Abstract: A wheel or wheel assembly for a non-motorized vehicle, such as a shopping cart, is disclosed that detects its direction of rotation. In one embodiment, the wheel assembly includes a plurality of magnets mounted to a rotating portion of the wheel, and includes a magnetic sensor, such as a tunneling magnetoresistance sensor, mounted to a non-rotating portion. As the wheel rotates the magnets produce a varying magnetic field that is sensed by the sensor, which outputs a signal corresponding to the sensed magnetic field. The magnets are arranged—preferably asymmetrically—such that the sensor's output signal differs depending upon whether the wheel is rotating in the clockwise versus counterclockwise direction. A controller analyzes the sensor's output signal to determine the direction of rotation. In another embodiment, the magnets are replaced by conductive targets, and an eddy current sensor is used for the magnetic sensor.

Abstract: A probe card with a voltage terminal configured to be coupled to a voltage supply and a current terminal configured to be coupled to a current supply. The voltage terminal and the current terminal are configured to be coupled to an input node of a device under test (DUT) field effect transistor (FET) through probe needles. The probe card has an overlap resistor capacitor (RC) element coupled to the input node. The probe card includes an analog to digital (ADC) voltage capture module configured to be coupled to the input node of the DUT FET and to an output node of the DUT FET through the probe needles. The probe card has a resistive element configured to be coupled to the output node of the DUT FET through the probe needles and to an electrically neutral node and an ADC current capture module coupled in parallel to the resistive element.

Abstract: A stage, electric probes, an optical probe, an electric measurement device, an optical measurement device, and a first positioning mechanism are provided. The stage includes a second positioning mechanism that changes relative positional relationship between the electric probes and an electric connection portion of each of the optical elements. The electric probes electrically connect the electric measurement device and each of the optical elements. The optical probe optically connects the optical measurement device and each of the optical elements. The first positioning mechanism changes relative positional relationship between the optical probe and an optical connection portion of each of the optical elements.

Abstract: An apparatus for diagnosing a battery according to an embodiment of the present invention may include microcontroller (MCU) that includes a voltage measurement unit that measures a voltage of a battery cell of a battery, a signal conversion unit that converts the voltage of the battery cell measured by the voltage measurement unit into a differential signal, and an abnormality diagnostic unit that diagnoses an abnormality of the battery cell based on the differential signal.

Abstract: A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.

Abstract: A structure includes an insulating layer on a semiconductor substrate, and a first through-hole and a second through-hole formed in the insulating layer. The second through-hole is formed in the insulating layer at a set distance from the first through-hole. The structure also includes a first electrode portion and a second electrode portion. The first electrode portion is formed by filling the first through-hole. The first electrode portion includes a probing pad on the insulating layer. The probing pad is wider than an opening area of the first through-hole. The second electrode portion is formed by filling the second through-hole. The second electrode portion includes a probing pad on the insulating layer. The probing pad is wider than an opening area of the second through-hole.

Abstract: An electronic component testing apparatus for testing a device under test (DUT) includes: a socket unit that is electrically connected to the DUT; a first wiring board that includes a board opening; and a tester that includes a test head in which the first wiring board is mounted. The socket unit includes a first socket that faces a first main surface of the DUT and is electrically connected to the DUT and the first wiring board. The second socket that is exposed from the first wiring board through the board opening, contacts a second main surface of the DUT on a side opposite to the first main surface, and includes: a base that contacts the second main surface; and a test antenna unit that is electrically connected to the tester and faces a device antenna unit of the DUT.

Abstract: A capacitance detection device detecting a capacitance between a detection electrode and a detection target close to the detection electrode has: a first voltage output circuit that outputs a first alternating current voltage to be supplied to a shield electrode placed close to the detection electrode; a second voltage output circuit that outputs a second alternating current voltage with substantially the same frequency as the first alternating current voltage; and an operational amplifier that amplifies the difference in voltage between an inverting input terminal connected to the detection electrode and a non-inverting input terminal to which the second alternating current voltage is applied, and outputs the amplified difference in voltage.

Abstract: A detection method for wiring relationship of electrical components is disclosed. An acquisition unit for the wiring relationship of electrical components is used, and the acquisition unit includes a master controller, a control input coding module, a control output coding module, an acquisition signal input and output module, a control input decoding and control analog switch module, a control output decoding and control analog switch module, a relay control wiring separate drive, an acquisition signal module, a wiring terminal module, and also a data transmission module. The detection method can realize multi-point wiring relationship detection technology.

Abstract: A DS sensing apparatus includes a body and electrodes provided on the body. The body defines a test volume between a first surface and an opposing second surface spaced from the first surface a distance that allows a fluid to enter the test volume from a fluid inlet, which is communicatively coupled to the test volume, via capillary action. The electrodes include a first sensing electrode on the first surface and configured to receive an input RF signal, a second sensing electrode on the first surface spaced from the first sensing electrode and configured to deliver an output RF signal and a floating electrode on the second surface.

