Abstract: A magnetic field sensor includes a plurality of transducer legs coupled together as a first circuit to sense a magnetic field, wherein each transducer leg comprises a plurality of magnetoresistance sense elements. The magnetic field sensor also includes a second circuit including a first plurality of current lines, wherein each current line of the first plurality of current lines is adjacent to a corresponding plurality of magnetoresistance sense elements of a transducer leg of the plurality of transducer legs. When at least one current line of the first plurality of current lines is energized, a magnetization of each magnetoresistance sense element of the transducer leg is aligned in a first direction or a second direction opposite to the first direction. A routing pattern of the at least one current line is configured to generate an equal population of magnetoresistance sense elements with magnetization aligned in the first and second directions.

Abstract: A system includes a proportional-integrated-derivative (PID) regulator. The system also includes a fault detection unit. The fault detection unit is for receiving at least two outputs from the PID regulator. The at least two outputs include at least two rotor reference frame (D-Q) currents. The fault detection unit is further for generating a detection signal based on the at least two rotor reference frame currents. The detection signal identifies a fault based on the fault detection signal amplitude value based on the magnitudes of the amplitudes for each of the at least two rotor reference frame D-Q currents. The fault detection unit is for identifying an existence of a permanent magnet motor fault based on a comparison between the fault detection signal amplitude value and an amplitude threshold value. Further the fault localization signature is utilized to locate the location of the fault.

Abstract: In one embodiment, a method for measuring current comprises generating a sensor current based on a current being measured. The method also comprises converting a combined current into a first frequency, wherein the combined current is a sum of the sensor current and a common-mode current, and converting the first frequency into a first count value. The method further comprises converting the common-mode current into a second frequency, converting the second frequency into a second count value, and subtracting the second count value from the first count value to obtain a current reading.

Abstract: An interface test device for testing a circuit, the interface test device including a module configured to open and close a medium to high voltage monitoring circuit, the module having at least one pair of contacts biased towards each other that are electrically connected and in line with the medium to high voltage monitoring circuit; at least one pair of insulated jacks, wherein the at least one pair of insulated jacks is connected to the medium to high voltage monitoring circuit before or substantially simultaneously with the medium to high voltage monitoring circuit being opened; at least one disconnect plug that is insertable into the module through at least one parking opening into at least one parking position and insertable into the module through at least one disconnect opening into at least one disconnect position.

Abstract: A line detecting apparatus and a line detecting method for an array substrate relates to the field of line detecting technology. The detecting method comprises: arranging an input terminal sensor (30) at a signal input terminal of a wire to be detected, arranging one output terminal sensor (41, 42, 43) at a signal output terminal of the wire to be detected, and arranging other output terminal sensor (41, 42, 43) at a signal output terminal of another wire adjacent to the wire to be detected; measuring an output voltage of the wire to be detected by a voltage detector; and determining the line conduction condition of the wire to be detected according to the output voltage as measured. When the sensors perform line scan, the coordinate of the specific location where the short-circuit or open-circuit occurs can be found directly without performing scan by PDS or AOI, thus simplifying the technical processes, shortening the time for detecting, and saving the production cost.

Abstract: A switching matrix includes a plurality of input ports, a plurality of output ports, a plurality of switching devices configured to open and close, an electrical connection between the input ports and the output ports, and an electrical sensor configured to generate a signal by measuring a predetermined electrical property of the electrical connection, the open and close of switching devices is pre-determined by status read from the electrical sensor.

Abstract: An integrated circuit includes a copper hillock-detecting structure. The copper hillock-detecting structure includes a copper metallization layer and an intermediate plate structure spaced apart from adjacent to the copper metallization layer. The intermediate plate structure includes a conducting material plate. The intermediate plate structure further includes a plurality of conductive vias that are electrically and physically connected with the conducting material plate. The copper hillock-detecting structure further includes a sensing plate adjacent to the intermediate plate and electrically and physically connected with the plurality of vias such that the vias are disposed between the intermediate plate and the sensing plate.

Abstract: Light-emitting devices, such as LEDs, are tested using a photometric unit. The photometric unit, which may be an integrating sphere, can measure flux, color, or other properties of the devices. The photometric unit may have a single port or both an inlet and outlet. Light loss through the port, inlet, or outlet can be reduced or calibrated for. These testing systems can provide increased reliability, improved throughput, and/or improved measurement accuracy.

Abstract: A test system includes a test socket assembly for capturing low energy electromagnetic emissions from radio frequency (RF) integrated circuits (ICs). The test socket assembly is structured to direct electromagnetic radiation from the device under test (DUT) to a socket port coupled to one end of a waveguide for transmission to a tester. The combination of the materials comprising the socket assembly is selected to more efficiently couple electromagnetic emissions from the DUT into the waveguide. For example, a reflective plane with an adjustable position may be located below the DUT in order to increase coupling of electromagnetic radiation from the DUT into the waveguide.

Abstract: A capacitive switch includes a drive circuit, a detection circuit, a reference circuit and an identification unit. The drive circuit outputs a drive signal and a switching signal, wherein the drive signal is outputted to a first node and a second node. The detection circuit is sequentially coupled to the first node and the second node according to the switching signal and generates a first detection signal according to the drive signal. The reference circuit is sequentially coupled to the second node and the first node according to the switching signal and generates a second detection signal according to the drive signal. The identification unit includes a first input terminal and a second input terminal respectively coupled to the first node and the second node, and identifies a phase shift between inputted detection signals received by the first input terminal and the second input terminal.

