defective primary regions are set to unused while isolation latches for corresponding redundant regions are set to used. There is no need to individually set isolation latches for redundant regions to unused, which saves time during POR. Moreover, whenever the isolation latch for a defective primary region is set from used to unused, in parallel the isolation latch for the replacement redundant column may be set from unused to used, thereby not incurring a time penalty.

Abstract: The present disclosure relates to an apparatus, and a method for memory management and more a memory device structured with internal analogic measurement mode features. The memory device includes memory component having a memory array, a memory controller coupled to the memory component, a JTAG interface in the memory controller, voltage and current reference generators, and an analogic measurement block driven by the JTAG interface.

Abstract: An apparatus includes a first group of memory units and a second group of memory units coupled to a first data path and a second data path coupled to a controller, a first delay element on the first data path coupled to the second group of memory units and configured to send, from the controller to the second group of memory units, signals for write and read operations in a sequence of time cycles delayed by a time cycle with respect to the first group of memory units, and a second delay element on the second data path and coupled to the first group of memory units and configured to send, from the first group of memory units to the controller, test result signals delayed by a time cycle, the delayed test result signals having a matching delay to the delayed write and read operations.

Abstract: A semiconductor device includes a semiconductor die having a peripheral region surrounding, a defect detection circuit in the peripheral region, the defect detection circuit arranged in an open conduction loop, the defect detection circuit comprising a plurality of latch circuits and a plurality of defect detection conduction paths, each defect detection conduction path of the plurality of defect detection conduction paths connecting two adjacent latch circuits of the plurality of latch circuits, and a test control circuitry configured to perform (a) a test write operation by transferring bits of an input data pattern in a forward direction of the open conduction loop to cause the plurality of latch circuits to store the bits of the input data pattern in the plurality of latch circuits, and (b) a test read operation by transferring bits stored in the plurality of latch circuits in a backward direction of the open conduction loop.

Abstract: A FX phase driver for a memory device having a first driver circuit including a first pull-up circuit configured to drive a first phase signal to a first high state value and a first pull-down circuit configured to drive the first phase signal to a first low state value. The phase driver also including a second driver circuit including a second pull-up circuit configured to drive a second phase signal to a second high state value that is higher than an active state voltage level of a word line in the memory device and a second pull-down circuit configured to drive the second phase signal to a second low state value. The second pull-down circuit includes a stabilization circuit configured to provide a resistive path for a leakage current in the second pull-down circuit when the second pull-up circuit drives the second phase signal to the second high state value.

Abstract: Exemplary methods, apparatuses, and systems include receiving a plurality of read operations. The read operations are divided into a current set of a sequence of read operations and one or more other sets. The size of the current set is a first number of read operations. An aggressor read operation is selected from the current set. A data integrity scan is performed on a victim of the aggressor and a first indicator of data integrity is determined based on the first data integrity scan. A size of a subsequent set of read operations is set to a second number, which less than the first number, based on the indicator of data integrity.

Abstract: Methods, systems, and devices for debugging memory devices are described. A memory system may be an example of a multichip package (MCP) that includes at least one volatile memory device and at least one non-volatile memory device. In some examples, errors may occur at the volatile memory device, and data associated with the errors may be stored to the non-volatile memory device. To store the data, access operations being performed on the non-volatile memory may be interrupted (e.g., paused) and the data may be stored to the non-volatile memory before the access operations are resumed. The stored data may be accessed (e.g., by a host device) for use during an error correction operation.

Abstract: A memory system is provided. The memory system includes a compare circuit and a control circuit. The compare circuit determines, in response to a number of detected error bits in a read data from a first memory array, whether a fail word address associated with the detected error bits is in an error table. The control circuit increments a counter value corresponding to the fail word address when the fail word address is in the error table, and further compares the counter value with a threshold value to replace memory locations, corresponding to the fail word address, in the first memory array with backup memory locations in a second memory array.

Abstract: A semiconductor device includes a memory bank including a first memory block, a second memory block, and a redundancy memory block, and a column line selection circuit configured, when a fail occurs in a first column line of the first memory block, to replace the first column line of the first memory block with a first redundancy line of the redundancy memory block, and replace a second column line of the second memory block with a second redundancy line of the redundancy memory block.

Abstract: The present disclosure generally relates to methods of operating storage devices. The storage device comprises a controller and a media unit divided into a plurality of zones. Data associated with one or more first commands is written to a first portion of a first zone. Upon a predetermined amount of time passing, dummy data is written to a second portion of the first zone to fill the first zone to a zone capacity. Upon receiving one or more second commands to write data, a second zone is allocated and opened, and the data associated with the one or more second commands is written to a first portion of the second zone. The data associated with the one or more first commands is then optionally re-written to a second portion of the second zone to fill the second zone to a zone capacity, and the first zone is erased.

Abstract: The present technology includes a memory device and a method of operating the memory device. The memory device includes a control logic circuit configured to control the peripheral circuit so that the program operation is performed. The control logic circuit controls a peripheral circuit so that memory cells to be programmed to first to (N?1)-th program states are programmed in a double program method using a main verify voltage and a sub verify voltage less than the main verify voltage during a verify operation and memory cells to be programmed to the N-th program state are programmed in a normal program method using the main verify voltage during the verify operation, when the verify operation of the memory cells corresponding to the (N?1)-th program state has failed.