Abstract: In a peeling system and a peeling method for a flexible fingerprint component provided by the present invention, the flexible fingerprint component is formed on a rigid substrate, and the flexible fingerprint component comprises a flexible substrate, a photosensitive device layer and an optical film sequentially arranged on the flexible substrate, a first chip-on film bonded to the photosensitive device layer on a first side of the optical film, and a second chip-on film bonded to the photosensitive device layer on a second side of the optical film, wherein the optical film is provided with an extension portion beyond the flexible substrate, the second side of the optical film is located on a side opposite to the extension portion, and the first side of the optical film is located on a side adjacent to the extension portion.

Abstract: A projection curtain is provided in the present invention. The projection curtain at least comprises a reflective layer and one of a colored layer, a diffusion layer, and a Fresnel lens layer. The Fresnel lens layer is a spherical Fresnel lens layer or an aspherical Fresnel lens layer. The Fresnel lens layer comprises a plurality of annular protrusions protruding from a plane, the plurality of annular protrusions are arranged in circular bands. A cross-sectional shape of each annular protrusion along a cross section perpendicular to the plane is a triangular shape or a multi-step shape or a free surface shape. The width of one side of each cross-sectional shape parallel to the plane gradually changes, and gradual change of the cross-sectional shape and the width thereof determines light gathering characteristics of the spherical Fresnel lens layer or the aspherical Fresnel lens layer. A surface of each annular protrusion has scattered microstructures.

Abstract: A thermal decomposition apparatus includes a heating zone, a cooling zone, a first conveying mechanism and a second conveying mechanism. The heating zone has a first space, a first inlet and a first outlet. The first inlet and the first outlet are located at two opposite sides of the first space. The cooling zone has a second space, a second inlet and a second outlet. The second inlet is selectively in space communication connection with the first outlet of the heating zone. The first conveying mechanism is at least partially disposed in the first space. The second conveying mechanism includes a carrier disposed in the second space. The carrier has an inclined surface. A position of the inclined surface located close to the second inlet is higher than a position of the inclined surface located close to the second outlet along a gravity direction.

Abstract: Systems and methods for managing surgical sponges. A dispenser assembly coupled to a main support includes an internal or first storage location to removably receive a carton of sponge sorters, and an external or second storage location to removably support a carton of surgical draping. At least one arm may be supported on the housing and movable between an undeployed position and a deployed position. The arm may include weighing means to measure a weight of the surgical sponge being disposed in a sponge sorter supported by the arm. The arm may be a cantilever and abeam load cell may be disposed within a channel of a beam. A processor may determine fluid weight based on measured weight and dry weight correlated with the surgical sponge being counted out as detected with a data reader. The processor may estimate blood loss to be displayed on a display.

Abstract: A composite backing layer peel starter and methods of use are presented. A method of beginning removal of a backing layer from a composite material is presented. An impact force is applied to a corner of the backing layer with a polymeric material contact surface of a striker to adhere the polymeric material to the backing layer. The striker is pulled away from the backing layer to apply a lifting force to the backing layer.

Abstract: A backing film removal system comprises a separating mechanism configured to separate a first portion of a first backing film on a first side of a material segment and a second portion of a second backing film on a second side of the material segment from a material layer of the material segment, wherein the second side is opposite the first side. The backing film removal system also includes a clamping mechanism that is actuatable to apply a clamping force to secure the material layer and the second portion together. A separator assembly includes a gripping mechanism configured to grip the first portion. At least one of the gripping mechanism or the clamping mechanism is movable to draw the first portion gripped by the gripping mechanism away from the material layer to remove a remaining portion of the first backing film from the material layer.

Abstract: The present disclosure relates to a method for producing a decorated wall or floor panel, comprising the method steps: a) providing a first molten polymer mass and a second molten polymer mass; b) extruding the molten polymer masses, wherein in particular each polymer mass is extruded by a separate extruder, wherein the molten polymer masses are layered on top of each other; c) expelling the layered molten polymer masses through a die; d) calibrating the layered molten polymer masses in order to form a plate-shaped carrier comprising at least one carrier layer comprising the first polymer mass and a sealable layer contacting the carrier layer and comprising the second polymer mass. Furthermore, the disclosure relates to plate-shaped carriers and decorative panels produced in this way, and to a device for carrying out the method.

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

Abstract: Embodiments herein are generally directed to ejection assemblies for singulated dies and thinned wafers and methods related thereto. Die ejection assemblies may be used to minimize cracking or deformation of dies during post-singulation processing. Thus, the die ejection assemblies and methods described herein reduce the number of dies rejected after singulation and the number of failures during a die bonding process. In one general aspect, an apparatus for removing singulated dies from a dicing tape is provided. The apparatus may include a die ejector assembly, which may include a vacuum plate configured to engage with a portion of the dicing tape. A die ejector may be disposed in an ejector opening of the vacuum plate. One or more actuators may be configured to move at least a portion of the die ejector in a lateral direction relative to the upper surface of the vacuum plate.

