Patents Examined by Neel D Shah
  • Test board and test system including the same
    Patent number: 11428734
    Abstract: A test board includes a first board and a second board. The first board includes a socket on which a device under test (DUT) is mounted, and a first functional circuit. The first functional circuit exchanges signals and data with the DUT in an actual operating environment of the DUT, and performs a first test on the DUT using a first test signal. The first test signal is identical to a signal to be transmitted in the actual operating environment. The second board includes a processor and a multiplexer. The processor performs a second test different from the first test on the DUT using a second test signal. The second test signal is different from the first test signal and checks an electrical characteristic of the DUT itself. The multiplexer selects one of the first test signal and the second test signal to transmit to the DUT.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: August 30, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Minkyun Sun
  • Manipulator for moving a test head
    Patent number: 11408933
    Abstract: A manipulator may include a base portion, an upright portion connected to the base portion, a test head attachment incorporated into the upright portion, and an upright quick connect assembly incorporated into the test head attachment. In some cases, the manipulator includes an automatic weight transfer mechanism, a mobile base portion with casters and/or steerable casters.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: August 9, 2022
    Assignee: Reid-Ashman Manufacturing, Inc.
    Inventors: Bruce D. Baer, Chris McArthur, Leo Wright, Kyle Bodily, Nathaniel Johnson, Brian Hunt, Erik Erekson, Spence Rencher
  • Electrical connecting device, inspection apparatus, and method for electrical connection between contact target and contact member
    Patent number: 11408926
    Abstract: An electrical connecting device having one or more contact members to be in contact with a contact target is provided. The electrical connecting device includes a main body having one or more recesses on a surface thereof opposed to the contact target, and a flexible portion that covers the recesses to form sealed spaces. The main body includes a gas exhaust passage and an air supply passage provided for each of the sealed spaces to adjust a pressure in each of the sealed spaces, and the contact members are respectively disposed to be opposed to the recesses with the flexible portion interposed therebetween.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: August 9, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Jun Mochizuki
  • Test device
    Patent number: 11391757
    Abstract: A test device for a high-speed/high-frequency test. The test device includes: a conductive block which includes a probe hole; at least one signal probe which is supported in an inner wall of the probe hole without contact, includes a first end to be in contact with a testing contact point of the object to be tested, and is retractable in a lengthwise direction; and a coaxial cable which includes a core wire to be in electric contact with a second end of the signal probe. With this test device, the coaxial cable is in direct contact with the signal probe, thereby fully blocking out noise in a test circuit board.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: July 19, 2022
    Inventors: Changhyun Song, Jaehwan Jeong
  • In-situ testing device
    Patent number: 11385256
    Abstract: The present disclosure relates to an in-situ testing device including a measuring head, a drive mechanism, and a testing chamber. The testing chamber is provided with a first optical observation hole. The measuring head is provided with a second optical observation hole. The testing chamber is provided with an opening allowing the measuring head to pass. The testing chamber is further provided with a shielding door, and the drive mechanism is connected to the shielding door to drive the shielding door to move relative to the testing chamber, to open or cover the opening, thereby opening or closing the testing chamber.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: July 12, 2022
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Qi-Kun Xue, Xiao-Peng Hu, Cheng Zheng, Xi Chen
  • Method for controlling test apparatus and test apparatus
    Patent number: 11385286
    Abstract: A method for controlling a test apparatus, the test apparatus including a test unit in which testers are arranged in columns and rows, each tester configured to test a substrate; aligners each configured to cause the substrate to be contacted with respect to a given tester from among the testers, at least one aligner provided in each row; and a controller configured to control the aligners. The method includes constraining, by the controller, operation of at least a second aligner, while alignment is performed through a first aligner from among the aligners.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: July 12, 2022
    Assignee: Tokyo Electron Limited
    Inventor: Tomoya Endo
  • Modular electronic testing system with flexible test PCB format
    Patent number: 11385277
    Abstract: A testing system for test sockets is presented having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A top stiffener is attached to the lower surface of the DUT PCB and is locked in place by engagement members of a locking mechanism, that is operated by an actuating mechanism, that includes a rack and pinion arrangement that converts rotational movement of the pinions to lateral movement of the racks thereby locking the stiffener connected to the DUT PCB to the socket plate so as to facilitate testing. The upper surface of the DUT PCB has an infinite top plane that is uninterrupted and can be of any size and shape. The system is also modular and can be formed of any number of modules depending on the pin count density required.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: July 12, 2022
    Assignee: MODUS TEST, LLC
    Inventors: Lynwood Adams, Jack Lewis, Njteh Keleshian
  • Differential current sensing bussing method
    Patent number: 11385300
    Abstract: The line power and neutral conductors for a circuit interrupter such as a miniature circuit breaker, using ground fault sensing via a current transformer, are arranged as a rigid conductor formed from a flat plate and surrounding and holding an insulated flexible conductor when passing through the Ground Fault Interrupter current transformer. The rigid conductor can provide a shaped current path to maximize the effectiveness of the current transformer.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: July 12, 2022
    Assignee: Schneider Electric USA, Inc.