Abstract: A semiconductor test apparatus includes a chuck top on which a semiconductor wafer is mounted, and contact probes that contact measurement points of semiconductor chips formed on the semiconductor wafer, the chuck top includes a conductor that contacts a lower surface of the semiconductor wafer, a mounting table arranged below the conductor, and a first vacuum tube and a second vacuum tube connected to the mounting table, the conductor has a plurality of suction holes that are arranged in a spiral form in top view, in the mounting table, a flow pass communicating with the plurality of suction holes and having a spiral form in top view, the first vacuum tube is connected to an inner circumference portion of the flow pass, and the second vacuum tube is connected to an outer circumference portion of the flow pass.

Abstract: A method of testing a motor of a robot arm for a fault during a start-up procedure of the robot arm. The robot arm comprises a first link connected to a second link by a joint, the joint permitting the second link to move relative to the first link. The motor is for driving the joint and is a multiple-phase motor, each phase of the motor comprising a motor winding and a motor drive circuit for applying power to the motor winding from a power supply rail and for applying drive signals to the motor winding.

Abstract: A probe unit includes: a first contact probe configured to come in contact with a signal electrode; a second contact probe configured to come in contact with a ground electrode; a probe holder including a first holder hole through which the first contact probe passes, and a second holder hole through which the second contact probe passes; and a conductive floating member including a first through hole to which the first contact probe is inserted and the signal electrode is inserted, and a second through hole to which the second contact probe is inserted and the ground electrode is inserted. The probe holder is configured such that at least an inner circumferential surface of the first holder hole has an insulating property, and the probe unit has a coaxial structure in which central axes of the first contact probe and the first through hole are aligned with each other.

Abstract: The present invention provides a test method, a tester, a load board and a test system. The test method includes: outputting, through a first input/output (I/O) port of a tester, a first test signal to a first channel of a load board, wherein the first test signal is used to generate a second test signal and a third test signal; receiving, through the first I/O port, a third feedback signal returned from the first channel, wherein the third feedback signal is generated based on a first feedback signal and a second feedback signal; and determining whether a first chip and a second chip are operating normally based on the third feedback signal. Solutions provided in the present invention are capable of increasing the number of chips that can be tested at a single time.

Abstract: A measuring device is provided for reducing the occurrence of damage to a sensor section. The sensor section includes a substrate, a pair of comb electrodes on a first principal surface, and a pair of back-side electrodes disposed on a second principal surface and corresponding to the pair of comb electrodes, respectively. The pair of comb electrodes includes a plurality of tooth sections and connection sections that connect the tooth sections to each other, respectively. The substrate includes via-hole conductors in positions corresponding to the tooth sections inside a region surrounded by the outer tooth sections on opposite ends in a direction in which the tooth sections in the pair of comb electrodes are aligned and the connection sections. The via-hole conductors connect the comb electrodes and the back-side electrodes.

Abstract: The application discloses a RF vector measurement system including: a first port for generating a RF pulse, a pulse splitter for splitting the pulse into a first pulse send to a device-under-test DUT, and a second pulse send as a reference to a first quantum sensor of the system. The system is arranged to supply a third pulse, which is produced by reflecting or transmitting the first by the DUT, to at least one second quantum sensor phase-correlated with said first quantum sensor by entanglement.

Abstract: A spectrographic system includes a space-borne spectrometer in communication with a ground-based processor. The space-borne spectrometer may include an interferometer, a detector array downstream from the interferometer, and a spectrometer controller configured to cooperate with the detector array to collect Fourier Transform Spectral (FTS) data, generate Principle Component Analysis (PCA) scores from the collected FTS data, generate an approximate interferogram based upon the PCA scores and the collected FTS data, generate residuals based upon the approximate interferogram, and generate compressed FTS data based upon the PCA scores and residuals to be sent to the ground-based processor.

Abstract: The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

Abstract: Disclosed is a MTJ sensing circuit for measuring an external magnetic field and including a plurality of MTJ sensor elements connected in a bridge configuration, the MTJ sensing circuit having an input for inputting a bias voltage and generating an output voltage proportional to the external magnetic field multiplied by the bias voltage and a gain sensitivity of the MTJ sensing circuit, wherein the gain sensitivity and the output voltage vary with temperature; the MTJ sensing circuit further including a temperature compensation circuit configured to provide a modulated bias voltage that varies as a function of temperature over a temperature range, such that the output voltage is substantially constant as a function of temperature. Also disclosed is a method for compensating the output voltage for temperature.

Abstract: An engaging device in a Mass-Interconnect, which provides an apparatus and method to change test adapters for testing applications. An engaging device of a Mass-Interconnect includes an interchangeable test adapter (ITA) and a locking mechanism. The locking mechanism includes a plunger having a plunger head at a first end thereof, a leaflet insert disposed over the plunger, a sleeve disposed over the leaflet insert, an over-dead-center (ODC) link connected to the plunger at a second end thereof opposite to the first end, and a rotatable handle connected to the ODC link. The plunger, the leaflet insert, and the sleeve of the locking mechanism engage or disengage the ITA when a user rotates the rotatable handle.