Abstract: An abnormality determination system includes a power generation amount measurement unit that measures a power generation amount of the photovoltaic facility; a data acquisition unit that acquires data of a solar radiation amount; a calculation unit that divides a summed value of the power generation amount per day by a summed value of the solar radiation amount per day to calculates a division value; and a data accumulation unit that accumulates a combination of the power generation amount and the solar radiation amount, or the division value, and is configured to determine that there is an abnormality based on a slope of the division values.

Abstract: An apparatus includes a thermal heat sensor trace including conductive metal and disposed in a space transformer, the thermal heat sensor trace being configured to form a resistance, and a controller configured to sense a voltage across the resistance formed by the thermal heat sensor trace, the voltage positively correlating to a temperature of the space transformer. The controller is further configured to determine whether the sensed voltage is greater than or equal to a predetermined threshold voltage, and based on the sensed voltage being determined to be greater than or equal to the predetermined threshold voltage, output an alert signal for reducing and/or warning of the temperature of the space transformer.

Abstract: A debug probe (102) for controlling debugging of a target system (104) is described, the debug probe comprising an interface (128) comprising a plurality of pins (202), debug control circuitry (130) to control debugging of the target system based on a digitally sampled level of at least one signal communicated through at least one of the plurality of pins, and measurement circuitry (204) to make a measurement of a property of the target system based on an analogue level of a signal received through said at least one of the plurality of pins.

Abstract: A neural interface circuit for bidirectional signal transmission includes at least one electrode configured to collect a neural signal and receive an excitation signal. The neural interface circuit can transmit signals bidirectionally. On the one hand, neural signals can be collected through electrodes, and on the other hand, excitation signals can be received through electrodes. The excitation signals can achieve the purpose of researching or intervening treatment.

Abstract: A device for measuring the amount of moisture in a medium that includes a transmission antenna that sends a signal as an electromagnetic wave, a reception antenna that receives the electromagnetic wave sent from the transmission antenna and transmitted through a medium, a measurement section that measures the electromagnetic wave propagated to the reception antenna, and a sensor casing. The sensor device further includes a transmission substrate that includes a plurality of wiring layers and a reception substrate that includes a plurality of wiring layers, or a first covering layer that partially covers an outer periphery of the transmission substrate and a second covering layer that partially covers an outer periphery of the reception substrate The coverings are formed of an electromagnetic wave absorption material. The sensor casing includes a transmission probe casing that accommodates the transmission substrate and a reception probe casing that accommodates the reception substrate.

Abstract: A waveguide to wafer-probe adapter includes an integrated computer-controlled load pull tuner forming a compact and handy assembly. The adapter includes a horizontal, a vertical and a sloped straight section, joined with two knee junctions. The tuner is simple and includes two, only along the sloped waveguide section moving at fixed penetration tuning probes without cumbersome vertical axis mechanisms. The sloped cavity section of the waveguide includes niches at the knee junctions, in which the probes can be moved and hidden, thus allowing a for low residual reflection and original transmission behavior. When the probes are hidden the adapter can be used for instantaneous s-parameter measurement still maintaining full load pull capacity. High-speed calibration and tuning algorithms allow efficient operation.

Abstract: A sensor assembly and method of sensing water in a fluid may include a sensor body having a first electrical connection, a second electrical connection, and a probe portion configured to be submerged in a fluid comprising a fuel, a signal input line supplying a signal voltage and power to the sensor from a voltage source to the first electrical connection of the sensor body, a ground line connected to the second electrical connection of the sensor body, and a controller configured to receive a signal output from the signal input line for determining a presence of water in the fluid.

Abstract: A system (50) for tracking an object (1) comprises a magnetic field source (10) configured to be fixed to this object (1); a magnetometric data collection unit (20) that uses magnetic field sensors (22) fixed at predetermined positions on a support (23) to form an array (21), and that includes a sensor control unit (25) for controlling the magnetic field sensors (22); a data processing unit (30) configured to receive the magnetic field data from the sensor control unit (25) and to calculate from these data position coordinates of the magnetic field source (10) with respect to the array (21) forming a vector of such position coordinates which minimizes the distance between magnetic field values expected at the sensor positions (22) and magnetic field values collected by the collection unit (20), wherein the magnetic field source (10) is arranged to generate a local magnetic field (4), at the magnetic field sensors (22), of intensity set between 5 and 500 microtesla, so that the magnetic field sensors (22) dete

Abstract: Ion sensing device includes a field-effect transistor including a bottom gate and a top gate, a reference electrode, and a driver circuit configured to measure concentration of ions in a sample solution into which the reference electrode and the top gate are immersed. The driver circuit includes a constant current source configured to supply a drain of the field-effect transistor with a constant current, and a voltage follower configured to receive a potential of the drain. The driver circuit is configured to supply the reference electrode with a constant reference potential, apply a constant voltage across an output of the voltage follower and the bottom gate, and output an output potential of the voltage follower.

