Abstract: In one embodiment, systems and methods for determining the positions of strands in a post-tensioned tendon involve positioning a magnet in close proximity to the outer surface of a tendon, moving the magnet around the periphery of the tendon, and measuring the force of attraction between the magnet and strands within the tendon at multiple angular positions of the tendon.

Abstract: Techniques for estimating state-dependent capacitance of a circuit are described herein. In one embodiment, a method for determining a circuit state for a circuit comprises determining a capacitance of the circuit for each one of a plurality of circuit states, and selecting one of the circuit states based on the determined capacitances.

Abstract: In one embodiment, a TMR field sensor utilizes existing one or more self-test current lines in a configuration to extend magnetic field measurement range without sacrificing measurement sensitivity. The self-test current lines are energized to facilitate magnetic field measurement when the measured magnetic field reaches a threshold. The magnetic field created by self-test coil opposes an external magnetic field being measured to keep the net magnetic field within a desired range where the magnetic field sensor has linear output and desired sensitivity.

Abstract: In embodiments, three magnetic field sensing elements are arranged equidistantly from each other to define a plane and a central axis perpendicular to the plane. The magnetic field sensing elements are configured to generate a respective output signal representing proximity of a magnetic target that is proximate to the central axis and capable of moving relative to the central axis. A processor circuit is coupled to receive output signals from each of the sensors and configured to calculate a position of the magnetic target relative to the plane.

Abstract: A shunt resistance type current sensor includes a bus bar, a circuit board disposed to oppose the bus bar, a shunt resistance part in the bus bar, connection terminals which electrically connect the bus bar and the circuit board, and a voltage detector which is mounted on the circuit board and detects a voltage applied to the bus bar to detect a magnitude of current to be measured flowing through the bus bar. The connection terminal is formed integrally with the bus bar as an extending piece extended from an edge part of the bus bar, an area of the connection terminal reduced in its plate thickness than that of the bus bar is set in a range from a tip side thereof, and the tip side of the connection terminal penetrates the circuit board and connects with the circuit board.

Abstract: A circuit includes a stacked circuit layer, a plurality of test contact points, and a comparator. The stacked circuit layer includes a plurality of reference capacitors each having a reference capacitance. Each of the test contact points is electrically connecting to an under-test capacitor of an under-test module. The comparator compares the reference capacitance of one of the reference capacitors with an under-test capacitance of the under-test capacitor corresponding to one of the test contact points to measure a range of the under-test capacitance.

Abstract: A direct (DC) voltage is applied to an electrode at a voltage value to clamp a workpiece to an electrostatic chuck in a processing chamber. The electrode is embedded into the electrostatic chuck. An electrostatic chuck current through the electrode at the DC voltage is measured. A DC self bias induced on the workpiece by a plasma is determined based on the electrostatic chuck current and the applied voltage.

Abstract: A method for detecting defects in an object of interest comprises applying an ultrasonic signal including a tone burst having a predetermined frequency and number of cycles into an object of interest, receiving a return signal reflected from the object of interest, and processing the return signal to detect defects in at least one inner material. The object may have an outer material and the at least one inner material that have different acoustic impedances. An ultrasonic sensor system includes an ultrasonic sensor configured to generate an ultrasonic signal having a tone burst at a predetermined frequency corresponding to a resonant frequency of an outer material of an object of interest.

Abstract: A test fixture has a flexible plastic cable that acts as a waveguide. The Device-Under-Test (DUT) is a small transceiver and antenna that operate in the Extremely High-Frequency (EHF) band of 30-300 GHz. The size of the DUT transceiver is very small, limiting the power of emitted electromagnetic radiation so that close-proximity communication is used. The envelope for reception may only extend for about a centimeter from the DUT transceiver, about the same size as the test socket. A slot is formed in the test socket very near to the antenna. The slot receives one end of the plastic waveguide. The slot extends into the envelope by the DUT transceiver so that close-proximity radiation is captured by the plastic waveguide. The waveguide has a high relative permittivity and reflective metalized walls so that the radiation may be carried to a receiver that is outside the envelope.

Abstract: A single layer capacitive touch module including a sensor dot matrix is provided. The sensor dot matrix has M×N sensor dots formed by M driving lines intersecting N sensing lines. Each one of the sensing lines and M driving lines forming a sensor zone, wherein each sensor zone comprises M sensor dots, M and N are positive integers. A driving unit is coupled to the driving lines. A first soft board has a lead-in area on a first side thereof to be coupled with the driving lines on a first side of the sensor dot matrix. A second soft board has a lead-in area on a first side for being coupled with the driving lines and sensing lines on a second side of the sensor dot matrix opposite the first side of the sensor dot matrix.

