Patents Examined by Nathan K Ford
  • Patent number: 10276355
    Abstract: Multi-zone reactors, systems including a multi-zone reactor, and methods of using the systems and reactors are disclosed. Exemplary multi-zone reactors include a movable susceptor assembly and a moveable plate. The movable susceptor assembly and movable plate can move vertically between reaction zones of a reactor to expose a substrate to multiple processes or reactants.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: April 30, 2019
    Assignee: ASM IP Holding B.V.
    Inventors: Carl Louis White, Mohith Verghese, Eric James Shero, Todd Robert Dunn
  • Patent number: 10269599
    Abstract: A semiconductor manufacturing apparatus includes a chamber, a view port window on a sidewall of the chamber and configured to receive an optical emission spectroscopy (OES); and an air distributor located between the view port window and an inner space of the chamber. The air distributor includes a hollow region aligned with the transparent window and configured to generate an air curtain in the hollow region to isolate the view port from the inner space.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: April 23, 2019
    Inventors: Chao-Tzung Tsai, Tzu Ken Lin, I-Chang Wu, Ching-Lun Lai, Li-Jia Liou
  • Patent number: 10233539
    Abstract: Disclosed is a vapor deposition apparatus comprising an adsorption apparatus disposed in a vapor deposition cavity, wherein the adsorption apparatus comprising: a plurality of magnetic blocks arranged in a matrix disposed on a side of a substrate to be vapor deposited away from a metal mask plate, and a towing apparatus for adjusting each of the magnetic blocks to move up and down relative to the substrate to be vapor deposited. Such a vapor deposition apparatus may cause the metal mask plate to closely fit the substrate to be vapor deposited, such that a correct pattern will be formed when sub-pixel units are vapor deposited, and cause the magnetic fields of all the magnetic blocks to tend to be consistent, avoiding affecting the above-mentioned pattern by a deformation of the metal mask plate due to the inhomogeneity of the magnetic fields.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: March 19, 2019
    Inventors: Lifei Ma, Peng Zhang
  • Patent number: 10236197
    Abstract: An apparatus and method for processing a substrate in a processing system containing a deposition chamber, a treatment chamber, and an isolation region, separating the deposition chamber from the treatment is described herein. The deposition chamber deposits a film on a substrate. The treatment chamber receives the substrate from the deposition chamber and alters the film deposited in the deposition chamber with a film property altering device. Processing systems and methods are provided in accordance with the above embodiment and other embodiments.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: March 19, 2019
    Inventors: Karthik Janakiraman, Abhijit Basu Mallick, Hari K. Ponnekanti, Mandyam Sriram, Alexandros T. Demos, Mukund Srinivasan, Juan Carlos Rocha-Alvarez, Dale R. Dubois
  • Patent number: 10138540
    Abstract: An infiltration device comprises a heating room, a rotary tray, a rotary bracket, a material box, an elevating mechanism and a transmission device, wherein the heating room has an annular groove, and the rotary tray is arranged below an opening end at a lower end of the heating room; the rotary bracket is installed on the rotary tray; the material box is arranged on the rotary bracket; the rotary tray and the material box can move upward and downward under the action of the elevating mechanism; the rotary bracket can spin in the annular groove and revolve around a central axis of the rotary tray under the action of the transmission device. The infiltration method provided by the invention comprises the steps of charging, vacuum-pumping, high temperature infiltrating, cooling, discharging, etc.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: November 27, 2018
    Assignee: Tianhe (Baotou) Advanced Tech Magnet Co., Ltd.
