Abstract: A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.

Abstract: A sheet supply device and a sheet supply method include a guide roller disposed at an opposite side of a standby side roll with respect to a tangential line to an outer peripheral surface of the standby side roll at a pressing position in a state in which a pressing roller is pressed against a pressing position, and configured to guide a sheet from the pressing roller in a direction away from the standby side roll. Furthermore, the second guide roller is fixed to a moving unit so as to be configured to approach and move away from the standby side roll together with the pressing roller.

Abstract: A tandem system of metering and donor rolls is used to apply two different adhesives to a fully adhesive backed multilayer sheet to produce variably distributed adhesives and properties. Each of the two adhesives is unique and is cured differently to create a layer of adhesive that has differing adhesive properties on the sheet. A clear adhesive is applied to a top portion of cards before they are cut from the sheet and has a higher tackiness than the adhesive applied to the rest of the cards on the sheet in order to reduce glue buildup on blades cutting the cards from the sheet.

Abstract: A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

Abstract: A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

Abstract: A method of and system for removing a portion of a thermoplastic component is provided. The component includes a thermoplastic material having a melting temperature. The method includes: a) providing a glider that includes an electrically conductive material operable to produce thermal energy resulting from electrical resistance; b) heating a portion of the glider with electrical energy to a glider operating temperature that is equal or greater than the melting temperature; and c) removing the portion by engaging the component with the glider and translating one of the glider or the component relative to the other. The engagement of the glider and the component causes an amount of the thermoplastic material to melt, and the translation of the one of the glider or the component relative to the other removes the portion from the thermoplastic component.

Abstract: Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly, the upper flange disposed in the facility plate, a lower flange coupled to the upper flange, the lower flange disposed in the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, the passage is defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.

Abstract: A duplex label. The duplex label has a first face ply having a printable upper side and a lower side, and a second face ply having an upper side and a printable lower side. A layer of patterned adhesive is situated underneath the lower side of the first face ply. A displaceable liner coating comprising an enabler, a facilitator, and a stabilizer is formulated, and the layer of patterned adhesive is covered with the displaceable liner coating. The displaceable liner coating is activated by bringing the displaceable liner coating in contact with a fluid. The second face ply is secured to the first face ply using the activated displaceable liner coating such that the printable upper side faces away from the printable lower side. The first face ply is secured to the substrate, and the second face ply is sandwiched between the first face ply and the substrate.

Abstract: A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.

Abstract: After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.

Abstract: Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to electromagnetic energy. The adhesive is disposed at least partially between a major component and a minor component of the apparel product. The adhesive includes a polymer having a cyclodextrin moiety bonded to an azobenzene moiety. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Abstract: Embodiments provide methods of disassembling apparel products. The methods include exposing an adhesive of the apparel product to a composition. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a material having an imine bond or an iminium bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component via the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Abstract: A suction holder for sucking and holding a holding target member includes a sucker, a tube bellows connected to a lower end of the sucker, and a tube arranged inside the tube bellows and having an upper end positioned lower than an upper end of the sucker. A lower opening of the tube is communicated with a suction source and the holding target member is contacted with the upper end of the sucker to form a closed room, and the inside of the closed room is placed into a negative pressure state to hold the holding target member.

Abstract: A method for recycling of packaging material is disclosed. The packaging material comprises a multilayer material (10) comprising a metal layer (30) and at least one polymer layer (20, 40). The method comprises placing the packaging material in a vat (310) comprising a separation fluid (330) to produce a mixture of metal shreds from the metal layer (30), plastic shreds from the polymer layer (20, 40) and residual components. The separation fluid comprises a mixture comprising a mixture of water, a short-chained carboxylic acid, phosphoric acid and an alkali metal hydroxide solution.

Abstract: There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

Abstract: The invention relates to a welding unit (1) for the welding of film tubes for a waterless toilet, the welding unit (1) comprising welding jaws (2, 3), the welding jaws (2, 3) comprising welding means covers (4, 5), characterized in that the welding means covers (4, 5) are detachably arranged on the welding jaws (2, 3), in particular are detachably connected to the welding jaws (2, 3).

Abstract: A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.

Abstract: An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.

Abstract: A solar panel disassembling apparatus for disassembling a solar panel including a glass plate and a stacked film, includes a supporting plate of which is in contact with the glass plate, a moving scraper module including a first body moving in parallel with the supporting plate, a first elevator moving vertically, and a blade connected to the first elevator and changing in height and scraping the stacked film using the blade, and a moving pressing module including a second body moving in parallel with the supporting plate, a second elevator vertically, and a pressing unit connected to the second elevator and changing in height. The moving pressing module is disposed forward in the forward movement direction of the moving scraper module and presses and aligns the stacked film using the pressing unit ahead of the moving scraper module.

Abstract: A solar module exterior disassembling apparatus for disassembling an exterior of a solar module including a module body, a frame and a junction box attached to the module body includes a positioning plate supporting one surface of the module body from below the solar module and being able to move up and down, a top contact plate over the positioning plate and in contact with the other surface of the module body when the positioning plate is moved up, frame separation blades around the top contact plate and moving in parallel with a surface of the module body between a first position inside the frame and a second position outside the frame, and a pressing actuator including pressing cylinders and pressing outward from the module body and disassembling the module body by moving forward the frame separation blades from the first position to the second position with the pressing cylinders.