Abstract: A sensor for detecting a position of an encoder magnet in a direction of motion, including: a first coil extending in the direction of motion, a second and third coil, which are aligned with the first coil and which are arranged symmetrical to each other with respect to a point of symmetry as observed in the direction of motion and which accordingly form a first and second transformer with the first coil, the transformation ratio of which transformers depends on the position of the encoder magnet, and a magnetic asymmetry, which changes the transformation ratio of one of the transformers with respect to the other transformer.

Abstract: An electronic device includes a housing and an electrical connector disposed along the housing. The electrical connector includes one or a plurality of electrical contacts having at least a portion thereof exposed to an exterior of the housing. An interface circuit is operable with the electrical connector and coupled to one or more electrical contacts of the electrical connector to interact with a complementary connector when connected to the electrical connector. A moisture detection circuit is to detect moisture contacting the electrical connector.

Abstract: A stroke sensor system includes a tubular vehicle-body-side member, a tubular vehicle-wheel-side member, and a displacement obtainer. The tubular vehicle-body-side member is disposed at a vehicle body side. The tubular vehicle-wheel-side member is coupled to the vehicle-body-side member on a vehicle wheel side and movable in an axial direction of the vehicle-body-side member relative to the vehicle-body-side member. At least one of the members is a conductor. Another one of the members includes a coil. The displacement obtainer includes a capacitor electrically coupled to the coil and constituting an LC oscillation circuit that outputs an oscillation waveform when the members move relative to each other.

Abstract: A test fixture has a flexible plastic cable that acts as a waveguide. The Device-Under-Test (DUT) is a small transceiver and antenna that operate in the Extremely High-Frequency (EHF) band of 30-300 GHz. The size of the DUT transceiver is very small, limiting the power of emitted electromagnetic radiation so that close-proximity communication is used. The envelope for reception may only extend for about a centimeter from the DUT transceiver, about the same size as the test socket. A slot is formed in the test socket very near to the antenna. The slot receives one end of the plastic waveguide. The slot extends into the envelope by the DUT transceiver so that close-proximity radiation is captured by the plastic waveguide. The waveguide has a high relative permittivity and reflective metalized walls so that the radiation may be carried to a receiver that is outside the envelope.

Abstract: When a voltage applied to a heater assumes a low-level potential, a control section of a load drive apparatus instantaneously supplies an anomaly judgment current to the heater, and computes the electrical resistance of the heater on the basis of the anomaly judgment current. The control section judges whether or not any of anomalous states of the heater, including at least a deteriorated state of the heater and wiring anomalous states of the heater, has occurred on the basis of the electrical resistance of the heater.

Abstract: A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the test pin is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested. The test pin has a hard stop edge which engages a hard stop wall which limits its rotation movement. The bottom of the pin has a shallow convex curvature preferably with a flat region and the tip of the test pin has a chisel edge.

Abstract: An interface test device for testing a circuit, the interface test device including a module assembly including a plurality of modules, wherein a test block assembly is formed from individual test blocks that are arranged at one another in parallel and fixated at one another, wherein a test plug assembly is formed from individual test plugs that are arranged at one another other in parallel and fixated at one another, wherein a movement of a lever arm out of a plane of an insertion direction of the test plug assembly into the test block assembly is transferred by strut elements to pinions of the test plug assembly and inserts test fingers of the test plug assembly into openings of the test block assembly, wherein one of the test fingers of the test plug assembly opens a medium to high voltage monitoring circuit.

Abstract: An appliance includes an operation unit that is mounted in a case of the appliance that is supplied power by an external power supply and that includes at least one of a motor and a heating member. The appliance further includes a control circuit mounted in the case of the appliance and configured to control the operation unit to perform appliance functionality that is different than measuring power. The appliance further includes a power meter coupled to the control circuit, built into the case, and configured to measure power consumed by the appliance in performing the appliance functionality.

Abstract: FPAs on a wafer can be tested prior to dicing the wafer into individual dies. A focal plane array (FPA) can comprise an array of photodetectors, such as microbolometers, on a semiconductor substrate or die. FPAs can be manufactured on a wafer to make multiple FPAs on a single wafer that can be later diced or divided into individual FPAs. Prior to dicing the wafer, the FPAs can be tested electrically and radiometrically in bulk to characterize individual FPAs, to identify bad pixels, to identify bad chips, to calibrate individual FPAs, and the like. These test results can be used to determine acceptable FPAs and can be used to provide initial settings for imaging systems with the tested and integrated FPA.

Abstract: Method and apparatus for determining a ground fault impedance. In one embodiment the apparatus comprises a voltage divider and a ground fault detection module for (i) determining a first voltage based on at least one voltage measurement of the voltage divider while the voltage divider is coupled between the first AC line and the DC line; (ii) determining a second voltage based on at least one voltage measurement of the voltage divider while the voltage divider is coupled between the second AC line and the DC line; (iii) determining a differential voltage based on at least one voltage measurement between the first AC line and the second AC line; and (iv) computing the ground fault impedance based on the first voltage, the second voltage, and the differential voltage.