    Inventors: Juchang Miao, Yong Zhai, Jianxin Ma, Enfeng Gao, Yanling Song, Shulin Diao, Yi Dong, Haibo Yi, Shujie Wu, Yi Yuan, Ya Chen, Wenjie Yuan
  • Patent number: 10113236
    Abstract: Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: October 30, 2018
    Inventors: Adib Khan, Shankar Venkataraman, Jay D. Pinson, II, Jang-Gyoo Yang, Nitin Krishnarao Ingle, Qiwei Liang
  • Patent number: 10095114
    Abstract: A method and apparatus disclosed herein apply to processing a substrate, and more specifically to a method and apparatus for improving photolithography processes. The apparatus includes a chamber body, a substrate support disposed within the chamber body, and an electrode assembly. The substrate support has a top plate disposed above the substrate support, a bottom plate disposed below the substrate support, and a plurality of electrodes connecting the top plate to the bottom plate. A voltage is applied to the plurality of electrodes to generate an electric field. Methods for exposing a photoresist layer on a substrate to an electric field are also disclosed herein.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: October 9, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Kartik Ramaswamy, Srinivas D. Nemani
  • Patent number: 9994956
    Abstract: An apparatus for in situ fabrication of multilayer heterostructures is provided comprising a first vacuum chamber adapted for atomic layer deposition and comprising a first stage docking assembly configured to dock a detachable stage configured to support a substrate; a second vacuum chamber adapted for ultra-high vacuum physical or chemical vapor deposition and comprising a second stage docking assembly configured to dock the detachable stage; a load lock vacuum chamber between the first and second vacuum chambers and comprising a third stage docking assembly configured to dock the detachable stage, the load lock vacuum chamber coupled to the first vacuum chamber via a first shared valve and coupled to the second vacuum chamber via a second shared valve; and a substrate transport vacuum chamber comprising a substrate transfer device, the substrate transfer device configured to detachably couple to the detachable stage and to transfer the substrate supported by the detachable stage in situ between the first v
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: June 12, 2018
    Assignee: University of Kansas
    Inventors: Judy Z. Wu, Rongtao Lu, Alan Elliot, Allen Hase
  • Patent number: 9947557
    Abstract: A semiconductor substrate processing system includes a chamber that includes a processing region and a substrate support. The system includes a top plate assembly disposed within the chamber above the substrate support. The top plate assembly includes first and second sets of plasma microchambers each formed into the lower surface of the top plate assembly. A first network of gas supply channels are formed through the top plate assembly to flow a first process gas to the first set of plasma microchambers to be transformed into a first plasma. A set of exhaust channels are formed through the top plate assembly. The second set of plasma microchambers are formed inside the set of exhaust channels. A second network of gas supply channels are formed through the top plate assembly to flow a second process gas to the second set of plasma microchambers to be transformed into a second plasma.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: April 17, 2018
    Assignee: Lam Research Corporation
    Inventors: John Patrick Holland, Peter L. G. Ventzek, Harmeet Singh, Richard Gottscho
  • Patent number: 9916995
    Abstract: A substrate processing tool includes N substrate processing stations arranged in a first transfer plane around a central cavity, where N is an integer greater than one. At least one of the N substrate processing stations is configured to process the substrate. M substrate processing stations are arranged in a second transfer plane around the central cavity, where M is an integer greater than one. The second transfer plane is arranged parallel to and above the first transfer plane. An upper tool portion includes the M substrate processing stations and a first portion of the N substrate processing stations. A rotatable lower tool portion rotates relative to the upper tool portion. A second portion of the N substrate processing stations rotates with the rotatable lower tool portion.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: March 13, 2018
    Inventor: Karl Leeser
  • Patent number: 9828670
    Abstract: A loader device is arranged for densifying porous preforms of stackable shape by means of directed stream chemical vapor infiltration in a reaction chamber of an infiltration oven. The device comprises a support tray, a first stack having a plurality of bottom rings arranged on the support tray and a plurality of injection orifices, a second stack comprising a plurality of top rings and a plurality of discharge orifices extending between the outer periphery and inner periphery of each ring. The device includes a first non-porous wall corresponding to the porous preforms and arranged on the support tray inside the bottom rings of the first stack, and a second non-porous wall corresponding to the porous preforms extending between the bottom ring situated at the top of the first stack and the top ring situated at the top of the second stack.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: November 28, 2017
    Assignee: HERAKLES
    Inventors: Stephane Goujard, Sebastien Bertrand, Adrien Delcamp, Franck Beauvais
  • Patent number: 9793146
    Abstract: A fab can be constructed as a round or rectangular annular tube with a primary cleanspace located in-between its inner and outer tubes. The fab can be encircled with levels upon which tools can be densely packed while preserving unidirectional air flow. If only tool ports are inside, and robotics are used, primary cleanspace size can be minimized. Highly simplified robotics can be used. Tools can be removed and repaired centrally. A secondary cleanspace can be added for tool bodies. Multilevel construction enhances use of prefabricated units for fab build or maintenance. Curves or folds, applied to a conventional planar cleanroom, can construct a wide range of fab geometries, including a tubular non-annular fab. A fab can also be constructed according to a curved or non-curved sectional cut of an annular tube. A novel fab, of a non-curved section, can include a non-segmented cleanspace or have its tools vertically stacked.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: October 17, 2017
    Assignee: Futrfab, Inc.
    Inventor: Frederick A. Flitsch
  • Patent number: 9790584
    Abstract: An apparatus and method for coating a substrate moved along a path of travel through the apparatus. A plasma source issues a plasma jet into which a first reagent is injected from a discharge orifice located upstream of the jet. A second reagent is injected into the jet from a discharge orifice located downstream of the jet. A controller is configured to regulate the flow of the first reagent according to a first set of parameters and regulate the flow of the second reagent according to a second set of parameters. As a result, the first and second reagents are applied to the substrate to form at least one layer of a coating on the substrate.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: October 17, 2017
    Inventor: Steven M. Gasworth
  • Patent number: 9644268
    Abstract: A thermal bridge connecting first and second processing zones and a method for transferring a work piece from a first to a second processing zone by way of the thermal bridge are disclosed. A work piece, transportable from the first to the second processing zone on or above the thermal bridge, is maintained at a temperature between the temperatures of the processing zones. The thermal bridge member features a thermally conductive transport member for the work piece supported over an infrared transmissive member that is insulative to heat conduction and convection. The bridge insulative member extends between the first and second processing zones or between reactors. An infrared radiation beam source emits infrared radiation which passes through the bridge insulative member to the transport member, heating the member. In an alternate embodiment, the transport member may be heated directly. A liner member may be mounted above the bridge member to retain heat.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: May 9, 2017
    Assignee: ALTA DEVICES, INC.
    Inventors: Gregg Higashi, Khurshed Sorabji, Andreas Hegedus
  • Patent number: 9640416
    Abstract: A single- and dual-chamber module-attachable wafer-handling chamber includes: a wafer-handling main chamber equipped with a wafer-handling robot therein, and adaptors for connecting process modules to the wafer-handling main chamber. The adaptors are detachably attached to the sides of the wafer-handling main chamber, respectively, and the process modules are detachably attached to the adaptors, respectively, so that the process modules can be attached to the wafer-handling main chamber, regardless of whether the process modules are of a single-chamber type or dual-chamber type.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: May 2, 2017
    Assignee: ASM IP Holding B.V.
    Inventor: Izumi Arai
  • Patent number: 9631277
    Abstract: Provided are atomic layer deposition apparatus and methods including a rotating wheel with a plurality of substrate carriers for continuous processing of substrates. The processing chamber may have a loading station on the front end which is configured with one or more robots to load and unload substrates from the substrate carriers without needing to stop the rotating wheel.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: April 25, 2017
    Assignee: Applied Materials, Inc.
    Inventor: Joseph Yudovsky
  • Patent number: 9611540
    Abstract: An end station for an ion implantation system is provided, wherein the end station comprises a process chamber configured to receive an ion beam. A load lock chamber is coupled to the process chamber and configured to selectively introduce a workpiece into the process chamber. An electrostatic chuck within the process chamber is configured to selectively translate through the ion beam, and a shield within the process chamber is configured to selectively cover at least a portion of a clamping surface of the electrostatic chuck to protect the clamping surface from one or more contaminants associated with the ion beam. A docking station within the process chamber selectively retains the shield, and a transfer mechanism is configured to transfer a workpiece between the load lock chamber and the electrostatic chuck, and to transfer the shield between the docking station and the clamping surface of the electrostatic chuck.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: April 4, 2017
    Inventors: Kan Ota, Stanley W. Stone, Steve T. Drummond
  • Patent number: 9598285
    Abstract: An apparatus of the present invention for producing aligned carbon nanotube aggregates is an apparatus for producing aligned carbon nanotube aggregates, the apparatus being configured to grow the aligned carbon nanotube aggregate by: causing a catalyst formed on a surface of a substrate to be surrounded by a reducing gas environment constituted by a reducing gas; heating at least either the catalyst or the reducing gas; causing the catalyst to be surrounded by a raw material gas environment constituted by a raw material gas; and heating at least either the catalyst or the raw material gas, at least either an apparatus component exposed to the reducing gas or an apparatus component exposed to the raw material gas being made from a heat-resistant alloy, and having a surface plated with molten aluminum.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: March 21, 2017
    Inventors: Akiyoshi Shibuya, Keiichi Kawata, Kenji Hata, Motoo Yumura
  • Patent number: 9570714
    Abstract: An organic layer deposition assembly, an organic layer deposition apparatus, an organic light-emitting display apparatus, and a method of manufacturing the organic light-emitting display apparatus, in order to improve a characteristic of a deposited layer, the organic layer deposition assembly including a deposition source for discharging a deposition material; a deposition source nozzle unit disposed at a side of the deposition source, and including a plurality of deposition source nozzles; and a patterning slit sheet disposed while facing the deposition source nozzle unit, and including a plurality of patterning slits and one or more alignment confirmation pattern slits that are formed at edge portions of the plurality of patterning slits, wherein the deposition material that is discharged from the deposition source passes through the patterning slit sheet and then is formed on the substrate, while a deposition process is performed.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: February 14, 2017
    Assignee: Samsung Display Co., Ltd
    Inventors: Myung-Ki Lee, Sung-Bong Lee, Dong-Seob Jeong, Mu-Hyun Kim
  • Patent number: 9530677
    Abstract: A substrate processing apparatus comprises a processing chamber for storing a substrate and performing a specified processing on the substrate, a substrate holding jig for holding the substrate in the processing chamber, a placement stand capable of moving the substrate holding jig inside and outside the processing chamber while mounting the substrate holding jig, a substrate holding jig movement mechanism for moving the substrate holding jig to a location different from the placement stand while holding the substrate holding jig, and a substrate holding jig movement suppression mechanism for suppressing vertical and horizontal movement of the substrate holding jig in order to keep the substrate holding jig mounted on the placement unit of the substrate holding jig movement mechanism.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: December 27, 2016
    Inventors: Takatomo Yamaguchi, Akinori Tanaka, Daisuke Hara