Abstract: A drive circuit and a memory chip are provided. The drive circuit includes: an amplification module, working under a first voltage domain; an output module, working under a second voltage domain, a power supply voltage of the second voltage domain being greater than a power supply voltage of the first voltage domain, and an output terminal of the output module being an output terminal of the drive circuit; a connection module, connected to an output terminal of the amplification module and an input terminal of the output module; and a feedback module, an input terminal of the feedback module being connected to the output terminal of the output module, and an output terminal of the feedback module being connected to an input terminal of the amplification module.

Abstract: A circuit for detecting an anti-fuse memory cell state includes a current providing module connected to a first node and used to provide constant current; an anti-fuse memory cell array connected to the first node and including at least one bit line, the at least one bit line is connected to a plurality of anti-fuse memory cells and the first node; and a comparator, a first input end of the comparator is connected to the first node and a second input end of the comparator is connected to a first reference voltage, and used to detect a storage state of an anti-fuse memory cell to be tested in the anti-fuse memory cell array.

Abstract: In some embodiments, the present disclosure relates to a one-time program memory device that includes a source-line arranged over a bottom dielectric layer. Further, a bit-line is arranged directly over the source-line in a first direction. A channel isolation structure is arranged between the source-line and the bit-line. A channel structure is also arranged between the source-line and the bit-line and is arranged beside the channel isolation structure in a second direction perpendicular to the first direction. A vertical gate electrode extends in the first direction from the bottom dielectric layer to the bit-line and is arranged beside the channel isolation structure in the second direction. The one-time program memory device further includes a gate dielectric layer arranged between the vertical gate electrode and the bit-line, the source-line, and the channel structure.

Abstract: A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.

Abstract: In some embodiments, the present disclosure relates to a one-time program memory device that includes a source-line arranged over a bottom dielectric layer. Further, a bit-line is arranged directly over the source-line in a first direction. A channel isolation structure is arranged between the source-line and the bit-line. A channel structure is also arranged between the source-line and the bit-line and is arranged beside the channel isolation structure in a second direction perpendicular to the first direction. A vertical gate electrode extends in the first direction from the bottom dielectric layer to the bit-line and is arranged beside the channel isolation structure in the second direction. The one-time program memory device further includes a gate dielectric layer arranged between the vertical gate electrode and the bit-line, the source-line, and the channel structure.

Abstract: Ranks of one or more memory modules can have variable data widths. As part of initializing a memory architecture, a memory controller can be configured to detect the data width of the ranks in the memory architecture. Based on the detected data widths of the ranks, the memory controller can synchronize the clocks and chip select signals of multiple ranks to thereby cause one or more memory chips in each of the multiple ranks to be connected to the shared data lines at the same time.

Abstract: A memory controller includes: a security level setting circuit suitable for setting a security level by monitoring a risk of a row hammer attack; and a refresh management command control circuit suitable for controlling the number of times that a refresh management command is to be applied to a memory per unit time according to the security level.

Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.

Abstract: Disclosed is an operating method of a memory device communicating with a memory controller, which includes receiving a first command from the memory controller, the first command indicating initiation of synchronization of a data clock signal and defining a clock section corresponding to the synchronization, preparing a toggling of the data clock signal during a preparation time period, processing a first data stream based on the data clock signal toggling at a reference frequency, and processing a second data stream based on the data clock toggling at the reference frequency and extended for a period of the defined first clock section.

Abstract: A voltage trimming circuit including: a first resistance circuit having a first resistance value determined by up codes and down codes; a second resistance circuit having a second resistance value determined by the up codes and the down codes; and a comparator to output a voltage detection signal by comparing a voltage level of a reference voltage trimming node to that of a feedback node, wherein the voltage detection signal adjusts the up and down codes, which increase the first resistance value and decrease the second resistance value when the voltage level of the reference voltage trimming node is higher than that of the feedback node, and adjusts the up and down codes, which decrease the first resistance value and increase the second resistance value when the voltage level of the reference voltage trimming node is lower than that of the feedback node.

Abstract: A processing device of a memory sub-system is configured to determine, for a memory unit of the memory device, a plurality of write disturb counts associated with the memory unit, wherein each of the plurality of write disturb (WD) count is associated with a corresponding write disturb direction; compute, for the memory unit, a weighted WD count reflecting the plurality of write disturb counts; determine whether the weighted WD count meets a criterion; and responsive to determining that the weighted WD count meets the criterion, perform a refresh operation on the memory unit.

