Abstract: A device for cooling electronic boards grouped together in an electronic unit. The principle is that of providing at least one distinct cooling board that is introduced into the unit in place of one or more electronic board(s). The manufacture, use and maintenance of such a cooling device are thereby greatly optimized.

Abstract: A handheld computing device can include a substantially rectangular first screen having a front surface, a rear surface, and a beveled edge extending between the front and rear surfaces of the first screen and a substantially rectangular second screen rotatably connected to the first screen so that the device is foldable between an open position and a closed position, the second screen having a front surface, a rear surface, and a beveled edge extending between the front and rear surfaces of the second screen. When the device is in the closed position, the first and second screens are positioned back-to-back and the beveled edges of the first and second screens angle inwardly toward the other respective screen to provide an angled surface configured to facilitate opening the device.

Abstract: A Method and Apparatus for a User Configurable Docking System have been disclosed. In one embodiment of the invention, an electrical connector and a back support are adjustable by a user.

Abstract: A heat-dissipating structure for a variable speed drive (VSD), a VSD device having the heat-dissipating structure, and a method for controlling the heat-dissipating structure. The heat-dissipating structure comprises: an electronic element array, having a first end and an opposite second end, electronic elements in the array producing heat during operation; a heat-dissipating fan, disposed at the first end of the array and used to conduct cooling air to flow between the first end and the second end to cool the electronic elements in the array; and a control apparatus, for controlling operation of the fan, the control apparatus controlling the fan so that the fan rotates at a first rotation direction within a first time period to conduct the cooling air to flow from the second end to the first end, and rotates at a second rotation direction contrary to the first rotation direction within a second time period to conduct the cooling air to flow from the first end to the second end.

Abstract: Provided is a circuit assembly having a new structure in which a busbar circuit unit overlapped with a printed circuit board can reliably be fixed regardless of the heating temperature during soldering of an electrical component. In a circuit assembly in which a busbar circuit unit is overlapped with and fixed to a printed circuit board, the busbar circuit unit is configured as one piece by busbars being buried between insulator layers, and a section of the busbars is exposed via a through-hole of the insulator layer. The insulator layer of the busbar circuit unit is overlapped with the printed circuit board and is fixed thereto via fixing means, and terminal sections of an electrical component are soldered to and mounted on the exposed section of the busbar circuit unit and a printed wiring of the printed circuit board.

Abstract: An electronic device including a case having a space, a circuit board disposed in the space, a heat source disposed on the circuit board and a vapor chamber disposed at a side of the circuit board and adjacent to the heat source is provided. The vapor chamber includes an upper sheet, a bottom sheet assembled with the upper sheet to form a chamber, and a working fluid disposed in the chamber.

Abstract: A heatsink-less electronic unit includes a metal coreless electronic substrate, a heatsink-less microcomputer and various semiconductor relays. The heatsink-less microcomputer and the various semiconductor relays are mounted on the metal coreless electronic substrate. The heatsink-less microcomputer is arranged on the metal coreless electronic substrate. Among the various semiconductor relays, the one which may reach the highest temperature is separated at a longest distance from a location where the heatsink-less microcomputer is arranged, and the various semiconductor relays are arranged separately from one another.

Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.

Abstract: A portable information handling system having a cooling airflow vent located in its bottom surface extends and retracts feet at the bottom surface to aid airflow when the portable information handling system is rested on support surface to impede airflow through the vent. In one embodiment, a microfluidic reservoir communicates pressurized fluid to the plural feet to extend the plural feet if a predetermined thermal condition is detected in the portable information handling system, such as a predetermined temperature, a cooling fan that initiates operation or an impedance to airflow through the vent.

Abstract: A composite sheet includes a graphite layer, a heat insulation layer including a fiber and a heat insulation material and a fiber layer located between the graphite layer and the heat insulation layer, wherein the fiber layer comprises the fiber. An electronic apparatus includes an electronic component that involves heat generation, a housing and the composite sheet, wherein the composite sheet is placed between the electronic component and the housing.

