Abstract: The exemplary embodiments disclosed herein provide a heat exchanger assembly for cooling power module bricks, having a plurality of heat exchanger layers where a top layer is in conductive thermal communication with the power module brick. A series of metallic plates are preferably positioned within each heat exchanger layer and are preferably aligned with the power module brick. A circulating fan may be positioned to force circulating gas across the power module brick and through the heat exchanger. An external air fan may be positioned to force external air through the heat exchanger. Pass through junctions may be positioned near edges of the heat exchanger to permit the circulating gas to cross paths with the external air without allowing the two gas flows to mix with one another.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: Apparatus for thermally cooling a solid state memory unit, such as but not limited to densely packed flash memory storage devices in a data storage system. In some embodiments, a thermally conductive corrugated plate has one or more corrugations. The corrugations are adapted for positioning adjacent at least one solid state memory unit to form one or more channels for a cooling fluid to flow therethrough.

Abstract: Disclosed herein are computing devices, and methods of manufacturing computing devices, that have a cooling fan and integrated thermal transfer unit. A centrifugal fan unit includes a rotatable hub, a plurality of blades disposed on the rotatable hub, and a motor coupled to the rotatable hub. The motor causes the rotatable hub to rotate about an axis such that airflow proceeds outward from the centrifugal fan unit along trajectories that are perpendicular to the axis. One or more thermal transfer units have first portions that are coupled to the one or more heat sources and second portions that collectively at least partially surround the centrifugal fan unit.

Abstract: An electronic device includes a substrate (101), a conductor plane (104) which is provided on an inner layer of the substrate (101), an electronic circuit (102) which is mounted on the substrate (101), a heat sink (103) which is mounted on an upper surface of the electronic circuit (102), includes a portion which does not overlap with the electronic circuit (102) when seen in a plan view, faces the conductor plane (104), and is configured of a conductive material, a conductor via (105) which is connected to the heat sink (103) on a surface of the heat sink (103) contacting the electronic circuit (102), and extends toward the conductor plane (104), and a stub (106) which is connected to the conductor via (105) and extends to face the conductor plane (104).

Abstract: An arrangement for a computer system includes a heat-producing expansion card and a cooling device. The cooling device has at least one fan and a hollow body with a first opening and a second opening to cool the expansion card. The hollow body is arranged with the first opening on the expansion card. The at least one fan is arranged on the hollow body in a region of the second opening or is at least partly surrounded by the hollow body by the second opening. The at least one fan produces a flow of air through the hollow body to cool the expansion card.

Abstract: An electronic device and a heat dissipation plate are provided. The electronic device includes a frame or a housing, a first heat generating component, a second heat generating component and a heat pipe, and the heat dissipation plate includes the frame and the heat pipe. The heat pipe is installed at the frame or housing and has branches. An orthogonal projection of the heat pipe on the frame or the housing overlaps at least part of orthogonal projections of the first heat generating component and the second heat generating component on the frame or the housing.

Abstract: A cooling system includes: an evaporator; a condenser; a feed pipe including a feed pipe body configured to couple an opening portion within the evaporator and the condenser, at least a portion of the feed pipe body in a longitudinal direction having an inner cross-sectional area smaller than an inner cross-sectional area of the opening portion; a return pipe configured to couple the condenser and the evaporator; and a bypass pipe configured to couple the evaporator and the feed pipe body.

Abstract: The present application discloses an electronic apparatus, comprising: a frame body, a fixing device, and a functional main body section. The fixing device is connected to the frame body, and used for fixing the electronic apparatus onto a support body. The frame body and the fixing device form a ring-like space when the electronic apparatus is fixed onto the support body by the fixing device. The functional main body section at least includes a first display module and a second display module, which are disposed in the frame body and stacked sequentially in a first direction. The electronic apparatus has a first cross section. The first cross section is a ring formed by sectioning the electronic apparatus in a direction perpendicular to the support body with the support body as a reference object, when the electronic apparatus is fixed onto the support body by the fixing device.

