Abstract: Provided is a method for peeling a PSA sheet adhered on a polarizing plate. The PSA sheet has a PSA layer. The PSA layer includes a layer A forming at least one surface of the PSA layer. Of the polarizing plate, the surface to which the PSA sheet is adhered is corona-treated or plasma-treated. The peeling method includes a water-peel step in which the PSA sheet is peeled from the polarizing plate, in a state where an aqueous liquid exits at the interface between the polarizing plate and the PSA sheet at the front line of peeling the PSA sheet from the polarizing plate, with the aqueous liquid allowed to further enter the interface following the movement of the peel front line.

Abstract: Provided is a method for producing a GaN layered substrate, comprising the steps of: subjecting a C-plane sapphire substrate 11 having an off-angle of 0.5° to 5° to a high-temperature nitriding treatment at 800° C. to 1,000° C. to carry out a surface treatment of the C-plane sapphire substrate; carrying out epitaxial growth of GaN on the surface of the surface-treated C-plane sapphire substrate 11 to produce a GaN film carrier having a surface of an N polar face; forming an ion implantation region 13ion by carrying out ion implantation on the GaN film 13; laminating and joining a support substrate 12 with the GaN film-side surface of the ion-implanted GaN film carrier; and separating at the ion-implanted region 13ion in the GaN film 13 to transfer a GaN thin film 13a onto the support substrate 12, to produce a GaN layered substrate 10 having, on the support substrate 12, a GaN thin film 13a having a surface of a Ga polar face.

Abstract: A reinforcement structure includes an adherend, such as a metal plate, and a reinforcement sheet adhering thereto. The reinforcement sheet includes a front layer containing a plurality of fibers, a core material layer, and an adhesive layer. The reinforcement structure is capable of intensively reinforcing a first corner portion of the adherend and obtaining an improvement in strength.

Abstract: A system and method for removing a backing from a ply of composite material is disclosed. The system includes a roller having a roller axis and a roller surface that circumscribes the roller axis. The system also includes an adhesion feature disposed on the roller surface. The system further includes a roller drive to move the roller along a travel path that is perpendicular to the roller axis and to rotate the roller about the roller axis.

Abstract: A decorative layer removal tool for flooring is configured with a removal shaft and either a drill attachment or handle to remove the decorative layer from a plank. The removal shaft includes a threaded end to attach to either the handle or drill attachment. The handle can be used when the user wishes to manually rotate the shaft and remove the decorative layer; the drill attachment can be used with a power drill for a motorized removal. The removal shaft includes a slit that extends from an unthreaded end to the threaded side. In typical implementations, the slit may not extend to the shaft's threads. At least a portion of the slit is used to receive the decorative surface layer from a plank, thereby enabling the decorative layer's removal.

Abstract: To satisfactorily apply a protective tape to a bump wafer, an application apparatus (1) for applying a protective tape (PT) to a wafer (W) includes: an application table (60) configured to support the wafer (W); a tape holding body (30) capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body (30) onto the wafer (W); and a pressing member (62) configured to press the protective tape (PT) from above. The pressing member (62) includes a protective layer outer periphery retainer (620) configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).

Abstract: A display protector attachment apparatus for a foldable electronic device according to the present disclosure includes: a frame unit including a frame-first end member at one end and a frame-second end member at another end and configured to support and accommodate the foldable electronic device between the frame-first end member and the frame-second end member; and an inclination-forming fixing unit connected to the frame-second end member and configured to align a protector film assembly to be arranged inclinedly with respect to the foldable display unit of the foldable electronic device by varying mounting heights for both ends of the protector film assembly including a display protector that is to be attached to the foldable electronic device.

Abstract: A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume.

Abstract: A welding assembly is disclosed. The welding assembly includes a plurality of separately controllable actuators (e.g., pneumatic, having an axially movable ram) to press a corresponding portion of a first workpiece (e.g., a discrete flange of a first stiffener) against a second workpiece (e.g., an outer skin) for welding operations (e.g., via induction welding).

Abstract: A method for integrally bonding a cast aluminum component to a joining partner. The method includes laser-treating a region of the cast aluminum component that is to be connected to the joining partner. The laser treatment is carried out via a pulsed laser system having a pulse duration of 100 to 200 ns, and an impulse frequency of 10 to 80 kHz. The method also includes integrally bonding the cast aluminum component and the joining partner.

Abstract: A garment shaped to approximate the abdomen of an expectant mother having a layered laminated conductive material adhered to the garment is disclosed. A portion of the laminated material is configured to directly contact the skin of the maternal abdomen to create an electrical signal connection. A portion of the layered laminated material comprises a stretchable circuit assembly having a substrate with an adhesive layer, a thermoplastic layer, a conductive layer and an encapsulating layer. A monitor controller is disposed about the garment and is configured to receive electrical signals from the circuit assembly and transmit information related to the electrical signals to a remote location.

Abstract: A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.

Abstract: Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; forming an organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; stress relief etching the second side of the semiconductor substrate; applying a backmetal over the second side of the semiconductor substrate; removing one or more portions of the backmetal through jet ablating the second side of the semiconductor substrate; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.

Abstract: A label web and method utilize a substrate, first and second longitudinally spaced label arrays each including two or more double-sided adhesive labels removably attached to the substrate, and a peelable protective covering web extending generally coextensive with the substrate. The label arrays and the peelable protective web are configured such that the peelable protective web is selectively removable to expose the first label array while remaining removably attached to the second label array, with both the first and second label arrays remaining removably attached to the substrate, to thereby facilitate removal of all labels in the first label array as a group while the peelable protective covering web remains in place over the second label array.

Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.

Abstract: An apparatus for manufacturing a display device and a method for manufacturing a display device includes a stage; a first guide unit positioned on one side of the stage in a first direction and extending in a second direction crossing the first direction; and a first peeling unit disposed on the first guide unit, wherein the first peeling unit includes a first moving part configured to move along the first guide unit, a first rotating part coupled to the other side of the first moving part in the first direction and configured to rotate about an axis extending in the first direction, and a first gripping part coupled to the other side of the first rotating part in the first direction and disposed to overlap the stage.

Abstract: A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a winding roller and a gripper. The winding roller rotates and winds the two-ply sheet to separate the two-ply sheet. The gripper is disposed in the winding roller and configured to grip a gripped portion of the two-ply sheet at one end of the two-ply sheet without abutting a tip of the gripped portion at the one end of the two-ply sheet on a member.

Abstract: A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.

Abstract: An apparatus for applying individual tapes in layers onto a substrate includes a plurality of reels, applicators, and a guide member. A first reel holds a first tape and a second reel holds a second tape. A first applicator includes a first pressure surface that receives the first tape from the first reel and presses the first tape in a direction toward the substrate to apply the first tape to the substrate. The second applicator includes a second pressure surface that receives the second tape from the second reel. The second pressure surface is aligned to dispense the second tape over a section of the first tape applied to the substrate and to press the second tape toward the substrate to apply the second tape over the first tape. The guide member is disposed between the reels and the applicators and aligns the first and second tapes during application.

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to a back surface of the wafer, a frame unit carrying-out unit, and a beveled part removing unit that cuts and removes, in a ring manner, a beveled part formed in an outer circumferential surplus region from the wafer of a frame unit.