Abstract: An electronic device, such as a set top box comprises an enclosure that houses a circuit board having a peripheral edge positioned in the set top box. A heat sink has orientation features on its periphery that contact and orient the circuit board. Further, the heat sink has positioning tabs at a leading edge that contact a control surface on a rear wall of the set top box enclosure and orients the heat sink within the set top box. Antenna assemblies are positioned in corners of the set top box enclosure and adjacent to one of the vertically oriented walls, wherein the antenna assemblies are positioned outside the peripheral edge of the circuit board and the periphery of the heat sink.

Abstract: A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat.

Abstract: A modular data center system is disclosed for constructing a modular data center building. A plurality of structural support columns are used to support a plurality of unit structures above a floor surface at a desired height relative to the floor surface. A pair of elongated support rails are also included which are coupled perpendicularly to the plurality of structural support columns, at approximately the desired height, to form two parallel, horizontally spaced apart tracks. Each of the unit structures includes a plurality of carriage assemblies, with each of the carriage assemblies including a wheel. The wheels allow the unit structures to be rolled horizontally into a desired position on the pair of elongated support rails when constructing the modular data center building to expedite its assembly.

Abstract: A modification kit for converting an existing signage mounting structure to an electronic sign generally includes at least one sectional sign assembly including a frame section having a back-facing portion configured to be coupled to the existing signage mounting structure and a front-facing portion including an array of bays, each individual bay having removably mounted therein an LED display module and being prewired with a power routing system; wherein the power routing system includes an input end that branches out to a plurality of output ends, each disposed in one of the bays and each configured to directly couple to one of the LED display modules; a power kit configured to couple the input end of each power routing system to an AC power source; and an installation kit configured to facilitate mounting said back-facing portion to the existing signage mounting structure.

Abstract: In one example, a shell includes walls that collectively define an interior space of the shell, the interior space sized and configured to receive heat generating equipment. An internal heat exchanger disposed within the interior space is arranged for thermal communication with heat generating equipment when heat generating equipment is located in the interior space. Additionally, an external heat exchanger is located outside of the shell and arranged for fluid communication with the internal heat exchanger. Finally, a prime mover is provided that is in fluid communication with the internal heat exchanger and the external heat exchanger, and the prime mover is operable to circulate a flow of coolant through the internal heat exchanger and the external heat exchanger.

Abstract: A cooling mount for portable electronic devices is provided that includes a cooling unit for preventing portable electronic devices housing the cooling mount from reaching critical temperatures during operation to avoid undesired shut down of the electronic device.

Abstract: The invention discloses a lamp radiator, including a heat conducting plate, wherein the heat conducting plate is fixed together with a fin group for heat dissipation; and a power supply box equipped with a power supply is respectively fixed at the left side and the right side of the heat conducting plate when the lamp radiator is used. The heat conducting plate is an integrated structure which is composed of a base plate and two leg plates; and the cross section of the heat conducting plate is ?-shaped. The length of the fin group for heat dissipation may be changed according to the power of an energy-saving lamp; and the lamp radiator further includes a heat pipe. The invention also discloses an LED energy-saving lamp having the above lamp radiator.

Abstract: A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator.

Abstract: A server includes a chassis, a power bridge module having a first power connector, a backplate having a first signal connector, a tray, a motherboard module and a signal bridge board. The motherboard module is fixed to the tray, and includes a second power connector detachably and electrically connected to the first power connector. The signal bridge board includes a second signal connector detachably and electrically connected to the first signal connector. Removal of the tray out of the chassis results in removal and electrical disconnection of the second signal connector from the first signal connector, and removal and electrical disconnection of the second power connector from the first power connector.

Abstract: There is provided an evaporator including: a container including a top plate, and a bottom plate configured to be heated by an electronic component; a reinforcing member having a tubular shape extending from the bottom plate to the top plate, and configured such that a coolant is introduced inside the reinforcing member; a side opening formed in a side portion of the reinforcing member, and configured to allow the coolant to flow out to the bottom plate; and a discharge port provided in the top plate outside the reinforcing member, and configured to discharge vapor from the container, the vapor being generated by the coolant contacting the bottom plate.