Abstract: A heat transfer device is described. In one or more implementations, a device includes a housing that is moveable through a plurality of orientations involving at least two dimensions during usage, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a plurality of heat pipes configured to transfer heat using thermal conductivity and phase transition from the heat-generating device, the plurality of heat pipes arranged to provide generally uniform heat transfer from the heat-generating device during movement of the housing through the plurality of orientations.

Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.

Abstract: An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.

Abstract: Apparatuses and methods are provided for facilitating air-cooling of, for instance, one or more electronics racks within a data center. The apparatus includes an air-moving assembly and one or more flywheels. The air-moving assembly includes a shaft, one or more mechanical fans coupled to the shaft to rotate, at least in part, with the shaft, and a motor coupled to the shaft to rotatably drive the shaft. The flywheel(s) is sized and coupled to the shaft of the air-moving assembly to store rotational energy, and to facilitate, for a specified period of time, continued rotation of the shaft during interruption in power to the motor. In one implementation, the flywheel(s) is sized and coupled to the shaft to facilitate, for the specified time period, continued rotation of the shaft at a specified percentage, or greater, rotational speed of the shaft compared with shaft speed when rotatably driven by the motor.

Abstract: A modular data center is disclosed. The modular data center may have a plurality of unit structures arranged generally parallel to one another. A plurality of supports may be used for supporting the unit structures elevationally above a floor, and wherein adjacent ones of the unit structures form hot aisles therebetween through which hot air generated from data center components may be channeled. Each unit structure may form an elongated structure having a frame structure, a roof panel supported by the frame structure, and a ceiling panel. The unit structures may be used to channel cold air to the data center components and hot air from the hot aisles out from the unit structures.

Abstract: An image display device includes: a display to output an image; a frame to cover at least a partial upper portion of a rear surface of the display and form an appearance; and a back cover coupled to the frame to cover the rear surface of the display, wherein the back cover includes a first cover disposed in a horizontal direction and detachably coupled to the frame; a second cover coupled to the first cover and disposed to overlap with the first cover; and a fixing member disposed at an inner side of the first cover and the second cover and fixes the second cover to the first cover.

Abstract: A power supply module includes a circuit board and a heatsink plate. The circuit board includes a first principal surface, a second principal surface, and side surfaces. Electronic components are mounted on the first principal surface. The heatsink plate includes a plate-shaped body portion that faces the first principal surface, and a plurality of fixing portions that extend at an angle from the body portion to face the side surfaces. The fixing portions are configured to come into contact with the second principal surface to secure the body portion to the circuit board.

Abstract: According to one embodiment, an electronic device includes a first housing, a second housing, a hinge configured to connect the first housing and the second housing and including a pipe, and a cable. The cable includes a first portion outside the pipe and a second portion inside the pipe, thicker than the first portion and in contact with an inner surface of the pipe.

Abstract: Provided is a motor driver including: a housing; an electronic component that is disposed inside the housing, and that drives or controls a motor; and a fan motor that is disposed below a top plate of the housing, and that causes air to pass from an opening in a bottom plate of the housing to an opening in the top plate. In the motor driver, an outer surface of the top plate is an inclined surface.

Abstract: A touch module is provided, including a hollow frame, a positioning member, and a touch unit. The positioning member includes a main body, an extending portion, and a U-shape structure. The extending portion is connected to the main body and fixed to the frame. The U-shape structure includes a contact portion and a pair of flexible arms. The flexible arms are connected to the main body, wherein the U-shape structure and the main body form a gap therebetween. The contact portion and the extending portion are disposed on opposite sides of the main body, wherein the contact portion is disposed between the two flexible arms. The touch unit is connected to the main body and forms a protrusion, wherein when a force is applied to the touch unit, the protrusion contacts the contact portion.

Abstract: In a relay module device, a signal converting section transmits driving signals of switching elements when receiving input signals from an external device and sets a relationship between the input signals and the driving signals. The relationship includes a first mode in which the signal converting section transmits the driving signals to separately control one of the switching elements with respect to one of the input signals, and a second mode in which the signal converting section transmits the driving signals to concurrently control two or more of the switching elements with respect to one of the input signals.