Abstract: A bonding and sealing system for coupling a joint of a circular tube to be utilized in the manufacturing of an automatic balancer is disclosed. The system includes a circular tube having a joint and a fluid; and a predetermined amount of Belzona 5815®; wherein the predetermined amount of Belzona 5815® bonds and seals the joint, thereby securing the fluid within the circular tube; wherein the application of Belzona 5815® over the joint forms a balancing ring to be used to create an automatic balancer.

Abstract: A method of forming a substrate support for use in a processing chamber includes forming a porous region in each of a plurality of ceramic green sheets, stacking the plurality of ceramic green sheets, each having the porous region formed therein, to form a ceramic laminate, and sintering the ceramic laminate to form a monolithic ceramic body having a porous plug formed therein. The porous plug includes the porous regions in the plurality of ceramic green sheets that are sintered.

Abstract: Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region to form an initially bonded region and releasing the second substrate having the initially bonded region formed thereon from the second holding unit.

Abstract: An apparatus for roll forming thermoplastic composites comprises a plurality of thermoplastic composite material spools, a plurality of thermoplastic composite material rollers, a plurality of sheet metal spools, a plurality of welding rollers, an oven, a forming roller, a pair of pinch rollers. The thermoplastic composite material spools retain plies of thermoplastic composite material. The plies flow through the thermoplastic composite material rollers to form a layup. The sheet metal spools retain metal sheets. The metal sheets and the layup flow through the welding rollers to form a metal composite material laminate. The oven heats the metal composite material laminate. The forming roller imparts a curvature to the metal composite material laminate. The pinch rollers receive the metal composite material laminate from the forming roller, pull the metal composite material laminate, and output the metal composite material laminate in a heated and compressed state.

Abstract: A system for separating a prepreg composite material ply from a backing includes a first support configured to contact a first surface of the backing apart from a corner defined by the ply and the backing. A second support is configured to contact a second surface of the ply apart from the corner. A corner displacer is coupled to at least one of the first support and the second support. The corner displacer is configured to displace the corner in a first direction and an opposite second direction to thereby bend portions of the ply and the backing between the corner and the first support and the second support, and the portions of the ply and the backing thereby separate from each other.

Abstract: Delamination of a solar module (for, e.g., purposes of recycling) may be achieved by applying a rotating member(s) against surface(s) of a used solar module. In certain embodiments, the rotating member may comprise a straight router bit, which may be applied under computer control. Successive application of rotating member(s) at different heights, may afford the collection of different materials. According to one particular embodiment, a rotating router bit may be applied first against a polymer backsheet, and then at a different height against other materials comprising metals and PV material such as crystalline silicon. Collection of resulting fractions produced by delamination at different heights, can produce material (e.g., metals, silicon) of relatively high purity and suitable for reuse.

Abstract: A preheating arrangement includes a preheating device defining a first plane by a first centerline along a first axis and a second centerline along a second axis perpendicular to the first axis. A first preheating structure is asymmetric with respect to the first and/or the second centerline. A second preheating structure is oriented like the first preheating structure such that, when viewed along a third axis perpendicular to the first plane, the preheating structures are arranged one above the other. A first actuator rotates the preheating device between first and second positions and the preheating structures in the first position have a first orientation and in the second position a second orientation rotated around the axis of asymmetry by 180° or in which they are rotated by an angle ? in the range of 0°<?<360°, or 90°???270° or ?=180° around the third axis compared to the first orientation.

Abstract: A system for forming multiple braided preform segments includes a mandrel assembly disposed along a mandrel axis, a radial braider for winding fibers onto the mandrel assembly to form a continuous braided article, an applicator for applying a polymer binder to the braided article while mounted on the mandrel assembly, and a debulking tool for debulking the braided article while mounted on the mandrel assembly. The mandrel assembly includes a lead-in extension defining a first end, an end extension defining a second end, and a plurality of mandrels removably connected to a plurality of transition pieces and disposed axially between the lead-in extension and the end extension.

Abstract: A method for bonding two fiber composite components with each other to form a fiber composite structure includes integrating conductive fibers underneath a bonding surface of at least one of the two fiber composite components, each conductive fiber comprising a carbon fiber coated with an electrically insulating coating, the conductive fibers running along the bonding surface and protruding at least at their ends from the respective fiber composite component; arranging the two fiber composite components against each other at their respective bonding surfaces; passing an electric current through the conductive fibers by electrically contacting the conductive fibers at their protruding ends so that the respective fiber composite component is heated at the bonding surface to a curing temperature; and joining the two fiber composite components with each other at their bonding surfaces via secondary bonding, co-bonding and/or co-curing at the curing temperature, thereby forming the fiber composite structure.

Abstract: A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4).

Abstract: The present disclosure relates to a method for producing a decorated wall or floor panel, comprising the method steps: a) providing a first molten polymer mass and a second molten polymer mass; b) extruding the molten polymer masses, wherein in particular each polymer mass is extruded by a separate extruder, wherein the molten polymer masses are layered on top of each other; c) expelling the layered molten polymer masses through a die; d) calibrating the layered molten polymer masses in order to form a plate-shaped carrier comprising at least one carrier layer comprising the first polymer mass and a sealable layer contacting the carrier layer and comprising the second polymer mass. Furthermore, the disclosure relates to plate-shaped carriers and decorative panels produced in this way, and to a device for carrying out the method.