    Inventors: Dennis W. Fleege, Chad Mittelstadt, Randall J. Gass, Douglas P. Vanwaart, Jason Potratz
  • Apparatus for testing electronic components
    Patent number: 11385257
    Abstract: An apparatus for testing electronic components includes a base, a screw rod structure, a first sliding portion, a second sliding portion, a vacuum-based or similar adsorption structure, and a probe. The screw rod structure is fixedly connected to one side of the base. The first sliding portion is slidably positioned on the screw rod structure. The second sliding portion is slidably positioned on the first sliding portion. The adsorption structure is arranged on the second sliding portion. The adsorption structure gathers and holds an electronic component. The probe and the electronic component are arranged to correspond. The probe is electrically connected to a test device. The test device tests the electronic component through the probe.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: July 12, 2022
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jun Chen, Wei Wu, Yan-Fang Yan, Zhen-Ke Zhang, Zhi-Qing Liu
  • Device and method for processing a multiplicity of semiconductor chips
    Patent number: 11378590
    Abstract: A device for processing a multiplicity of semiconductor chips in a wafer assemblage includes an electrically conductive carrier for contacting rear contacts of the semiconductor chips, an electrically conductive film for contacting front contacts of the semiconductor chips that are situated opposite the rear contacts, and a squeegee, which is displaceable relative to the film and is configured to press a region of the film in the direction toward the carrier.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: July 5, 2022
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Michael Bergler, Roland Zeisel
  • Body-contacted field effect transistors configured for test and methods
    Patent number: 11367790
    Abstract: Test structures for a body-contacted field effect transistor (BCFET) include: a single-pad structure with body contact and probe pad regions connected to a channel region at first and second connection points with a known separation distance between the connection points; and a multi-pad structure with a body contact region connected to a channel region at a first connection point and multiple probe pad regions connected to the channel region at second connection points that are separated from the first connection point by different separation distances.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: June 21, 2022
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Anupam Dutta, Balaji Swaminathan
  • RF functional probe
    Patent number: 11360140
    Abstract: The present disclosure relates to a radio frequency (RF) functional probe for testing an RF device in a cryogenic environment. The RF functional probe includes a probe head configured to receive the RF device, a flange structure, an isolation structure coupled between the probe head and the flange structure, and an RF cable structure extending from the flange structure, through the isolation structure, and to the probe head. The isolation structure is configured to provide thermal and electrical isolation to reduce radiant heat leak from the RF cable structure to the RF device. Herein, the isolation structure includes multiple baffle structures, each of which includes cable guides. The cable guides of each baffle structure are configured to guide routing paths for the RF cable structure. The RF cable structure is configured to transmit signals to and from the RF device.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 14, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Seth Kimes, Richard P. Rouse, Brandon S. Bohlen
  • Devices and methods for surge protection device monitoring
    Patent number: 11360141
    Abstract: Example devices and methods for compensating for monitoring a surge protection device are provided. In some embodiments, a device is configured to couple to a surge protection device. The device comprises a processor that is capable of sending a DC current signal. A serial data interface is electrically connected to the processor and includes at least one shift register. The device also comprises a multiplexer coupled to the serial data interface. The serial data interface is operable to direct the DC current through the multiplexer. The device also comprises an analog to digital converter (optionally embedded within the processor) that is operable to output a digital signal corresponding to a voltage induced by the DC current signal. Returned DC signals represent surge protection device's health and a multitude of other surge module information.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: June 14, 2022
    Assignee: ASCO Power Technologies, L. P.
