Abstract: Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board.

Abstract: A bezel includes a dock for a portable display device. The bezel also includes a hinge component that, when coupled to an enclosure, allows the bezel to be rotatably moved with respect to the enclosure.

Abstract: A stacked expansion card assembly is positioned on a mainboard. The mainboard includes a mainboard connector. The stacked expansion card assembly includes a first expansion card, at least one first supporting member, and a first connector. The first card includes a contact card end and electrically connected with the mainboard connector by inserting the contact end of the first expansion card to the mainboard connector. The first supporting member is positioned on the mainboard and supports the first expansion card. The first connector is positioned on the first expansion card and electrically connected or disconnected with a second expansion card by removable insertion of the second expansion card to the first connector. Thereby, the expansion cards can be installed onto the mainboard without increasing the surface area of the mainboard and limited by the layout of the electronic components on the mainboard.

Abstract: A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Abstract: An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

Abstract: An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights.

Abstract: A case assembly encloses heat generating electronic components. The case includes first and second housing parts which can be cast from the same mold. Covers are mounted to the housings to form coolant passages. The housing parts include built-in the connecting parts which are coupled together to form additional coolant passages. One of the connecting parts has a lip which sealingly receives an end of another connecting part. The lip is received by a slot adjacent to the other connecting part. The slot communicates with an exterior of the housing.

Abstract: An example apparatus and method for preventing component overheating and extending system survivability of an appliance is provided and may include a component assembly configured to be inserted in a first slot of the appliance. The component assembly may include a door disposed on its side and extending substantially along the length of the component assembly. The door is movable between a first and a second position and the component assembly is configured so that when the component assembly is inserted in the first slot and the trap door is in the second position, the trap door provides a barrier to airflow in a second slot of the switch that is adjacent to the first slot when a second component assembly has been removed from the second slot.

Abstract: A Method and Apparatus for a User Configurable Docking System have been disclosed. In one embodiment of the invention, a slidable electrical connector and a slidable back support are adjustable by a user.

Abstract: An electromagnetic interference reduction assembly for a transmission is disclosed. A transmission casing includes a base and walls extending outwardly away from the base to a distal edge. The transmission casing defines a first cavity between the walls and includes a platform disposed between the walls. A power inverter module is disposed in the first cavity and supported by the platform when in the first cavity. The power inverter module generates electrical noise during operation which produces electromagnetic interference. A lid is attached to the distal edge of the walls to contain the power inverter module inside the first cavity. A grounding member engages the power inverter module and the lid when the lid is attached to the transmission casing to electrically connect the power inverter module to the lid to reduce the electrical noise exiting the first cavity which reduces the electromagnetic interference exiting the first cavity.

Abstract: An electronic device includes a chassis and a heat dissipation apparatus. The chassis includes a sidewall defining a latching hole and a rear wall defining an opening adjacent to the latching hole. The heat dissipation apparatus is detachably inserted in the chassis from the opening. The heat dissipation apparatus includes a casing defining a positioning slot aligning with the latching hole of the chassis, a liquid cooling assembly received in the casing, and a resilient latching member. A first end of the latching member is mounted in the casing. A latching block protrudes out from a second end of the latching member. The latching block extends through the positioning slot, to be latched in the latching hole of the chassis.

Abstract: A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.

Abstract: This disclosure relates to systems and methods for securing a port component of a user that receives a connection component to a remote device. The port component may be secured by a docking component that may include compressible features that apply a force to the port component to insure proper alignment or orientation to receive the connection component.

Abstract: The disclosure relates to an electronic device comprising an insertion housing produced from a profile element having a closed cross-section and including a first opening and a second opening, a circuit board having at least one electronic component, and a first closure element. The first closure element is disposed at the first opening, and the first opening lies in a plane at an angle to a direction of insertion of the circuit board.

Abstract: A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.

Abstract: An example mounting structure in accordance with one implementation of the present disclosure includes an engagement assembly to mount within a pass-through tunnel of a support stand for an electronic display. The structure further includes a mounting bracket coupled to the engagement assembly. The mounting bracket provides a mounting surface for an electronic device.

Abstract: Embodiments of the present invention disclose a removable cover panel for a display housing. According to one embodiment, the display housing includes an electronic display device for displaying images on a front side opposite a back side and a removable cover panel that substantially spans a surface area of the back side of the display device. In addition, a flexible ring is formed around the periphery of the display device while also being configured to hold the cover panel in a fixed position on the back side of said display device.

Abstract: An exemplary electronic assembly includes a heat spreader, a socket, and an electronic component received in the socket. The electronic component includes a substrate and a chip disposed at a center of the substrate. The chip contacts a bottom surface of the heat spreader. The electronic assembly further includes a pair of flexible fixtures. One end of each flexible fixture abuts against the heat spreader, and another end of each flexible fixture abuts against either the substrate or the socket.

Abstract: An image processing board and a display apparatus having the same are provided. The image processing board includes a substrate, common input terminals installed on the substrate, and an additional input terminal selectively installed on the substrate. The additional input terminal is selectively installed on the substrate according to a type of display apparatus, and thus the image processing board may be used in various types of display apparatuses.

Abstract: Systems and methods of coupling sensors to a structure are disclosed. A particular method includes applying one or more communication traces to the structure. At least one of the one or more communication traces is formed using at least one direct-write technique. The method also includes coupling the one or more communication traces to at least one sensor.