Abstract: A training method for a memory system is provided. The memory system includes a memory controller and a memory. The memory controller is connected with the memory. The training method includes the following steps. Firstly, the memory samples n command/address signals according to a first signal edge and a second signal edge of a clock signal to acquire a first sampled content and a second sampled content. The memory selectively outputting one of the first sampled content and the second sampled content through m data signals to the memory controller in response to a control signal. Moreover, m is larger than n and smaller than 2n.

Abstract: A signal generating circuit includes the following: a clock circuit, configured to receive an external clock signal to generate an internal clock signal; a controlling circuit, configured to generate a control signal according to the frequency of the external clock signal; and a generating circuit, connected with the clock circuit and the controlling circuit respectively, and configured to receive the internal clock signal, the control signal and a flag signal to generate a target signal. When the flag signal changes from a first level to a second level, the target signal is changed from a third level to a fourth level, and after the target signal maintains the fourth level for a target time length, the target signal is changed from the fourth level to the third level. The generating circuit is further configured to determine the target time length according to the internal clock signal and the control signal.

Abstract: A request to read data at the memory device is received. A first read operation is performed to read the data at the memory device using a first read threshold voltage. The data read at the memory device using the first read threshold voltage is determined to be associated with a first unsuccessful correction of an error. Responsive to determining that the data read at the memory device using the first read threshold voltage is associated with the first unsuccessful correction of the error, a second read threshold voltage is stored at a register to replace a preread threshold voltage previously stored at the register that is associated with the memory device. The first preread threshold voltage was previously used to perform a preread operation at the memory device. A second read operation to read the data at the memory device is performed using the second read threshold voltage.

Abstract: Disclosed herein are related to a memory system including a memory cell and a circuit to operate the memory cell. In one aspect, the circuit includes a pair of transistors to electrically couple, to the bit line, a selected one of i) a voltage source to supply a reference voltage to the memory cell and ii a sensor to sense a current through the memory cell. In one aspect, the circuit includes a first transistor. The first transistor and the bit line may be electrically coupled between the pair of transistors and the memory cell in series.

Abstract: A memory access operation performed on a first memory unit of a memory device is detected. A counter associated with the first memory unit is modified. It is determined that the counter satisfies a threshold criterion, wherein the threshold criterion is based on a random or pseudo-random number within a margin of an average number of memory access operations. A refresh operation is performed on a second memory unit.

Abstract: A spin-orbit torque magnetization rotational element includes a first ferromagnetic layer and a spin-orbit torque wiring facing the first ferromagnetic layer and extending in a first direction. The spin-orbit torque wiring has a plurality of atomic planes in which atoms are arranged and the plurality of atomic planes have reference surfaces in which the same atoms are arranged and a buckling surface having a buckling part. The buckling surface has a plurality of first atoms forming a main surface substantially parallel to the reference surfaces and one or more second atoms forming a buckling part bent toward the main surface.

Abstract: The present disclosure provides a method for determining status of a fuse element of a memory device. The method includes providing the memory device including a first terminal and a second terminal and applying a first power signal on the first terminal of the semiconductor device. The memory device includes a configurable reference resistor unit electrically coupled to the fuse element. The method also includes obtaining an evaluation signal at the second terminal of the memory device and identifying the evaluation signal to determine whether the memory device is redundant. The configurable reference resistor unit includes a first resistor, a first transistor connected in parallel with the first resistor, and a first configurable unit connected to a gate of the first transistor. The first configurable unit is configured to generate a first configurable signal to turn on the first transistor.

Abstract: According to one general aspect, an apparatus may include a memory module. The memory module may include a plurality of memory banks configured to store data. The memory module may include a plurality of memory bank power down controllers, each configured to place one or more respective memory bank(s) in a power down mode. The memory module may include a memory module command interface configured to receive a handshake command from a memory controller, wherein the handshake command comprises a command to remove an indicated memory bank from power down mode.

Abstract: A semiconductor circuit and semiconductor device for determining status of a fuse element are provided. The semiconductor circuit includes a configurable reference resistor unit with a first terminal receiving a first power signal and a second terminal electrically coupled to the fuse element. The semiconductor circuit also includes a latch circuit for reading a first status signal of a first node between the configurable reference resistor unit and the fuse element. The configurable reference resistor unit includes a first resistor, a first transistor connected in parallel with the first resistor, and a first configurable unit connected to a gate of the first transistor. The first configurable unit is configured to generate a first configurable signal to be provided to the gate of the first transistor.