Abstract: A semiconductor device includes a substrate, an insulating film provided on a surface of the substrate, and a sensing film formed of a conductive material deposited on top of the insulating film. The sensing film defines at least one conductive path between a first position and a second position on the insulating film. A first circuit connection is electrically connected to the sensing film at the first position on the insulating layer, and a second circuit connection is electrically connected to the sensing film at the second position. A control circuit is operatively connected to the first circuit connection and the second circuit connection for measuring an electrical resistance of the sensing film. The sensing film has a thickness that enables a resistivity of the sensing film to be altered predictably in a manner that is dependent on ambient moisture content.

Abstract: A semiconductor device measures a state of a MEMS as a first voltage variation at a sensing node. The state of the MEMS includes a capacitance. A first capacitor is coupled between the sensing node and an input of an integrator for transferring the first voltage variation to a second node as a first signal. A second voltage variation is routed through a second capacitor to the second node as a second signal. The integrator integrates the first signal and second signal to provide an integrated signal. An ADC has an input coupled to an output of the integrator and converts the integrated signal to a digital signal representative of the capacitance of the MEMS. A DAC has an input coupled to the output of the ADC. A second capacitor is coupled between an output of the DAC and the sensing node.

Abstract: A zero insertion force (ZIF) connector can include a connector housing defining an opening and an interior space for receiving a mating member, multiple LIGA springs positioned within the interior space and configured to apply pressure to the mating member while in a first position, and a locking component to cause the LIGA springs to move to a second position responsive to a user pressing the locking component. The LIGA springs do not apply pressure to the mating member while in the second position.

Abstract: A test and measurement system including a device under test, an accessory, a controller and a test and measurement instrument. The accessory is connected to the device under test and includes a signal input to receive an input signal from the device under test, a compensation unit configured to apply a compensation signal internal to the accessory, and a signal output to output an output signal read from the device under test. The controller is connected to the accessory and includes one or more receivers to receive the input signal and the output signal from the accessory, and a microcontroller or correction circuit configured to compare the input signal and the output signal and in response to the comparison provide a compensation signal to the compensation unit.

Abstract: A probe assembly includes plural capacitive contacts that are separate from each other and a conductive depletion gate disposed between and separating the contacts from each other. The depletion gate is configured to receive a direct electric voltage to deplete regions of a sample under test of electrons. The contacts are configured to be placed in close proximity to a buried conducting layer in the sample under test without engaging the buried conducting layer, thereby capacitively coupling to the buried conducting layer. A first subset of the capacitive contacts is configured to apply an alternating electric current to a portion of the sample under test and a second subset of the capacitive contacts is configured to sense an alternating voltage response of the portion of the sample under test to characterize one or more electrical properties of the sample under test without the capacitive contact with the buried conductive layer.

Abstract: A sensor system with performance compensation testing capability includes a sensor device, a resistance bridge, a signal conditioning circuit, a first test connector, and a second test connector. The resistance bridge circuit is disposed on the sensor device and includes an excitation terminal, a circuit common terminal, and two output terminals, and is configured, upon being energized, to supply a bridge output voltage across the two output terminals. The signal conditioning circuit is electrically coupled to the excitation terminal, the circuit common terminal, and the two output terminals, and is configured to supply a sensor output signal representative of bridge output voltage. The first test connector is electrically coupled to one of the two output terminals and is configured to be coupled to an impedance test device. The second test connector is electrically coupled to the circuit common terminal and is configured to be coupled to the impedance test device.

Abstract: A test fixture has a flexible plastic cable that acts as a waveguide. The Device-Under-Test (DUT) is a small transceiver and antenna that operate in the Extremely High-Frequency (EHF) band of 30-300 GHz. The size of the DUT transceiver is very small, limiting the power of emitted electromagnetic radiation so that close-proximity communication is used. The envelope for reception may only extend for about a centimeter from the DUT transceiver, about the same size as the test socket. A slot is formed in the test socket very near to the antenna. The slot receives one end of the plastic waveguide. The slot extends into the envelope by the DUT transceiver so that close-proximity radiation is captured by the plastic waveguide. The waveguide has a high relative permittivity and reflective metalized walls so that the radiation may be carried to a receiver that is outside the envelope.

Abstract: There is provided a grounding detection device and method. The grounding detection device may include an insulation tester and a grounding resistance providing unit. The insulation tester may be mounted in a first cabinet, electrically connected to a positive busbar and a negative busbar to detect an equivalent busbar-to-ground resistance, and grounded via the first cabinet. The grounding resistance providing unit may be mounted at least in part in a second cabinet different from the first cabinet, electrically connected to at least one of the positive busbar and the negative busbar to provide a grounding resistance, and grounded via the second cabinet. The insulation tester may determine, based on resistance values of the equivalent busbar-to-ground resistance and the grounding resistance, whether there is a ground fault or not for the insulation tester, the first cabinet, and the second cabinet.

Abstract: A position sensor arrangement has a transformer based position sensor and a cable peaking correction apparatus. The cable peaking correction apparatus is controllably coupled to a transformer based position sensor excitation input or the outputs from the transformer based position sensor. A signal processing system is connected to multiple outputs from the transformer based position sensor arrangement.

Abstract: Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed.