Patents Examined by Neel D Shah
  • Patent number: 11367790
    Abstract: Test structures for a body-contacted field effect transistor (BCFET) include: a single-pad structure with body contact and probe pad regions connected to a channel region at first and second connection points with a known separation distance between the connection points; and a multi-pad structure with a body contact region connected to a channel region at a first connection point and multiple probe pad regions connected to the channel region at second connection points that are separated from the first connection point by different separation distances.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: June 21, 2022
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Anupam Dutta, Balaji Swaminathan
  • Patent number: 11360140
    Abstract: The present disclosure relates to a radio frequency (RF) functional probe for testing an RF device in a cryogenic environment. The RF functional probe includes a probe head configured to receive the RF device, a flange structure, an isolation structure coupled between the probe head and the flange structure, and an RF cable structure extending from the flange structure, through the isolation structure, and to the probe head. The isolation structure is configured to provide thermal and electrical isolation to reduce radiant heat leak from the RF cable structure to the RF device. Herein, the isolation structure includes multiple baffle structures, each of which includes cable guides. The cable guides of each baffle structure are configured to guide routing paths for the RF cable structure. The RF cable structure is configured to transmit signals to and from the RF device.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 14, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Seth Kimes, Richard P. Rouse, Brandon S. Bohlen
  • Patent number: 11360141
    Abstract: Example devices and methods for compensating for monitoring a surge protection device are provided. In some embodiments, a device is configured to couple to a surge protection device. The device comprises a processor that is capable of sending a DC current signal. A serial data interface is electrically connected to the processor and includes at least one shift register. The device also comprises a multiplexer coupled to the serial data interface. The serial data interface is operable to direct the DC current through the multiplexer. The device also comprises an analog to digital converter (optionally embedded within the processor) that is operable to output a digital signal corresponding to a voltage induced by the DC current signal. Returned DC signals represent surge protection device's health and a multitude of other surge module information.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: June 14, 2022
    Assignee: ASCO Power Technologies, L. P.
    Inventors: Glenn Edward Wilson, Matthew Arthur Scott, Daniel George Buchanan
  • Patent number: 11352880
    Abstract: An assembly for use in a wellbore can include a plurality of sensors positioned external to a casing string. The plurality of sensors can be positioned for detecting an amount of a hydrocarbon that is present in a fluid in the wellbore and a pH of the fluid in the wellbore. The plurality of sensors can be positioned for wirelessly transmitting signals representing the amount of the hydrocarbon that is present in the fluid and the pH of the fluid to a receiving device.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: June 7, 2022
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Paul F. Rodney, Mark W. Roberson, Batakrishna Mandal, Vimal V. Shah, Scott Goodwin
  • Patent number: 11353502
    Abstract: An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: a set plate that holds a DUT container including a plurality of pockets each of which accommodates the DUT; a sensor that acquires three-dimensional shape data of the DUT container; and a processor that corrects the shape data based on an inclination of the set plate, extracts a height and an inclination of a predetermined region corresponding to the DUT in a first pocket among the pockets, from the shape data corrected by the processor, and determines an accommodation state of the DUT in the first pocket based on an extraction result obtained by the processor.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: June 7, 2022
    Assignee: ADVANTEST Corporation
    Inventors: Masataka Onozawa, Mitsunori Aizawa, Aritomo Kikuchi
  • Patent number: 11346879
    Abstract: An increased accuracy in detecting deterioration of a semiconductor device can be achieved. A first metal pattern and a second metal pattern are connected to a controller. A bonding wire connects the first metal pattern and an emitter electrode. A linear conductor is connected between a first electrode pad and a second electrode pad. First bonding wires connect the first electrode pad and the second metal pattern. Second bonding wires connect the second electrode pad and the second metal pattern. The controller detects the deterioration of the semiconductor device when a potential difference between the first metal pattern and the second metal pattern is above a threshold.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: May 31, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Chihiro Kawahara, Takeshi Horiguchi, Yoshiko Tamada, Yasushi Nakayama
  • Patent number: 11348742
    Abstract: Device, circuit, system, and method for contact sequencing are discussed. An electrical circuit includes a first pair of terminals adapted to be connected across a first set of switchable contacts, and a second pair of terminals adapted to be connected across a second set of switchable contacts that are coupled to an arc suppression circuit. A controller circuit is coupled to the first and second pairs of terminals and is configured to sequence activation or deactivation of the first and second sets of contacts based on a contact control signal. A first power switching circuit is coupled to the first pair of terminals and the controller circuit. The first power switching circuit is configured to switch power from an external power source and to trigger the activation or the deactivation of the first set of switchable contacts based on a first logic state signal from the controller circuit.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: May 31, 2022
    Assignee: Arc Suppression Technologies
    Inventors: Reinhold Henke, Robert Thorbus
  • Patent number: 11346861
    Abstract: In a method for contact accuracy assurance in an inspection apparatus, an alignment substrate having first marks is placed and aligned on a stage, and a position checking member, which is a transparent body simulating a probe card and has second marks at positions corresponding to the first marks, is coupled to a mounting part where the probe card is to be coupled. Further, the alignment substrate is placed in a contact area directly below the position checking member. Horizontal deviations between the first and the second marks are detected by capturing images of the first and the second marks with position checking cameras provided above the position checking member at positions respectively corresponding to the second marks to capture the images from a top down angle. The contact accuracy between the substrate and probes of the probe card is assured when the deviations are within an allowable range.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 31, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshihito Yamasaki, Jun Mochizuki
  • Patent number: 11341875
    Abstract: A display device including: a substrate including a display area and a peripheral area peripheral to the display area; a plurality of pads disposed in a pad area, wherein the pad area is disposed in the peripheral area and the pad area includes an integrated circuit (IC); and a first crack detecting line connected to a first pad and a second pad at a first node, and a third pad at a second node, wherein the first crack detecting line is disposed in the peripheral area between the first node and the second node.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kwang Sae Lee, Ji-Hyun Ka, Won Kyu Kwak, Ki Myeong Eom, Hai-Jung In
  • Patent number: 11340260
    Abstract: A probe card in an automated test equipment (ATE) and methods for operating the same for testing electronic devices. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins. The probe card has a pad geometry that compensates for misalignment with corresponding probe pins due to manufacturing error or a mismatch of coefficient of thermal expansion, enabling reliable operation of the ATE over a wide range of test temperatures. The pad array may have a plurality of elongated pads, each of uniquely designed size, tilt angle, and/or center location, with the characteristics of each pad being dependent on a distance between each pad and a centroid of the pad array, such that a probe pin to pad location errors can be mitigated.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: May 24, 2022
    Assignee: Teradyne, Inc.
    Inventors: Brian Brecht, Steve Ledford
  • Patent number: 11340263
    Abstract: There is provided a probe device for inspecting a wafer. The probe device includes: an upper camera provided in a wafer alignment unit; a lower camera provided in a stage; a target member provided in any one of the wafer alignment unit and the stage; and a control circuit configured to control each operation of the upper and lower camera. The target member has an end surface on which a target mark is provided, wherein any of the upper and lower camera is configured to capture an image of the target mark. The control circuit is configured to acquire a captured image of the target mark using any of the upper camera and the lower camera; and calculate a correspondence between a specific physical parameter and a value represented in the captured image for a parameter represented in the captured image among physical parameters, based on the acquired captured image.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: May 24, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Muneaki Tamura
  • Patent number: 11333681
    Abstract: A cantilever probe head includes a support ring associated with a PCB board and a plurality of contact probes, protruding from the support ring in a cantilever manner and being held by a support associated with the support ring. Each contact probe has a rod-like body having a longitudinal axis inclined with respect to a reference plane corresponding to a plane of a wafer of devices under test by the cantilever probe head, as well as at least one first end portion, provided in a first probe section protruding from the support in the direction of the wafer of devices under test, the first end portion being bent with respect to the longitudinal axis starting from a bending point and ending with a contact tip of the contact probe able to abut onto a contact pad of a device under test of the wafer.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: May 17, 2022
    Assignee: Technoprobe S.p.A.
    Inventor: Riccardo Vettori
  • Patent number: 11327093
    Abstract: The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L2 of the second contact probe 22 is shorter than the length L1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: May 10, 2022
    Assignee: ADVANTEST Corporation
    Inventors: Takashi Kawashima, Akihiko Ito, Keishi Oku, Natsuki Shiota
  • Patent number: 11329411
    Abstract: This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a signal pin which is inserted in a communication hole of a metallic casing so as to form a coaxial line path between the inner wall surface of the communication hole and the outer circumferential surface of the signal pin so that one end of the signal pin is electrically connected to a terminal of the first electrical component while the other end is electrically connected to a terminal of the second electrical component; and a holding member which holds the signal pin in the communication hole such that the outer circumferential surface of the signal pin is separated from the inner wall surface of the communication hole, wherein the characteristic impedance of a signal path formed by the signal pin in a first region where the signal pin is held by the holding member is smaller than a predetermined characteristic impedance which is a reference
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: May 10, 2022
    Assignee: ENPLAS CORPORATION
    Inventors: Kazutaka Koshiishi, Keiichi Narumi
  • Patent number: 11320458
    Abstract: A high-voltage test terminal includes a first conductor, a second conductor, and a primary insulator disposed between and coupled to the first and second conductors. A blade is movably connected to the second conductor. The blade is electrically and mechanically connected to the first conductor in a first position and electrically isolated and mechanically disconnected from the first conductor in a second position. A guard insulation layer is disposed between the primary insulator and the first conductor.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: May 3, 2022
    Assignee: Hubbell Incorporated
    Inventors: Andrew Victor McNulty, Daniel Eric Huenger, Eric Ralph Weatherbee, Adam Robert Fronk, Shibao Zhang
  • Patent number: 11320288
    Abstract: The invention relates to a novel type of electric inductance arrangement for a series of applications in the field of distance measurement, sensor-based detection of objects, and construction of induction machines. The novelty consists in the type of inductance arrangement of the receiver or transmitter coil, said arrangement being designed in the form of a ladder rung arrangement, wherein the ladder spars short-circuit the rungs. The sum of all the short-circuit currents is an indicator of what is occurring in the surroundings of the arrangement. This could be changing magnetic fields caused by transmitter objects or additional ladder-rung systems acting as transmitters.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: May 3, 2022
    Inventor: Peter Haas
  • Patent number: 11320496
    Abstract: Apparatus includes a first portion of conductive material having varying response to a generated magnetic field along a length of the conductive material, wherein the first portion of conductive material produces a varying eddy current and a varying reflected magnetic field, in response to the generated magnetic field. The apparatus further includes one or more reference portions of conductive material having a relatively invariable response to the generated magnetic field, wherein the reference portion of conductive material produces a relatively invariable eddy current and a relatively invariable reflected magnetic field in response to the generated magnetic field.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: May 3, 2022
    Assignees: Allegro MicroSystems, LLC, COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES
    Inventors: Alexander Latham, Claude Fermon, Gerardo A. Monreal, Alejandro Gabriel Milesi
  • Patent number: 11315454
    Abstract: A display device includes a substrate includes a display area having a plurality of pixels, a pad area including a plurality of input pads, and a circuit area positioned between the pad area and the display area; a crack sensor having a first end and a second end, the first end being connected to a first input pad of the plurality of input pads; a first shorting element extending through the pad area, the first shorting element being connected to the second end and extending to an edge of the substrate; a plurality of data lines connected to the plurality of pixels; and a crack sensing circuit including a first switching element having an input terminal connected to the first end and an output terminal connected to a first data line of the plurality of data lines, and a second switching element having an input terminal connected to the second end and an output terminal connected to a second data line of the plurality of data lines.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: April 26, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kwang-Min Kim, Won Kyun Kwak, Seung-Kyu Lee
  • Patent number: 11307232
    Abstract: A structure and method for providing a housing which includes a high frequency (HF or RF) connection between a device under test (DUT) having a waveguide 22. The waveguide includes a wave insert 22, and a conductive compliant member 40 which maintains bias between the adapter/insert 22 and the DUT HF port 20 while also maintaining an RF shield despite the variable height of the DUT waveport. A passage 50 provides an RF connection between the RF port 62 on the DUT and a RF wave guide horn 54. A plurality of transmitting horns 54 can be arranged to transmit to a single receiving horn 154 so that fewer receivers are required to test multiple DUTs in sequence.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: April 19, 2022
    Assignee: Johnstech International Corporation
    Inventors: Jeffrey Sherry, Cory Kostuchowski
  • Patent number: 11307246
    Abstract: A probing apparatus includes a chuck supporting a DUT, and a platform with an opening above the chuck. The probing apparatus further includes first and second rails positioned at first and second sides of the platform, respectively. The probing apparatus further includes a probing device, the probing device includes a probing module slidably along the first and second rails, and a first motor system configured to automatically align a probe card with the DUT. The probing module includes a third rail with two ends slidably attached to the first and second rails, respectively, a probing stage slidably attached to the third rail, and the probe card attached to the probing stage. The first motor system includes a first motor configured to control movement of the probing stage along the third rail, and a second motor configured to control movement of the probing module along the first and second rails.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: April 19, 2022
    Assignee: Star Technologies, Inc.
    Inventors: Choon Leong Lou, Yi Ming Lau