    Inventors: Glenn Edward Wilson, Matthew Arthur Scott, Daniel George Buchanan
  • Determining characteristics of a fluid in a wellbore
    Patent number: 11352880
    Abstract: An assembly for use in a wellbore can include a plurality of sensors positioned external to a casing string. The plurality of sensors can be positioned for detecting an amount of a hydrocarbon that is present in a fluid in the wellbore and a pH of the fluid in the wellbore. The plurality of sensors can be positioned for wirelessly transmitting signals representing the amount of the hydrocarbon that is present in the fluid and the pH of the fluid to a receiving device.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: June 7, 2022
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Paul F. Rodney, Mark W. Roberson, Batakrishna Mandal, Vimal V. Shah, Scott Goodwin
  • Electronic component handling apparatus and electronic component testing apparatus
    Patent number: 11353502
    Abstract: An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: a set plate that holds a DUT container including a plurality of pockets each of which accommodates the DUT; a sensor that acquires three-dimensional shape data of the DUT container; and a processor that corrects the shape data based on an inclination of the set plate, extracts a height and an inclination of a predetermined region corresponding to the DUT in a first pocket among the pockets, from the shape data corrected by the processor, and determines an accommodation state of the DUT in the first pocket based on an extraction result obtained by the processor.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: June 7, 2022
    Assignee: ADVANTEST Corporation
    Inventors: Masataka Onozawa, Mitsunori Aizawa, Aritomo Kikuchi
  • Contact accuracy assurance method, contact accuracy assurance mechanism, and inspection apparatus
    Patent number: 11346861
    Abstract: In a method for contact accuracy assurance in an inspection apparatus, an alignment substrate having first marks is placed and aligned on a stage, and a position checking member, which is a transparent body simulating a probe card and has second marks at positions corresponding to the first marks, is coupled to a mounting part where the probe card is to be coupled. Further, the alignment substrate is placed in a contact area directly below the position checking member. Horizontal deviations between the first and the second marks are detected by capturing images of the first and the second marks with position checking cameras provided above the position checking member at positions respectively corresponding to the second marks to capture the images from a top down angle. The contact accuracy between the substrate and probes of the probe card is assured when the deviations are within an allowable range.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: May 31, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshihito Yamasaki, Jun Mochizuki
  • Semiconductor device
    Patent number: 11346879
    Abstract: An increased accuracy in detecting deterioration of a semiconductor device can be achieved. A first metal pattern and a second metal pattern are connected to a controller. A bonding wire connects the first metal pattern and an emitter electrode. A linear conductor is connected between a first electrode pad and a second electrode pad. First bonding wires connect the first electrode pad and the second metal pattern. Second bonding wires connect the second electrode pad and the second metal pattern. The controller detects the deterioration of the semiconductor device when a potential difference between the first metal pattern and the second metal pattern is above a threshold.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: May 31, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Chihiro Kawahara, Takeshi Horiguchi, Yoshiko Tamada, Yasushi Nakayama
  • Wet/dry contact sequencer
    Patent number: 11348742
    Abstract: Device, circuit, system, and method for contact sequencing are discussed. An electrical circuit includes a first pair of terminals adapted to be connected across a first set of switchable contacts, and a second pair of terminals adapted to be connected across a second set of switchable contacts that are coupled to an arc suppression circuit. A controller circuit is coupled to the first and second pairs of terminals and is configured to sequence activation or deactivation of the first and second sets of contacts based on a contact control signal. A first power switching circuit is coupled to the first pair of terminals and the controller circuit. The first power switching circuit is configured to switch power from an external power source and to trigger the activation or the deactivation of the first set of switchable contacts based on a first logic state signal from the controller circuit.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: May 31, 2022
    Assignee: Arc Suppression Technologies
    Inventors: Reinhold Henke, Robert Thorbus
  • Probe device and method of adjusting the same
    Patent number: 11340263
    Abstract: There is provided a probe device for inspecting a wafer. The probe device includes: an upper camera provided in a wafer alignment unit; a lower camera provided in a stage; a target member provided in any one of the wafer alignment unit and the stage; and a control circuit configured to control each operation of the upper and lower camera. The target member has an end surface on which a target mark is provided, wherein any of the upper and lower camera is configured to capture an image of the target mark. The control circuit is configured to acquire a captured image of the target mark using any of the upper camera and the lower camera; and calculate a correspondence between a specific physical parameter and a value represented in the captured image for a parameter represented in the captured image among physical parameters, based on the acquired captured image.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: May 24, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Muneaki Tamura
  • Probe card pad geometry in automated test equipment
    Patent number: 11340260
    Abstract: A probe card in an automated test equipment (ATE) and methods for operating the same for testing electronic devices. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins. The probe card has a pad geometry that compensates for misalignment with corresponding probe pins due to manufacturing error or a mismatch of coefficient of thermal expansion, enabling reliable operation of the ATE over a wide range of test temperatures. The pad array may have a plurality of elongated pads, each of uniquely designed size, tilt angle, and/or center location, with the characteristics of each pad being dependent on a distance between each pad and a centroid of the pad array, such that a probe pin to pad location errors can be mitigated.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: May 24, 2022
    Assignee: Teradyne, Inc.
    Inventors: Brian Brecht, Steve Ledford