Abstract: The present disclosure relates to a detection circuit, an appliance, and a control method. The detection circuit includes at least a first capacitive component, a second capacitive component, a load to be detected and a detection component, where the first capacitive component is connected in series with the load to be detected to form a first branch, and the first branch is connected in parallel with a second branch including the second capacitive component. The detection component is configured to detect a first alternating current (AC) signal of the first branch and a second AC signal of the second branch, determine a first direction of the first AC signal and a second direction of the second AC signal, and determine a type of the load to be detected based on the first direction and the second direction.

Abstract: A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

Abstract: An automated test equipment (ATE) includes a test interface board assembly. The test interface board includes a socket configured to provide electrical couplings from the test interface board to a device under test (DUT). The socket is further configured to accept an active thermal interposer (ATI) device while the DUT is disposed in the socket. The socket includes a plurality of spring-loaded roller retention devices configured to retain one or more devices in the socket. The ATE further includes a Z-axis interface plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the DUT into the socket and an ATI placement plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the ATI device into the socket.

Abstract: A current sensing system includes a pre-calibrated busbar, a voltage sensor, a temperature sensor and a controller. The pre-calibrated busbar has a known resistance, a known variation in resistance with respect to temperature and known dimensions. The voltage sensor detects a difference in voltage between a first location and a second location on the pre-calibrated busbar. The temperature sensor detects an ambient temperature of the pre-calibrated busbar. The controller determines a resistance of the busbar between the first location and the second location based on the known resistance, known variation in resistance, known dimensions and the ambient temperature. The controller additionally determines a current flowing through the pre-calibrated busbar based on the difference in voltage and the determined resistance. The current sensing system has numerous applications including using the determined current to control an operating condition of a solid state circuit breaker or a solid state power controller.

Abstract: An wafer probe device is provided, including a holder, and a probe card. The holder has a holding surface for holding a wafer. The probe card has a probing side for probing the wafer. Wherein the holder and the probe card are disposed on the ground, and the holding surface of the holder and the probing side of the probe card are perpendicular to the ground. Wherein when the holder holds the wafer to move upwardly toward the probe card into a probing position, the probed surface of the wafer is in contact with the probe card, and the probe surface is perpendicular to the ground.

Abstract: An inspection apparatus includes a stage having a placing surface, a first magnetic field generator, and a second magnetic field generator. The first magnetic field generator is configured to be changeable in orientation and to singly generate a first magnetic field. The second magnetic field generator is configured to be changeable in orientation and to singly generate a second magnetic field. The first and second magnetic field generators are configured to cooperatively generate a composite magnetic field in cooperation.

Abstract: According to one embodiment, a degradation detection device includes a driving circuit that supplies a driving signal that controls on/off of an output transistor to the output transistor and an output circuit that compares a value of integral of an output current that is output by the output transistor in an off-state thereof over a predetermined period of time with a predetermined threshold when the output transistor is turned from an on-state thereof to an off-state thereof and outputs a signal that indicates a degradation state of the output transistor depending on a result of such comparison.

Abstract: A rotation speed detector includes: a base material to be attached to a rotating body; a first magnetic pole having an arcuate strip shape and provided on the base material; a second magnetic pole having an arcuate strip shape and provided on the base material; and a power generation element including a magnetic wire configured to cause a large Barkhausen effect, and a pickup coil. The power generation element is arranged to face the first magnetic pole and the second magnetic pole so that a longitudinal direction of the magnetic wire is provided along a radial direction of the first magnetic pole and the second magnetic pole. A non-magnetic gap is provided between the first magnetic pole and the second magnetic pole.

Abstract: The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below the pressing-down block. The pressing-down block is connected to the support frame through an installation plate; a strip-shaped through hole is formed at an upper surface of the support frame; a first protruding strip is at each lower portion of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each upper portion of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block is connected to the second protruding strip through at least two springs.

Abstract: The present disclosure includes an adaptive die test socket and a formation method. The die test socket includes an upper test socket and a lower test socket disposed directly below the upper test socket. The upper test socket is connected to a support frame; a strip-shaped through hole is formed on an upper surface of the support frame; a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each of upper portions of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs.

Abstract: A semiconductor device for testing a device under test includes a circuit board, a plurality of probes disposed below the circuit board and facing the device under test, an integrated substrate disposed between the circuit board and the plurality of probes, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The plurality of probes is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the plurality of probes through the integrated substrate and the circuit board to perform a test to the device under test. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.